ʻŌpala/Jigs/mea paʻa no ka hoʻopili ʻana o Semiconductor e Glass-to-Metal Sealing

Wehewehe Pōkole:


Nā kikoʻī huahana

Nā Lepili Huahana

Wehewehe Huahana

ʻŌpala/Jigs/mea paʻa no ka hoʻopili ʻana o Semiconductor e Glass-to-Metal Sealing

 

Nā ʻano o kā mākou ʻōmole graphite:

1. ʻO nā ʻōmole graphite kekahi o nā mea kūpaʻa loa i ka wela i kēia manawa.

2. Me ke kūpaʻa haʻalulu wela maikaʻi, ʻaʻohe māwae e hana ʻia ke wela a anu ka mahana

3. ʻO ka conductivity thermal maikaʻi loa a me nā waiwai conductive

4. Maikaʻi ka lubrication a me ke kūpaʻa abrasion

5. Paʻa kemika, kūpaʻa waikawa a me ka alkali a me ke kūpaʻa i ka pala, ʻaʻole maʻalahi ke pane me ka hapa nui o nā metala

6. Hoʻolako ka hale hana i ka ʻōmole sintering graphite i hana maʻalahi ʻia e hana maʻalahi, hana hana mīkini maikaʻi, hiki ke hana i ke ʻano paʻakikī a me ka ʻōmole kikoʻī kiʻekiʻe
Noi

Ua hoʻohana nui ʻia ka ʻōpala graphite ma nā ʻano like ʻole:

1. Hoʻoheheʻe hoʻoheheʻe mau

2.Pressure foundry mold

3. Hoʻoheheʻe aniani me ka make

4. Hoʻoheheʻe ʻia ka ʻōmole

5.Centrifugal hoʻoheheʻe ʻana i ka ʻōmole

6. Hoʻoheheʻe i ke gula, ke kālā, nā mea hoʻonani……

 

Ka nui o ka palaoa
(μm)
25 25 25 25
Ka nui o ka nui
(≥g/cm3)
1.8 1.8 1.85 1.85
Ikaika Hoʻopaʻa
(≥MPa)
60 60 70 70
Ikaika Flexural
(≥MPa)
30 30 35 35
Ka porosity
(≤%)
21 21 18 18
Ke kū'ē kiko'ī
(≤μΩm)
12 12 12 12
Ka nui o ka lehu
(≤%)
0.08 0.08 0.08 0.08
Paʻakikī Kahakai 48 48 50 50

 ʻŌpala/Jigs/mea paʻa no ka hoʻopili ʻana o Semiconductor e Glass-to-Metal SealingʻŌpala/Jigs/mea paʻa no ka hoʻopili ʻana o Semiconductor e Glass-to-Metal SealingʻŌpala/Jigs/mea paʻa no ka hoʻopili ʻana o Semiconductor e Glass-to-Metal SealingʻŌpala/Jigs/mea paʻa no ka hoʻopili ʻana o Semiconductor e Glass-to-Metal SealingʻŌpala/Jigs/mea paʻa no ka hoʻopili ʻana o Semiconductor e Glass-to-Metal Sealing

Nā Huahana Hou Aʻe

ʻŌpala/Jigs/mea paʻa no ka hoʻopili ʻana o Semiconductor e Glass-to-Metal Sealing


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