West Lafayette, Indiana – SK hynix Inc. e phatlalalitse merero ea ho tsetela hoo e ka bang $4 bilione ho aha setsi se tsoetseng pele sa tlhahiso ea liphutheloana le sa lipatlisiso le nts'etsopele bakeng sa lihlahisoa tsa bohlale ba maiketsetso Purdue Research Park. Ho theha khokahano ea bohlokoa ketane ea phepelo ea li-semiconductor tsa US West Lafayette ke mohato o moholo bakeng sa indasteri le mmuso.
“Re thabetse ho haha setsi se tsoetseng pele sa ho paka Indiana,” ho boletse CEO oa SK hynix Nianzhong Kuo. “Re lumela hore projeke ena e tla rala motheo oa pelo e ncha ea Silicon, e leng tikoloho ea semiconductor e thehiloeng Delta Midwest. Setsi sena se tla theha mesebetsi e lefang haholo sebakeng seo le ho hlahisa li-chip tsa memori tsa AI tse nang le bokhoni bo phahameng e le hore United States e ka kenya ka hare ho ketane ea bohlokoa ea phepelo ea li-chip.”
SK hynix e ikopanya le Bayer, Imec, MediaTek, Rolls-Royce, Saab le lik'hamphani tse ling tse ngata tsa lehae le tsa machabeng ho tliseng boqapi bohareng ba Amerika. Setsi sena se secha - se nang le mohala o tsoetseng pele oa ho paka oa semiconductor o tla hlahisa li-chip tsa memori ea bandwidth e phahameng ea moloko o latelang (HBM) ka bongata, karolo ea bohlokoa ea li-unit tsa ts'ebetso ea litšoantšo tse sebelisoang ho koetlisa litsamaiso tsa AI tse kang ChatGPT - ho lebelletsoe hore se tla fana ka mesebetsi e mecha e fetang sekete sebakeng sa toropo ea Lafayette, 'me k'hamphani e rera ho qala tlhahiso e kholo karolong ea bobeli ea 2028. Morero ona o tšoaea matsete a nako e telele a SK Hynix le tšebelisano-'moho sebakeng se seholo sa Lafayette. Moralo oa ho etsa liqeto oa k'hamphani o beha phaello le boikarabello ba sechaba pele ha o ntse o khothaletsa ts'ebetso ea boitšoaro le boikarabello. Ho tloha nts'etsopele ea meralo ea motheo e etsang hore phihlello ea lits'ebeletso e be bonolo haholoanyane ho ea mananeong a matlafatso ea sechaba joalo ka nts'etsopele ea tsebo le boeletsi, SK Advanced Packaging Manufacturing ho hynix e tšoaea Nako e Ncha ea Kholo ea Tšebelisano-'moho. “Indiana ke moetapele wa lefatshe ka bophara wa boqapi le tlhahiso ho kganna moruo wa bokamoso, mme ditaba tsa kajeno ke bopaki ba nnete eo,” ho boletse Mmusisi wa Indiana Eric Holcomb. “Ke motlotlo haholo ho amohela SK Hynix Indiana semmuso, mme re dumela hore tshebedisano ena e ntjha e tla ntlafatsa sebaka sa Lafayette-West Lafayette, Yunivesithi ya Purdue, le mmuso wa Indiana nakong e telele. Setsi sena se setjha sa boqapi le dipakete tsa semiconductor ha se tiise feela boemo ba mmuso lefapheng la theknoloji e thata, empa ke kgato e nngwe ya bohlokwa ho ntshetseng pele boqapi ba Amerika le tshireletso ya naha, ho beha Indiana pele ntshetsopeleng ya lehae le ya lefatshe.” Matsete Midwest le Indiana a susumetswa ke bokhabane ba Purdue ba ho sibolla le ho hlahisa boqapi, hammoho le R&D e ikgethang le ntshetsopele ya talenta e kgonehang ka tshebedisano mmoho. Dikamano pakeng tsa Yunivesithi ya Purdue, lekala la dikhamphani, le mebuso ya mmuso le ya federal di bohlokwa ho ntshetseng pele indasteri ya semiconductor ya US le ho theha sebaka seo e le pelo ya silicon. “SK hynix ke pula-maliboho wa lefatshe ka bophara le moetapele wa mmaraka wa di-chip tsa memori bakeng sa bohlale ba maiketsetso,” ho boletse Mopresidente wa Yunivesithi ya Purdue Myung-Kyun Kang. Letsete lena la phetoho le bonts'a matla a maholo a mmuso le yunivesithi ea rona ho li-semiconductors, AI ea hardware, le nts'etsopele ea likhoerekhoere tsa theknoloji e thata. Hape ke motsotso oa bohlokoa oa ho phethela ketane ea phepelo ea naha ea rona bakeng sa moruo oa dijithale ka ho paka li-chips tse tsoetseng pele. E fumaneha Purdue Research Park, setsi sena se seholo ka ho fetisisa univesithing ea US se tla nolofalletsa kholo ka boqapi. "Ka 1990, United States e hlahisitse hoo e ka bang 40% ea li-semiconductors tsa lefats'e. Leha ho le joalo, ha tlhahiso e se e fetohetse Asia Boroa-bochabela le Chaena, karolo ea US ea bokhoni ba tlhahiso ea li-semiconductor lefatšeng ka bophara e theohile ho fihla ho hoo e ka bang 12%. "SK Hynix e tla ba lebitso la lehae Indiana haufinyane," ho boletse Senator oa US Todd Young. "Letsete lena le makatsang le bontša tšepo ea bona ho basebetsi ba Indiana, 'me ke thabetse ho ba amohela naheng ea rona. Molao oa CHIPS le SCIENCE o butse monyako oa hore Indiana e kene kapele, 'me lik'hamphani tse kang SK Hynix li re thusa ho haha bokamoso ba rona ba theknoloji e phahameng." “Ho tlisa tlhahiso ea li-semiconductor haufi le hae le ho tsitsisa ketane ea phepelo ea lefats'e, Lekhotla la Kopano la Amerika le hlahisitse “Molao oa ho Fana ka Likhothaletso tse Molemo bakeng sa Tlhahiso ea Amerika ea Li-semiconductor” (Molao oa CHIPS le Saense) ka la 11 Phuptjane 2020. Bili e saennoe ke Mopresidente Joe Biden ka la 9 Phato 2022, e tšehetsang nts'etsopele e akaretsang ea indasteri ea li-semiconductor ka lichelete tsa $280 bilione. E tšehetsa R&D ea semiconductor ea naha, tlhahiso, le ts'ireletso ea ketane ea phepelo. “Ha Mopresidente Biden a saena Molao oa CHIPS le Saense, o ile a kenya letsoho lefatšeng mme a romela lets'oao lefats'eng la hore Amerika e tsotella tlhahiso ea li-semiconductor,” ho boletse Arati Prabhakar, Moeletsi e Moholo oa Saense le Theknoloji ho Mopresidente oa US Joe Biden le Motsamaisi oa Leano la Saense le Theknoloji la White House. Tsebiso ea kajeno e tla matlafatsa ts'ireletso ea moruo le ea naha le ho theha mesebetsi e metle e tšehetsang mosebetsi oa lelapa. Ena ke tsela eo re etsang lintho tse kholo ka eona Amerika. "Purdue Research Park ke e 'ngoe ea litsi tse kholo ka ho fetisisa tsa ho ikatisa tse amanang le univesithi naheng, tse kopanyang ho sibolla le ho fana ka thepa le phihlello e bonolo ho litsebi tsa masimo a semiconductor tsa Purdue, baithuti ba fumaneng mangolo ba batloang haholo le mehloli e mengata ea lipatlisiso tsa Purdue. Phaka ena e boetse e fana ka phihlello e bonolo ho basebetsi le lipalangoang tsa semi-truck, metsotso e seng mekae ho tloha I-65.
Tsebiso ena ea nalane ke mohato o latelang ho tsweleng pele ha Purdue ho phehella bokhabane ba semiconductor e le karolo ea Morero oa Purdue Compute. Litsebiso tsa morao tjena li kenyelletsa tšebelisano-'moho ea maano ea Lenaneo la Purdue la Semiconductor le Microelectronics le Dassault Systèmes ho ntlafatsa, ho potlakisa le ho fetola basebetsi ba semiconductor Moetapele oa theknoloji ea Europe imec e bula setsi sa boqapi Univesithing ea Purdue Lenaneo la pele la degree ea semiconductor le kopaneng la naha Purdue e ntse e tsoela pele ho theha tikoloho e ikhethang ea laboratori ho ea ho e 'ngoe bakeng sa naha le naha Green2Gold, tšebelisano-'moho pakeng tsa Ivy Tech Community College le Purdue University ho holisa basebetsi ba boenjiniere Indiana.
SK hynix, e nang le ntlo-kholo Korea Boroa, ke mofani oa lihlahisoa tsa semiconductor tsa maemo a lefats'e, e fanang ka li-chip tsa memori tse sa reroang tsa dynamic access random (DRAM), li-chip tsa memori tse nang le flash (NAND flash) le li-sensor tsa setšoantšo sa CMOS (CIS) ho bareki ba tummeng lefatšeng ka bophara.
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Nako ea poso: Phupu-09-2024