Equipment for LMJ microjet laser technology

Short Description:

The focused laser beam is coupled into the high-speed water jet, and the energy beam with uniform distribution of cross section energy is formed after full reflection on the inner wall of the water column. It has the characteristics of low line width, high energy density, controllable direction and real-time reduction of surface temperature of processed materials, providing excellent conditions for integrated and efficient finishing of hard and brittle materials.


Product Detail

Product Tags

Advantages of LMJ processing

The inherent defects of regular laser processing can be overcome by the smart use of laser Laser micro jet (LMJ) technology to propagate the optical characteristics of water and air. This technology allows the laser pulses fully reflected in the processed high purity water jet in an undisturbed manner to reach the machining surface as in optical fiber. From the perspective of use, the main characteristics of LMJ technology are as follows:

1.The laser beam is a columnar (parallel) structure.

2.The laser pulse is transmitted in the waterjet like optical fiber, which is protected from any environmental interference.

3.The laser beam is focused in the LMJ equipment, and there is no change in the height of the machined surface during the whole machining process, so that there is no need to continuously focus with the change of processing depth during the machining process.

4.In addition to the ablation of the work piece material happened during each laser pulses, about 99% of the time in each single unit time from the beginning of each pulse to the next pulse, the processed material is in real-time cooling of water, thus almost erasing the heat-affected zone and remelting layer, but maintaining the high efficiency of processing.

5.Keep cleaning the processed surface.

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micro-jet laser cutting technolgoy (1)
micro-jet laser cutting technolgoy (1)

General specification

LCSA-100

LCSA-200

Countertop volume

125 x 200 x 100

460×460×300

Linear axis XY

Linear motor. Linear motor

Linear motor. Linear motor

Linear axis Z

100

300

Positioning accuracy μm

+ / - 5

+ / - 3

Repeated positioning accuracy μm

+ / - 2

+ / - 1

Acceleration G

0.5

1

Numerical control

3-axis

3-axis

Laser

Laser type

DPSS Nd: YAG

DPSS Nd: YAG, pulse

Wavelength nm

532/1064

532/1064

Rated power W

50/100/200

200/400

Water jet

Nozzle diameter μm

25-80

25-80

Nozzle pressure bar

100-600

0-600

Size/Weight

Dimensions (Machine) (W x L x H)

1050 x 800 x 1870

1200 x 1200 x 2000

Dimensions (control cabinet) (W x L x H)

700 x 2300 x 1600

700 x 2300 x 1600

Weight (equipment) kg

1170

2500-3000

Weight (control cabinet) kg

700-750

700-750

Comprehensive energy consumption

Input

AC 230 V +6%/ -10%, unidirectional 50/60 Hz ±1%

AC 400 V +6%/-10%, 3-phase50/60 Hz ±1%

Peak value

2.5kVA

2.5kVA

Join

10 m power cable: P+N+E, 1.5 mm2

10 m power cable: P+N+E, 1.5 mm2

Semiconductor industry user application range

≤4 inches round ingot

≤4 inches ingot slices

≤4 inches ingot scribing

≤6 inches round ingot

≤6 inch ingot slices

≤6 inches ingot scribing

The machine meets the 8-inch circular/slicing/slicing theoretical value, and the specific practical results need to be optimized cutting strategy

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