The rising price of raw materials is the main driver of the recent price rise of graphite electrode products. the background of the national “carbon neutralization” target and the stric...
Fan out wafer level packaging (FOWLP) is a cost-effective method in the semiconductor industry. But the typical side effects of this process are warping and chip offset. Despite the continuous impr...
The report on the high Grade Isostatic Graphite market provides a bird’s eye view of the current proceeding within the high Grade Isostatic Graphite market. Further, the report also takes into acco...
On April 10, the Yonhap News Agency learned that Lee Changyang, Minister of Trade, Industry and Resources of the Republic of Korea, met with Grant Shapps, Minister of Energy Security of the United ...
Modern C, N, B and other non-oxide high-tech refractory raw materials, atmospheric pressure sintered silicon carbide is extensive, economic, can be said to be emery or refractory sand. Pure silicon...
Tantalum carbide hardness, high melting point, high temperature performance, mainly used as a cemented carbide additive. The thermal hardness, thermal shock resistance and thermal oxidation resista...