As semiconductor manufacturing continues to push toward higher temperatures, larger crystal sizes, and stricter process stability, the performance of structural materials inside thermal processing ...
In the back-end process stage, the wafer (silicon wafer with circuits on the front) needs to be thinned on the back before subsequent dicing, welding and packaging to reduce the package mounting he...
Destinus, a Swiss startup, announced that it will participate in an initiative by the Spanish Ministry of Science to help the Spanish government develop a hydrogen-powered supersonic aircraft.
Spa...
At the Fraunhofer Institute for Machine Tools and Forming Technology IWU, researchers are developing advanced technology for manufacturing fuel cell engines with the aim of facilitating their fast ...