1. Main processes of plasma enhanced chemical vapor deposition
Plasma enhanced chemical vapor deposition (PECVD) is a new technology for the growth of thin films by chemical reaction of gase...
The first generation of semiconductor materials is represented by traditional silicon (Si) and germanium (Ge), which are the basis for integrated circuit manufacturing. They are widely used in low-...
SiC coated graphite bases are commonly used to support and heat single crystal substrates in metal-organic chemical vapor deposition (MOCVD) equipment. The thermal stability, thermal uniformity and...
Sputtering targets are mainly used in the electronics and information industries, such as integrated circuits, information storage, liquid crystal displays, laser memories, electronic control devic...
Tantalum carbide hardness, high melting point, high temperature performance, mainly used as a hard alloy additive. The thermal hardness, thermal shock resistance and thermal oxidation resistance of...