After the wafer has gone through the previous process, the chip preparation is completed, and it needs to be cut to separate the chips on the wafer, and finally packaged. The wafer cutting process ...
Dozens of countries have committed to net-zero emissions goals in the coming decades. Hydrogen is required to reach these deep decarbonization goals. It is estimated that 30% of energy-related CO2 ...
Why do graphite crucibles crack? How to solve it?
The following is a detailed analysis of the causes of cracks:
1. After the crucible is used for a long time, the crucible wall presents longitudin...
In the back-end process stage, the wafer (silicon wafer with circuits on the front) needs to be thinned on the back before subsequent dicing, welding and packaging to reduce the package mounting he...
Selecting the optimal CVD coating material is crucial for enhancing component performance and longevity. This post directly compares Titanium Nitride (TiN), Aluminum Oxide (Al2O3), and Silicon Car...
What is CVD SiC Coating?
Chemical vapor deposition (CVD) is a vacuum deposition process used to produce high-purity solid materials. This process is often used in the semiconductor manufacturing ...