Thepa ea silicon carbide le likarolo tsa eona

Sesebelisoa sa semiconductor ke motheo oa lisebelisoa tsa mechini tsa indasteri tsa sejoale-joale, tse sebelisoang haholo lik'homphieutheng, lisebelisoa tsa elektroniki tsa bareki, puisano ea marang-rang, lisebelisoa tsa elektroniki tsa likoloi le libaka tse ling tsa mantlha, indasteri ea semiconductor e entsoe haholo ka likarolo tse 'ne tsa motheo: lipotoloho tse kopaneng, lisebelisoa tsa optoelectronic, sesebelisoa se arohaneng, sensor, e ikarabellang bakeng sa lipotoloho tse fetang 80% tse kopaneng, hangata le semiconductor le potoloho e kopaneng e lekanang.

Potoloho e kopaneng, ho ya ka sehlopha sa dihlahiswa, e arotsoe haholo ka mekhahlelo e mene: microprocessor, memori, disebediswa tsa logic, dikarolo tsa simulator. Leha ho le jwalo, ka katoloso e tswelang pele ya tshimo ya tshebediso ya disebediswa tsa semiconductor, diketsahalo tse ngata tse ikgethang di hloka hore di-semiconductor di kgone ho kgomarela tshebediso ya mocheso o phahameng, mahlasedi a matla, matla a phahameng le dibaka tse ding, di se ke tsa senya, moloko wa pele le wa bobedi wa disebediswa tsa semiconductor ha di na matla, kahoo moloko wa boraro wa disebediswa tsa semiconductor o ile wa hlaha.

Hona jwale, thepa ya semiconductor ya lekhalo le leholo la sehlopha se seholo e emetsweng kekhabide ea silicon(SiC), gallium nitride (GaN), zinc oxide (ZnO), daemane, aluminium nitride (AlN) di dula mmarakeng o ka sehloohong ka melemo e meholo, e bitswang disebediswa tsa semiconductor tsa moloko wa boraro. Moloko wa boraro wa disebediswa tsa semiconductor tse nang le bophara bo boholo ba lekhalo la lebanta, ha tshimo ya motlakase e senyeha, ho tsamaisa mocheso, sekgahla se tletseng sa elektroniki le bokgoni bo phahameng ba ho hanela mahlaseli, di loketse haholo ho etsa mocheso o phahameng, maqhubu a phahameng, kganyetso mahlaseding le disebediswa tse matla a phahameng, hangata di tsejwa e le disebediswa tsa semiconductor tse pharaletseng tsa lebanta (bophara ba lebanta bo hanetsweng bo feta 2.2 eV), hape bo bitswang mocheso o phahameng disebediswa tsa semiconductor. Ho ya ka dipatlisiso tsa hajwale mabapi le disebediswa le disebediswa tsa semiconductor tsa moloko wa boraro, disebediswa tsa semiconductor tsa silicon carbide le gallium nitride di hodile haholo, mmetheknoloji ea carbide ea siliconke e hōlileng ka ho fetisisa, ha lipatlisiso tsa zinc oxide, daemane, aluminium nitride le thepa e 'ngoe li ntse li le mohatong oa pele.

Thepa le Thepa ea Bona:

Carbide ea siliconthepa e sebelisoa haholo ho li-bearing tsa bolo ea ceramic, li-valve, thepa ea semiconductor, li-gyros, lisebelisoa tsa ho lekanya, lifofane le masimo a mang, e se e le thepa e ke keng ea nkeloa sebaka masimong a mangata a indasteri.

SiC ke mofuta oa superlattice ea tlhaho le mofuta o tloaelehileng oa polytype e ts'oanang. Ho na le malapa a fetang 200 (a tsejoang hona joale) a polytypic a homotypic ka lebaka la phapang ea tatellano ea ho paka pakeng tsa mekhahlelo ea diatomic ea Si le C, e lebisang meahong e fapaneng ea kristale. Ka hona, SiC e loketse haholo moloko o mocha oa thepa ea substrate e ntšang leseli (LED), thepa ea elektroniki e matla haholo.