Wafer cutting is one of the important links in power semiconductor production. This step is designed to accurately separate individual integrated circuits or chips from semiconductor wafers.
The ke...
High-quality SiC graphite epitaxial susceptors in 2026 possess superior material purity, precise dimensional stability, advanced coating integrity, and optimized thermal performance. These c...
1. SiC crystal growth technology route
PVT (sublimation method),
HTCVD (high temperature CVD),
LPE (liquid phase method)
are three common SiC crystal growth methods;
The most recognized meth...
Atmospheric pressure sintered silicon carbide is no longer just used as an abrasive, but more as a new material, and is widely used in high-tech products, such as ceramics made of silicon carbide m...
The origin of the name epitaxial wafer
First, let’s popularize a small concept: wafer preparation includes two major links: substrate preparation and epitaxial process. The substrate is a wafer m...
After the ceramic substrate is sintered and formed, its surface needs to be metallized, and then the surface pattern is made through image transfer to achieve the electrical connection performance ...