In the back-end process stage, the wafer (silicon wafer with circuits on the front) needs to be thinned on the back before subsequent dicing, welding and packaging to reduce the package mounting he...
The carbon content of each sintered specimen fracture is different, with a carbon content of A-2.5 awt.% in this range, forming a dense material with almost no pores, which is composed of uniformly...
Introduction of Silicon Carbide
Silicon carbide (SIC) has a density of 3.2g/cm3. Natural silicon carbide is very rare and is mainly synthesized by artificial method. According to the different clas...
The first generation of semiconductor materials is represented by traditional silicon (Si) and germanium (Ge), which are the basis for integrated circuit manufacturing. They are widely used in low-...
“Where is the fuel car bad, why should we develop new energy vehicles?” This should be the primary question most people think about the current “wind direction” of the automobile industry. Under th...