Iphepha lokulwa le-wafer, yintoni omawuyenze?

Kwinkqubo ethile yokupakisha, kusetyenziswa izixhobo zokupakisha ezinee-coefficients ezahlukeneyo zokwandisa ubushushu. Ngexesha lenkqubo yokupakisha, i-wafer ibekwa kwi-substrate yokupakisha, emva koko kwenziwa amanyathelo okufudumeza nokupholisa ukuze kugqitywe ukupakisha. Nangona kunjalo, ngenxa yokungafani phakathi kwe-coefficient yokwandisa ubushushu bezinto zokupakisha kunye ne-wafer, uxinzelelo lobushushu lubangela ukuba i-wafer igobe. Yiza uze ujonge nomhleli ~

Yintoni i-wafer warpage?

Isonka esisicabaI-warppage ibhekisa ekugobeni okanye ekujijekeni kwe-wafer ngexesha lenkqubo yokupakisha.Isonka esisicabaI-warpage inokubangela ukuphambuka kokulungelelaniswa, iingxaki zokuwelda kunye nokonakala kokusebenza kwesixhobo ngexesha lenkqubo yokupakisha.

Ukuchaneka okuncitshisiweyo kokupakishwa:Isonka esisicabaI-warpage inokubangela ukuphambuka kokulungelelaniswa ngexesha lenkqubo yokupakisha. Xa i-wafer iguquka ngexesha lenkqubo yokupakisha, ukulungelelaniswa phakathi kwe-chip kunye nesixhobo esipakishiweyo kunokuchaphazeleka, okubangela ukungakwazi ukulungelelanisa ngokuchanekileyo iiphini zokudibanisa okanye amajoyinti e-solder. Oku kunciphisa ukuchaneka kokupakisha kwaye kunokubangela ukusebenza kwesixhobo okungazinzanga okanye okungathembekanga.

Uxinzelelo oluphezulu loomatshini:Isonka esisicabaI-warpage ingenisa uxinzelelo olongezelelweyo loomatshini. Ngenxa yokuguquka kwe-wafer ngokwayo, uxinzelelo loomatshini olusetyenziswa ngexesha lenkqubo yokupakisha lunokwanda. Oku kunokubangela uxinzelelo ngaphakathi kwe-wafer, kuchaphazele kakubi izinto kunye nolwakhiwo lwesixhobo, kwaye kubangele nomonakalo wangaphakathi we-wafer okanye ukungaphumeleli kwesixhobo. 

Ukwehla kokusebenza:I-wafer warpage inokubangela ukwehla kokusebenza kwesixhobo. Izinto kunye nolwakhiwo lwesekethe kwi-wafer zenzelwe ngokusekelwe kumphezulu othe tyaba. Ukuba i-wafer iyagoba, inokuchaphazela uqhagamshelo lombane, ukuhanjiswa kwesignali kunye nolawulo lobushushu phakathi kwezixhobo. Oku kunokubangela iingxaki ekusebenzeni kombane, isantya, ukusetyenziswa kwamandla okanye ukuthembeka kwesixhobo.

Iingxaki zokuwelda:I-wafer warpage inokubangela iingxaki zokuwelda. Ngexesha lenkqubo yokuwelda, ukuba i-wafer igobile okanye ijijekile, ukusasazwa kwamandla ngexesha lenkqubo yokuwelda kusenokungalingani, nto leyo ebangela umgangatho ophantsi we-solder joints okanye ukwaphuka kwe-solder joint. Oku kuya kuba nefuthe elibi ekuthembekeni kwephakheji.

Izizathu ze-wafer warpage

Nazi ezinye zezinto ezinokubangelai-waferiphepha lokulwa:

1.Uxinzelelo lobushushu:Ngexesha lenkqubo yokupakisha, ngenxa yotshintsho lobushushu, izinto ezahlukeneyo kwi-wafer ziya kuba nee-coefficients zokwandiswa kobushushu ezingaguqukiyo, nto leyo ekhokelela ekuqhekekeni kwe-wafer.

2.Ukungafani kwezinto:Ngexesha lenkqubo yokwenziwa kwe-wafer, ukusasazwa okungalinganiyo kwezinto kunokubangela ukugoba kwe-wafer. Umzekelo, ubuninzi bezinto ezahlukeneyo okanye ubukhulu kwiindawo ezahlukeneyo ze-wafer kuya kubangela ukuba i-wafer iguge.

3.Iiparamitha zenkqubo:Ulawulo olungalunganga lwezinye iiparameter zenkqubo kwinkqubo yokupakisha, ezinje ngobushushu, ukufuma, uxinzelelo lomoya, njl.njl., zinokubangela ukuqhekeka kwe-wafer.

Isisombululo

Amanye amanyathelo okulawula i-wafer warpage:

Ukulungiswa kwenkqubo:Nciphisa umngcipheko we-wafer warpage ngokuphucula iiparameter zenkqubo yokupakisha. Oku kuquka ukulawula iiparameter ezifana nobushushu kunye nokufuma, amazinga okufudumeza kunye nokupholisa, kunye noxinzelelo lomoya ngexesha lenkqubo yokupakisha. Ukukhetha ngokufanelekileyo iiparameter zenkqubo kunokunciphisa impembelelo yoxinzelelo lobushushu kwaye kunciphise amathuba e-wafer warpage.

Ukukhetha izinto zokupakisha:Khetha izixhobo zokupakisha ezifanelekileyo ukunciphisa umngcipheko we-wafer warpage. I-coefficient yokwandiswa kobushushu bezinto zokupakisha kufuneka ifane neye-wafer ukunciphisa ukuguquguquka kwe-wafer okubangelwa kuxinzelelo lobushushu. Kwangaxeshanye, iimpawu zoomatshini kunye nokuzinza kwezinto zokupakisha nazo kufuneka ziqwalaselwe ukuqinisekisa ukuba ingxaki ye-wafer warpage inokupheliswa ngempumelelo.

Uyilo lwe-wafer kunye nokwenza ngcono imveliso:Ngexesha lenkqubo yoyilo kunye neyokwenziwa kwe-wafer, amanyathelo athile anokuthathwa ukunciphisa umngcipheko we-wafer warpage. Oku kuquka ukuphucula ukusasazwa okufanayo kwezinto, ukulawula ubukhulu kunye nokuthamba komphezulu we-wafer, njl. Ngokulawula ngokuchanekileyo inkqubo yokwenziwa kwe-wafer, umngcipheko wokuguquka kwe-wafer ngokwayo ungancitshiswa.

Iindlela zokulawula ubushushu:Ngexesha lenkqubo yokupakisha, kuthathwa amanyathelo olawulo lobushushu ukunciphisa umngcipheko we-wafer warpage. Oku kuquka ukusebenzisa izixhobo zokufudumeza nezokupholisa ezinobunye obufanelekileyo bobushushu, ukulawula i-gradients yobushushu kunye namazinga okutshintsha kobushushu, kunye nokuthatha iindlela ezifanelekileyo zokupholisa. Ulawulo lobushushu olusebenzayo lunokunciphisa impembelelo yoxinzelelo lobushushu kwi-wafer kwaye lunciphise amathuba e-wafer warpage.

Amanyathelo okufumanisa nokulungisa:Ngexesha lenkqubo yokupakisha, kubaluleke kakhulu ukubona nokulungisa i-wafer warpage rhoqo. Ngokusebenzisa izixhobo zokufumanisa ezichanekileyo, ezifana neenkqubo zokulinganisa ezibonakalayo okanye izixhobo zokuvavanya oomatshini, iingxaki ze-wafer warpage zinokufunyanwa kwangethuba kwaye amanyathelo okulungisa afanelekileyo anokuthathwa. Oku kungabandakanya ukulungisa kwakhona iiparameter zokupakisha, ukutshintsha izinto zokupakisha, okanye ukulungisa inkqubo yokwenza i-wafer.

Kufuneka kuqatshelwe ukuba ukusombulula ingxaki ye-wafer warpage ngumsebenzi onzima kwaye kunokufuna ukuqwalaselwa ngokubanzi kwezinto ezininzi kunye nokulungiswa okuphindaphindiweyo kunye nokulungiswa. Kwizicelo zokwenyani, izisombululo ezithile zinokuhluka ngokuxhomekeke kwizinto ezifana neenkqubo zokupakisha, izixhobo ze-wafer, kunye nezixhobo. Ke ngoko, ngokuxhomekeke kwimeko ethile, amanyathelo afanelekileyo anokukhethwa kwaye athathwe ukusombulula ingxaki ye-wafer warpage.