Fan out wafer level packaging (FOWLP) is a cost-effective method in the semiconductor industry. But the typical side effects of this process are warping and chip offset. Despite the continuous impr...
Graphite electrode is mainly used in EAF steelmaking. Electric furnace steelmaking is to use graphite electrode to introduce current into the furnace. The strong current generates arc discharge thr...
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Physical and chemical activation method
Physical and chemical activation method refers t...
Wide bandgap (WBG) semiconductors represented by silicon carbide (SiC) and gallium nitride (GaN) have received widespread attention. People have high expectations for the application prospects of s...
Since the Industrial Revolution, global warming caused by the extensive use of fossil fuels has caused sea levels to rise and numerous animals and plants to become extinct. Environmentally friendly...
Graphite wafer boat is a key component with excellent performance in the photovoltaic field. As a semiconductor material, graphite wafer boats not only have corrosion resistance and high temperatur...