West Lafayette, Indiana - SK hynix Inc. e phatlalalitse merero ea ho tsetela hoo e ka bang $4 limilione tse likete ho aha tlhahiso ea liphutheloana e tsoetseng pele le setsi sa R&D bakeng sa lihlahisoa tsa mahlale a maiketsetso Purdue Research Park. Ho theha sehokelo sa mantlha khoebong ea phepelo ea li-semiconductor ea Amerika West Lafayette ke sehokelo se seholo indastering le mmusong.
"Re thabetse ho aha setsi se tsoetseng pele sa ho paka Indiana," ho boletse CEO oa SK hynix Nianzhong Kuo. "Re lumela hore morero ona o tla rala motheo oa pelo e ncha ea Silicon, e leng semiconductor ecosystem e bohareng ba Delta Midwest. Setsi sena se tla theha mesebetsi e lefang haholo ea lehae le ho hlahisa li-memory chips tse nang le bokhoni bo phahameng e le hore United States e ka kenya letsoho ho feta ketane ea bohlokoa ea phepelo ea li-chip."
SK hynix e ikopanya le Bayer, Imec, MediaTek, Rolls-Royce, Saab le lik'hamphani tse ling tse ngata tsa malapeng le tsa machaba ho tliseng boqapi ho pelo ea Amerika. Setsi sena se secha - se nang le mohala o tsoetseng pele oa semiconductor o tla hlahisa li-chips tsa moloko o latelang oa "high-bandwidth memory" (HBM), karolo ea bohlokoa ea likarolo tsa ts'ebetso ea litšoantšo tse sebelisetsoang ho koetlisa litsamaiso tsa AI joalo ka ChatGPT - ho lebelletsoe ho fana ka mesebetsi e mecha e fetang sekete sebakeng sa toropo ea Lafayette, 'me k'hamphani e rera ho qala tlhahiso ea boima ba SKni halofo ea bobeli ea SKni. matsete a nako e telele le tšebelisano 'moho sebakeng se seholo sa Lafayette. Moralo oa ho etsa liqeto oa k'hamphani o etelletsa pele phaello le boikarabello sechabeng ha o ntse o khothaletsa ts'ebetso ea boitšoaro le boikarabello. Ho tsoa ho nts'etsopele ea meaho e etsang hore phihlello ea lits'ebeletso e be bonolo haholoanyane bakeng sa mananeo a matlafatso ea sechaba joalo ka nts'etsopele ea litsebo le boeletsi, SK Advanced Packaging Manufacturing at hynix Marks A New Era of Collaborative Growth. "Indiana ke moetapele oa lefats'e oa boqapi le tlhahiso ho tsamaisa moruo oa bokamoso, 'me litaba tsa kajeno ke bopaki ba taba eo," ho boletse 'Musisi oa Indiana Eric Holcomb. "Ke motlotlo haholo ho amohela SK Hynix ka molao Indiana, 'me re lumela hore ts'ebelisano ena e ncha e tla ntlafatsa sebaka sa Lafayette-West Lafayette, Univesithi ea Purdue le seterekeng sa Indiana ka nako e telele. ntshetsopele ya lefatshe.” Ho tsetela ho Midwest le Indiana ho susumetsoa ke bokhabane ba Purdue ho sibolloeng le boqaping, hammoho le R&D e ikhethang le nts'etsopele ea litalenta e bileng teng ka tšebelisano. Likamano lipakeng tsa Univesithi ea Purdue, lekala la likhoebo, le mmuso le mebuso ea mmuso li bohlokoa ho nts'etsopele indasteri ea semiconductor ea US le ho theha sebaka seo joalo ka pelo ea silicon. "SK hynix ke pula-maliboho oa lefats'e le moetapele oa 'maraka oa li-memory chips bakeng sa bohlale ba maiketsetso," ho boletse Mopresidente oa Univesithi ea Purdue Myung-Kyun Kang. Letsete lena la phetoho le bonts'a matla a maholo a mmuso le yunivesithi ea rona ho li-semiconductors, hardware AI, le nts'etsopele ea liphaseje tse thata tsa theknoloji. Hape ke nako ea bohlokoa ea ho phethela phepelo ea naha ea rona bakeng sa moruo oa dijithale ka ho paka li-chips tse tsoetseng pele. E fumaneha Purdue Research Park, setsi sena se seholo ka ho fetisisa univesithing ea Amerika se tla thusa kholo ka boqapi. "Ka 1990, United States e ile ea hlahisa hoo e ka bang 40% ea li-semiconductors tsa lefats'e." Leha ho le joalo, ha tlhahiso e fetohetse ho Asia Boroa-bochabela le Chaena, karolo ea US ea lefats'e ea tlhahiso ea semiconductor e theohile hoo e ka bang 12%. "SK Hynix e tla tloha e le lebitso la lelapa Indiana," ho boletse Senator Todd Young oa United States. "Senator ea United States Todd Young Molao oa CHIPS le SCIENCE o butse monyetla oa hore Indiana e kene kapele, 'me lik'hamphani tse kang SK Hynix li re thusa ho aha bokamoso ba rona ba theknoloji e phahameng. "Ho tlisa tlhahiso ea semiconductor haufi le hae le ho tsitsisa ketane ea phepelo ea lefats'e, US Congress e ile ea hlahisa "Ho fana ka Litšusumetso tse Molemo bakeng sa Molao oa Tlhahiso ea Amerika ea Semiconductors Act" (CHIPS and Science Act) ka June 11, 2020. Bili e ne e saennoe ke Mopresidente Joe Biden ka August 9, 2022, e tšehetsang tsoelo-pele ea kakaretso ea lichelete tsa $ 2.2 limilione tse likete. E ts'ehetsa R&D ea semiconductor ea naha, tlhahiso, le ts'ireletso ea ketane ea phepelo. "Ha Mopresidente Biden a saena Molao oa CHIPS le Saense, o ile a kenya letsoho lefats'eng mme a romela letšoao ho lefats'e hore Amerika e tsotella tlhahiso ea semiconductor," ho boletse Arati Prabhakar, Moeletsi ea ka Sehloohong oa Saense le Theknoloji ho Mopresidente oa United States Joe Biden le Motsamaisi oa Ofisi ea White House ea Saense le Leano la Theknoloji. Phatlalatso ea kajeno e tla matlafatsa tšireletso ea moruo le ea naha le ho theha mesebetsi e metle e tšehetsang mosebetsi oa lelapa. Ke kamoo re etsang lintho tse kholo Amerika. "Purdue Research Park ke e 'ngoe ea litsi tse kholo ka ho fetisisa tse amanang le univesithi naheng, tse kopanyang ho sibolloa le ho fana ka phihlello e bonolo ho litsebi tsa lefapha la semiconductor tsa Purdue, baithuti ba batloang haholo le lisebelisoa tse pharalletseng tsa lipatlisiso tsa Purdue.
Phatlalatso ena ea nalane ke mohato o latelang morerong o tsoelang pele oa Purdue oa bokhabane ba semiconductor e le karolo ea Morero oa Compute oa Purdue. Liphatlalatso tsa morao-rao li kenyelletsa tšebelisano ea maano ea Purdue's Integrated Semiconductor le Microelectronics Program le Dassault Systèmes ho ntlafatsa, ho potlakisa le ho fetola basebetsi ba semiconductor moetapele oa theknoloji ea Europe imec e bula setsi sa boqapi Univesithing ea Purdue tšebelisano lipakeng tsa Ivy Tech Community College le Univesithi ea Purdue ho holisa basebetsi ba boenjiniere Indiana.
SK hynix, ntlo-kholo ea hae Korea Boroa, ke mofani oa thepa ea semiconductor ea maemo a holimo lefatšeng, e fanang ka li-memory memory chips (DRAM), flash memory chips (NAND flash) le CMOS image sensors (CIS) ho bareki ba tummeng lefatšeng ka bophara.
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Nako ea poso: Jul-09-2024