SOI ndi chidule chaChotetezera Chosungira Zinthu cha Silicon. Kwenikweni, limatanthauza "silicon pa insulator." Mwachizolowezi, kapangidwe kake ndi kakuti pali gawo lochepetsetsa kwambiri lotetezera kutentha, monga SiO₂, pamwamba pa silicon wafer, kenako gawo lochepa la silicon limapangidwa pamwamba pa gawo lotetezera kutentha ili. Kapangidwe kameneka kamalekanitsa gawo logwira ntchito la silicon ndi gawo la silicon. Komabe, mu njira yachikhalidwe ya silicon, chip imapangidwa mwachindunji pa gawo la silicon popanda kugwiritsa ntchito gawo lotetezera kutentha.
SOI waferIli ndi zigawo zitatu zofunika kwambiri: gawo la chipangizo cha silicon cha kristalo imodzi, gawo loteteza silicon dioxide (chobisika, kapena BOX), ndi gawo la silicon. Pamodzi, zigawo zitatuzi zimapanga malo odziyimira pawokha komanso okhazikika amagetsi, ndipo gawo lililonse limagwira ntchito yakeyake pamene likugwira ntchito mogwirizana kuti liwonjezere magwiridwe antchito ndi kudalirika.
Chida chapamwamba cha silicon chokhala ndi kristalo imodzi (nthawi zambiri chimakhala chokhuthala pafupifupi 5 nm mpaka 2 μm) ndi malo oyambira kumene ma transistors ndi zida zina zogwira ntchito zimapangidwa. Kapangidwe kake kopyapyala kwambiri ndi maziko ofunikira kwambiri pakukweza magwiridwe antchito a chipangizocho ndikupangitsa kuti chikhale cholimba nthawi zonse.
Gawo lapakati la oxide (BOX) limapereka kusiyanitsa kwa magetsi. Gawo la silicon dioxide ili, lomwe nthawi zambiri limakhala ndi makulidwe a 5 nm mpaka 2 μm, limatseka bwino kulumikizana kwa magetsi pakati pa gawo la chipangizocho ndi gawo loyambira kudzera mu njira zosiyanitsa zakuthupi komanso zamankhwala.
Pansi pa silicon kwenikweni pamakhala kulimba kwa kapangidwe kake komanso kukhazikika kwa makina, kuonetsetsa kuti wafer ndi yodalirika popanga ndikugwiritsa ntchito pambuyo pake. Kukhuthala kwake nthawi zambiri kumakhala pakati pa 200 μm mpaka 700 μm, zomwe zimapereka chithandizo chokwanira cha makina poganizira momwe zinthu zingagwiritsidwire ntchito komanso zofunikira pakugwiritsa ntchito.
Ubwino Waukulu wa Ma Wafers a SOI
1. Liwiro Lapamwamba
- Ndi gawo lobisika la okosijeni pansi pa zipangizozi, ma transistors amachotsedwa ku silicon substrate. Izi zimachepetsa mphamvu ya parasitic, zimafulumizitsa kusintha, ndipo zimapangitsa SOI kukhala yoyenera kwambiri pa ma logic ndi ma RF circuits othamanga kwambiri.
2. Kugwiritsa Ntchito Mphamvu Kotsika
- Kuchepa kwa capacitance kumatanthauza kuchepa kwa kuyitanitsa ndi kutulutsa mphamvu.
- Njira zochepa zotulutsira madzi zimapangitsa kuti mphamvu yogwiritsidwa ntchito moyimirira (yosasinthasintha) ichepe, zomwe zimapangitsa kuti makinawo azigwira ntchito bwino.
3. Kudzipatula Bwino
- Chipangizo chilichonse "chimakhala" pa oxide layer, zomwe zimachepetsa kwambiri kusokoneza magetsi pakati pa zipangizo. Izi zimathandizira kukhazikika pophatikiza ma analog + digital circuits, mayunitsi oyang'anira mphamvu, ndi ma RF modules pa chip yomweyo.
4. Kuwala kwabwino komanso kupirira kutentha kwambiri
- Ma charge opangidwa ndi radiation ndi ochepa kwambiri omwe amafalikira kudzera mu substrate, zomwe zimapangitsa kuti zipangizo za SOI zikhale zotetezeka komanso zodalirika m'malo omwe ali ndi radiation yambiri monga mlengalenga.
- Kuwonjezeka kwa mphamvu yotulutsa madzi pa kutentha kwambiri sikuli koopsa kwambiri, zomwe zimathandiza pa zamagetsi zamagalimoto ndi ntchito zowongolera mafakitale.
5. Yabwino pa Kukula Kowonjezera
- Ndi silicon wosanjikiza woonda kwambiri pamwamba ndi oxide wosanjikiza pansi pake, zotsatira zazifupi zimawongoleredwa bwino, zomwe zimapangitsa kuti zikhale zosavuta kusunga machitidwe okhazikika a chipangizocho pamene ma node a processing akupitirira kuchepa.
Ukadaulo wa SOI wagwiritsidwa kale ntchito m'magawo osiyanasiyana. Mu zamagetsi zamagetsi, umagwiritsidwa ntchito mu ma module a RF front-end a mafoni a m'manja, monga zosefera za 5G. Mu zamagetsi zamagalimoto, umapereka njira yokhazikika yogwiritsira ntchito ma radar chips mkati mwa galimoto. Mu gawo la ndege, umagwiritsidwa ntchito mu zida zolumikizirana ndi satellite zodalirika kwambiri. Mu zida zamankhwala, SOI imathandizira kupanga ndi kukhazikitsa masensa azachipatala omwe amayikidwa m'thupi ndi mitundu yosiyanasiyana ya ma chips owunikira opanda mphamvu zambiri.
Kampani yathu imapereka mapulojekiti apadera a ma wafers onyamula silicon okhala ndi kristalo imodzi:
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Kukhuthala kwa silicon substrate: 100 μm / 300 μm / 400 μm / 500 μm / 625 μm ndi kupitirira apo
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Kukhuthala kwa SiO₂: kuyambira 100 nm mpaka 10 μm
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Chigawo cha silicon chogwira ntchito: ≥ 20 nm
Nthawi yotumizira: Disembala-09-2025
