I-wafer warpage, yini okufanele uyenze?

Enqubweni ethile yokufaka, kusetshenziswa izinto zokupakisha ezine-coefficients yokwandisa ukushisa ehlukene. Ngesikhathi senqubo yokufaka, i-wafer ibekwa endaweni yokufaka, bese kwenziwa izinyathelo zokushisa nokupholisa ukuze kuqedwe ukufakwa. Kodwa-ke, ngenxa yokungafani phakathi kwe-coefficient yokwandisa ukushisa kwezinto zokupakisha kanye ne-wafer, ukucindezeleka kokushisa kubangela ukuthi i-wafer igobe. Woza uzobona umhleli ~

Kuyini i-wafer warpage?

I-WaferI-warpage ibhekisela ekugobeni noma ekusonteni kwe-wafer ngesikhathi senqubo yokupakisha.I-WaferUkugoba kwekhasi kungabangela ukuphambuka kokuqondanisa, izinkinga zokushisela kanye nokwehla kokusebenza kwedivayisi ngesikhathi senqubo yokupakisha.

Ukunemba kokupakisha okuncishisiwe:I-WaferUkugoba kwekhasi kungabangela ukuphambuka kokuqondanisa ngesikhathi senqubo yokupakisha. Lapho i-wafer iguquguquka ngesikhathi senqubo yokupakisha, ukuhambisana phakathi kwe-chip nedivayisi epakishiwe kungathinteka, okuholela ekungakwazini ukuvumelanisa ngokunembile amaphini okuxhuma noma amajoyinti e-solder. Lokhu kunciphisa ukunemba kokupakisha futhi kungabangela ukusebenza kwedivayisi okungazinzile noma okungathembekile.

Ukucindezeleka okwenyukayo kwemishini:I-WaferI-warpage ifaka ukucindezeleka okwengeziwe komshini. Ngenxa yokuguquguquka kwe-wafer ngokwayo, ukucindezeleka komshini okusetshenziswa ngesikhathi senqubo yokupakisha kunganda. Lokhu kungabangela ukugcwala kokucindezeleka ngaphakathi kwe-wafer, kuthinte kabi izinto zokwakha kanye nesakhiwo sedivayisi, futhi kubangele ngisho nomonakalo wangaphakathi we-wafer noma ukwehluleka kwedivayisi. 

Ukwehla kokusebenza:I-wafer warpage ingabangela ukuwohloka kokusebenza kwedivayisi. Izingxenye kanye nokwakheka kwesekethe ku-wafer kuklanyelwe ngokusekelwe endaweni eyisicaba. Uma i-wafer igoba, ingathinta ukuxhumana kukagesi, ukudluliswa kwesignali kanye nokuphathwa kokushisa phakathi kwamadivayisi. Lokhu kungabangela izinkinga ekusebenzeni kukagesi, isivinini, ukusetshenziswa kwamandla noma ukuthembeka kwedivayisi.

Izinkinga zokushisela:I-wafer warpage ingabangela izinkinga zokushisela. Ngesikhathi senqubo yokushisela, uma i-wafer igobile noma isontekile, ukusatshalaliswa kwamandla ngesikhathi senqubo yokushisela kungase kungalingani, okuholela ekhwalithini engeyinhle yamajoyinti e-solder noma ngisho nokuphuka kwejoyinti le-solder. Lokhu kuzoba nomthelela omubi ekuthembekeni kwephakheji.

Izimbangela ze-wafer warpage

Okulandelayo ezinye zezinto ezingase zibangelei-waferikhasi lokulwa:

1.Ukucindezeleka kokushisa:Ngesikhathi senqubo yokupakisha, ngenxa yokushintsha kwezinga lokushisa, izinto ezahlukene ku-wafer zizoba nama-coefficients okukhulisa ukushisa angaguquki, okuholela ekuqhekekeni kwe-wafer.

2.Ukungafani kwezinto ezibonakalayo:Ngesikhathi senqubo yokukhiqiza i-wafer, ukusatshalaliswa okungalingani kwezinto kungase kubangele ukugoba kwe-wafer. Isibonelo, ubuningi noma ubukhulu bezinto ezahlukene ezindaweni ezahlukene ze-wafer buzobangela ukuthi i-wafer iguge.

3.Amapharamitha enqubo:Ukulawulwa okungalungile kweminye imingcele yenqubo enqubweni yokupakisha, njengokushisa, umswakama, umfutho womoya, njll., nakho kungabangela ukugoba kwe-wafer.

Isixazululo

Ezinye izindlela zokulawula i-wafer warpage:

Ukuthuthukisa inqubo:Nciphisa ingozi yokuqhekeka kwe-wafer ngokwenza ngcono imingcele yenqubo yokupakisha. Lokhu kuhlanganisa ukulawula imingcele efana nokushisa nomswakama, amazinga okushisa nokupholisa, kanye nomfutho womoya ngesikhathi senqubo yokupakisha. Ukukhetha okunengqondo kwemingcele yenqubo kunganciphisa umthelela wokucindezeleka kokushisa futhi kunciphise amathuba okuqhekeka kwe-wafer.

Ukukhetha izinto zokupakisha:Khetha izinto zokupakisha ezifanele ukuze unciphise ingozi yokugoba kwe-wafer. I-coefficient yokwandisa ukushisa kwezinto zokupakisha kufanele ifane neye-wafer ukuze kuncishiswe ukuguquguquka kwe-wafer okubangelwa ukucindezeleka kokushisa. Ngesikhathi esifanayo, izakhiwo zomshini kanye nokuqina kwezinto zokupakisha nakho kudingeka kucatshangelwe ukuqinisekisa ukuthi inkinga ye-wafer warpage ingancishiswa ngempumelelo.

Ukuklama nokukhiqiza i-wafer:Ngesikhathi senqubo yokuklama nokukhiqiza i-wafer, kungathathwa izinyathelo ezithile zokunciphisa ingozi yokuqhekeka kwe-wafer. Lokhu kuhlanganisa nokwenza ngcono ukusatshalaliswa okufanayo kwezinto, ukulawula ukujiya kanye nokuba yisicaba komphezulu we-wafer, njll. Ngokulawula ngokunembile inqubo yokukhiqiza i-wafer, ingozi yokuguquka kwe-wafer ngokwayo ingancishiswa.

Izindlela zokuphatha ukushisa:Ngesikhathi senqubo yokupakisha, kuthathwa izinyathelo zokuphatha ukushisa ukuze kuncishiswe ingozi yokugoba kwe-wafer. Lokhu kuhlanganisa ukusebenzisa imishini yokushisa nokupholisa enokulingana okuhle kwezinga lokushisa, ukulawula amazinga okushisa kanye namazinga okushintsha kwezinga lokushisa, kanye nokuthatha izindlela ezifanele zokupholisa. Ukuphathwa kokushisa okuphumelelayo kunganciphisa umthelela wokucindezeleka kokushisa ku-wafer futhi kunciphise amathuba okugoba kwe-wafer.

Izindlela zokuthola nokulungisa:Ngesikhathi senqubo yokupakisha, kubaluleke kakhulu ukubona nokulungisa i-wafer warpage njalo. Ngokusebenzisa imishini yokuthola enembile kakhulu, njengezinhlelo zokulinganisa ezibonakalayo noma amadivayisi okuhlola oomatshini, izinkinga ze-wafer warpage zingatholakala kusenesikhathi futhi kungathathwa izinyathelo zokulungisa ezifanayo. Lokhu kungafaka ukulungisa kabusha amapharamitha okupakisha, ukushintsha izinto zokupakisha, noma ukulungisa inqubo yokukhiqiza i-wafer.

Kufanele kuqashelwe ukuthi ukuxazulula inkinga ye-wafer warpage kuwumsebenzi oyinkimbinkimbi futhi kungadinga ukucatshangelwa okubanzi kwezinto eziningi kanye nokwenza ngcono nokulungiswa okuphindaphindiwe. Ekusetshenzisweni kwangempela, izixazululo ezithile zingahluka kuye ngezici ezifana nezinqubo zokupakisha, izinto ze-wafer, kanye nemishini. Ngakho-ke, kuye ngesimo esithile, izinyathelo ezifanele zingakhethwa futhi zithathwe ukuxazulula inkinga ye-wafer warpage.