Ukwenziwa kwemveliso nganye ye-semiconductor kufuna amakhulu eenkqubo. Sahlula yonke inkqubo yokwenziwa ibe ngamanyathelo asibhozo:i-waferukucubungula-ukucoca-i-photolithography-ukukrola-ukuhluza ifilimu okuncinci-ukufakelwa kwe-epitaxial-ukusasazwa-kwe-ion.
Ukuze sikuncede uqonde kwaye uqaphele ii-semiconductors kunye neenkqubo ezinxulumene noko, siza kutyhala amanqaku e-WeChat kwinkupho nganye ukuba aqalise inyathelo ngalinye elingasentla ngalinye.
Kwinqaku elingaphambili, kukhankanyiwe ukuba ukuze kukhuselwei-waferukusuka kwiingcola ezahlukeneyo, kwenziwa ifilimu ye-oxide - inkqubo ye-oxidation. Namhlanje siza kuxoxa "ngenkqubo ye-photolithography" yokufota isekethe yoyilo lwe-semiconductor kwi-wafer kunye nefilimu ye-oxide eyenziweyo.
Inkqubo yefotolithography
1. Yintoni inkqubo yefotolithography
I-Photolithography kukwenza iisekethe kunye neendawo ezisebenzayo ezifunekayo kwimveliso yeetshiphusi.
Ukukhanya okukhutshwa ngumatshini we-photolithography kusetyenziselwa ukuveza ifilimu encinci egqunywe yi-photoresist ngemaski enepateni. I-photoresist iya kutshintsha iipropati zayo emva kokubona ukukhanya, ukuze ipateni ekwimaski ikotshelwe kwifilimu encinci, ukuze ifilimu encinci ibe nomsebenzi wedayagram yesekethe ye-elektroniki. Le yindima ye-photolithography, efana nokuthatha imifanekiso ngekhamera. Iifoto ezithathwe yikhamera ziprintwa kwifilimu, ngelixa i-photolithography ingakroli iifoto, kodwa i-circuit diagrams kunye nezinye izinto ze-elektroniki.
I-Photolithography yiteknoloji echanekileyo yokwenza oomatshini abancinci
I-photolithography eqhelekileyo yinkqubo esebenzisa ukukhanya kwe-ultraviolet okunobude bobude obuphakathi kwama-2000 ukuya kuma-4500 angstroms njengomthwali wolwazi lomfanekiso, kwaye isebenzisa i-photoresist njengendlela ephakathi (yokurekhoda umfanekiso) ukufezekisa utshintsho, ukudluliselwa kunye nokucubungula imizobo, kwaye ekugqibeleni idlulisele ulwazi lomfanekiso kwi-chip (ngokuyintloko i-silicon chip) okanye umaleko we-dielectric.
Kunokuthiwa i-photolithography sisiseko se-semiconductor yanamhlanje, i-microelectronics, kunye namashishini olwazi, kwaye i-photolithography imisela ngokuthe ngqo inqanaba lophuhliso lwezi teknoloji.
Kwiminyaka engaphezu kwama-60 ukususela ekuvelweni ngempumelelo kweesekethe ezidibeneyo ngo-1959, ububanzi bomgca wemizobo yayo buncitshisiwe malunga ne-odolo ezine zobukhulu, kwaye ukuhlanganiswa kweesekethe kuphuculwe nge-odolo ezingaphezu kwezintandathu zobukhulu. Inkqubela phambili ekhawulezileyo yale teknoloji ibangelwa kakhulu kuphuhliso lwe-photolithography.
(Iimfuneko zobuchwepheshe be-photolithography kwizigaba ezahlukeneyo zophuhliso lwemveliso yesekethe edibeneyo)
2. Imigaqo esisiseko ye-photolithography
Izixhobo ze-photolithography zihlala zibhekisa kwi-photoresists, ezaziwa ngokuba zii-photoresists, ezizezona zinto zibalulekileyo ezisebenzayo kwi-photolithography. Olu hlobo lwezinto luneempawu zokukhanya (kubandakanya ukukhanya okubonakalayo, ukukhanya kwe-ultraviolet, umqadi we-electron, njl.njl.). Emva kwe-photochemical reaction, ukunyibilika kwayo kutshintsha kakhulu.
Phakathi kwazo, ukunyibilika kwe-photoresist elungileyo kumphuhlisi kuyanda, kwaye ipateni efunyenweyo iyafana nemaski; i-photoresist engalunganga ichasene, oko kukuthi, ukunyibilika kuncipha okanye kunganyibiliki emva kokuba kuvezwe kumphuhlisi, kwaye ipateni efunyenweyo ichasene nemaski. Iindawo zokusetyenziswa zeentlobo ezimbini ze-photoresists zahlukile. Ii-photoresists ezilungileyo zisetyenziswa kakhulu, zingaphezulu kwe-80% yetotali iyonke.
Oku kungasentla ngumzobo wesicwangciso senkqubo ye-photolithography
(1) Ukuncamathelisa:
Oko kukuthi, ukwenza ifilimu yokumelana ne-photoresist enobukhulu obufanayo, ukunamathela okuqinileyo kunye nokungabikho ziphene kwi-silicon wafer. Ukuze kuphuculwe ukunamathelana phakathi kwefilimu yokumelana ne-photoresist kunye ne-silicon wafer, kudla ngokufuneka kuqala ulungise umphezulu we-silicon wafer ngezinto ezifana ne-hexamethyldisilazane (HMDS) kunye ne-trimethylsilyldiethylamine (TMSDEA). Emva koko, ifilimu yokumelana ne-photoresist ilungiswa nge-spin coating.
(2) Ukubhaka kwangaphambili:
Emva kokufaka i-spin coating, ifilimu ye-photoresist isenayo i-solvent ethile. Emva kokubhaka kubushushu obuphezulu, i-solvent ingasuswa kancinci kangangoko. Emva kokubhaka kwangaphambili, umxholo we-photoresist uncitshiswa uye kwi-5%.
(3) Ukuvezwa:
Oko kukuthi, i-photoresist ivezwa ekukhanyeni. Ngeli xesha, kwenzeka i-photoreaction, kwaye umahluko wokunyibilika phakathi kwenxalenye ekhanyisiweyo kunye nenxalenye engakhanyiswanga uyenzeka.
(4) Uphuhliso kunye nokuqina:
Imveliso intywiliselwa kumphuhlisi. Ngeli xesha, indawo eveziweyo ye-photoresist elungileyo kunye nendawo engaveziweyo ye-photoresist engalunganga ziya kunyibilika kuphuhliso. Oku kubonisa ipateni enamacala amathathu. Emva kophuhliso, itshiphusi ifuna inkqubo yonyango olushushu kakhulu ukuze ibe yifilimu eqinileyo, enceda kakhulu ekuphuculeni ukunamathela kwe-photoresist kwi-substrate.
(5) Ukukrola:
Izinto eziphantsi kwe-photoresist ziyakrolwa. Ziquka ukukrolwa okumanzi okumanzi kunye nokukrolwa okomileyo okuphuma kwigesi. Umzekelo, ukukrolwa okumanzi kwe-silicon, kusetyenziswa isisombululo samanzi esidikiweyo se-hydrofluoric acid; ukukrolwa okumanzi kwe-copper, kusetyenziswa isisombululo se-asidi esinamandla njenge-nitric acid kunye ne-sulfuric acid, ngelixa ukukrolwa okomileyo kusetyenziswa imisebe ye-plasma okanye ye-ion enamandla aphezulu ukonakalisa umphezulu wento kwaye uyikrolwe.
(6) Ukususa igum:
Okokugqibela, i-photoresist kufuneka isuswe kumphezulu welensi. Eli nyathelo libizwa ngokuba yi-degumming.
Ukhuseleko yeyona nto ibalulekileyo kuyo yonke imveliso ye-semiconductor. Iigesi eziphambili ze-photolithography eziyingozi neziyingozi kwinkqubo ye-chip lithography zezi zilandelayo:
1. I-hydrogen peroxide
I-hydrogen peroxide (H2O2) yi-oxidant enamandla. Ukudibana ngqo kunokubangela ukudumba kunye nokutsha kolusu namehlo.
2. I-Xylene
I-Xylene sisinyibilikisi kwaye sisetyenziswa kwi-negative lithography. Iyatsha kwaye inobushushu obuphantsi obuyi-27.3℃ kuphela (malunga nobushushu begumbi). Iyaqhuma xa uxinzelelo emoyeni luyi-1%-7%. Ukudibana rhoqo ne-xylene kunokubangela ukudumba kolusu. Umphunga we-Xylene umnandi, ufana nevumba le-airplane tack; ukuvezwa kwi-xylene kunokubangela ukudumba kwamehlo, impumlo kunye nomqala. Ukuphefumla igesi kunokubangela iintloko ezibuhlungu, isiyezi, ukuphelelwa ngumdla wokutya kunye nokudinwa.
3. I-Hexamethyldisilazane (i-HMDS)
I-Hexamethyldisilazane (HMDS) isetyenziswa kakhulu njengomaleko wokuqala ukwandisa ukunamathela kwe-photoresist kumphezulu wemveliso. Inokutsha kwaye ine-flash point eyi-6.7°C. Iyaqhuma xa uxinzelelo emoyeni luyi-0.8%-16%. I-HMDS isabela ngamandla namanzi, utywala kunye nee-mineral acids ukuze ikhuphe i-ammonia.
4. I-Tetramethylammonium hydroxide
I-Tetramethylammonium hydroxide (TMAH) isetyenziswa kakhulu njengomphuhlisi we-lithography elungileyo. Inobungozi kwaye iyakonakalisa. Inokuba yingozi ukuba iginyiwe okanye idibene ngqo nolusu. Ukudibana nothuli okanye inkungu ye-TMAH kunokubangela ukudumba kwamehlo, ulusu, impumlo kunye nomqala. Ukuphefumla ubuninzi be-TMAH kuya kukhokelela ekufeni.
5. I-chlorine kunye ne-fluorine
I-Chlorine (Cl2) kunye ne-fluorine (F2) zombini zisetyenziswa kwi-excimer lasers njengemithombo yokukhanya ye-ultraviolet enzulu kunye ne-ultraviolet extreme (EUV). Zombini iigesi zinobuthi, zibonakala ziluhlaza okotshani, kwaye zinevumba elibi lokucaphuka. Ukuphefumla ubuninzi bale gesi kuya kukhokelela ekufeni. Igesi ye-fluorine inokusabela namanzi ukuvelisa igesi ye-hydrogen fluoride. Igesi ye-hydrogen fluoride yi-asidi enamandla ecaphukisa ulusu, amehlo kunye nendlela yokuphefumla kwaye inokubangela iimpawu ezifana nokutsha kunye nobunzima bokuphefumla. Ubuninzi be-fluoride bunokubangela ityhefu emzimbeni womntu, okubangela iimpawu ezifana neentloko ezibuhlungu, ukuhlanza, urhudo, kunye ne-coma.
6. I-Argon
I-Argon (Ar) yigesi engasebenziyo edla ngokungabangeli monakalo ngqo emzimbeni womntu. Kwiimeko eziqhelekileyo, umoya abantu abawuphefumlayo uqulethe malunga ne-0.93% ye-argon, kwaye olu xinzelelo alunampembelelo icacileyo emzimbeni womntu. Nangona kunjalo, kwezinye iimeko, i-argon inokubangela umonakalo emzimbeni womntu.
Nazi ezinye iimeko ezinokwenzeka: Kwindawo exineneyo, uxinzelelo lwe-argon lunokwanda, ngaloo ndlela lunciphise uxinzelelo lwe-oksijini emoyeni kwaye lubangele i-hypoxia. Oku kunokubangela iimpawu ezifana nesiyezi, ukudinwa, kunye nokuphefumla kancinci. Ukongeza, i-argon yigesi engasebenziyo, kodwa inokuqhuma phantsi kobushushu obuphezulu okanye uxinzelelo oluphezulu.
7. I-Neon
I-Neon (Ne) yigesi ezinzileyo, engenambala kwaye engenavumba engathathi cala. Igesi ye-neon ayibandakanyeki kwinkqubo yokuphefumla yomntu, ngoko ke ukuphefumla igesi ye-neon enoxinzelelo oluphezulu kuya kubangela i-hypoxia. Ukuba ukwimeko ye-hypoxia ixesha elide, unokufumana iimpawu ezifana nentloko ebuhlungu, isicaphucaphu, kunye nokuhlanza. Ukongeza, igesi ye-neon inokusabela nezinye izinto eziphantsi kobushushu obuphezulu okanye uxinzelelo oluphezulu ukuze kubangele umlilo okanye ukuqhuma.
8. Igesi yeXenon
Igesi yeXenon (Xe) yigesi ezinzileyo, engenambala kwaye engenavumba engathathi cala kwinkqubo yokuphefumla yomntu, ngoko ke ukuphefumla igesi yeXenon enoxinzelelo oluphezulu kuya kubangela i-hypoxia. Ukuba ukwimeko ye-hypoxia ixesha elide, unokufumana iimpawu ezifana nentloko ebuhlungu, isicaphucaphu, kunye nokuhlanza. Ukongeza, igesi yeNeon inokusabela nezinye izinto eziphantsi kobushushu obuphezulu okanye uxinzelelo oluphezulu ukuze kubangele umlilo okanye ukuqhuma.
9. Igesi yeKrypton
Igesi iKrypton (Kr) yigesi ezinzileyo, engenambala kwaye engenavumba, engathathi nxaxheba kwinkqubo yokuphefumla yomntu, ngoko ke ukuphefumla igesi yeKrypton ephezulu kuya kubangela i-hypoxia. Ukuba ukwimeko ye-hypoxia ixesha elide, unokufumana iimpawu ezifana nentloko ebuhlungu, isicaphucaphu, kunye nokuhlanza. Ukongeza, igesi yeXenon inokusabela nezinye izinto eziphantsi kobushushu obuphezulu okanye uxinzelelo oluphezulu ukuze kubangele umlilo okanye ukuqhuma. Ukuphefumla kwindawo enengxaki yokunqongophala kweoksijini kunokubangela i-hypoxia. Ukuba ukwimeko ye-hypoxia ixesha elide, unokufumana iimpawu ezifana nentloko ebuhlungu, isicaphucaphu, kunye nokuhlanza. Ukongeza, igesi yeKrypton inokusabela nezinye izinto eziphantsi kobushushu obuphezulu okanye uxinzelelo oluphezulu ukuze kubangele umlilo okanye ukuqhuma.
Izisombululo zokufumanisa igesi ezinobungozi kushishino lwe-semiconductor
Ishishini le-semiconductor libandakanya ukuveliswa, ukuveliswa, kunye nenkqubo yeegesi ezinokutsha, eziqhumayo, ezinobuthi, neziyingozi. Njengomsebenzisi weegesi kwizityalo zokwenza ii-semiconductor, wonke umsebenzi kufuneka aqonde idatha yokhuseleko lweegesi ezahlukeneyo eziyingozi ngaphambi kokuba ayisebenzise, kwaye kufuneka azi indlela yokujongana neenkqubo zongxamiseko xa ezi gesi zivuza.
Kwimveliso, ukwenziwa, kunye nokugcinwa kweshishini le-semiconductor, ukuze kuthintelwe ukulahleka kobomi kunye nepropathi okubangelwa kukuvuza kwezi gesi ziyingozi, kuyimfuneko ukufaka izixhobo zokufumanisa igesi ukuze kubonwe igesi ekujoliswe kuyo.
Izixhobo zokubona igesi ziye zaba zizixhobo ezibalulekileyo zokujonga okusingqongileyo kushishino lwe-semiconductor lwanamhlanje, kwaye zikwazezona zixhobo zokujonga ngokuthe ngqo.
URiken Keiki ebesoloko enika ingqalelo kuphuhliso olukhuselekileyo lweshishini lokuvelisa ii-semiconductor, ngenjongo yokudala indawo yokusebenza ekhuselekileyo ebantwini, kwaye uzinikele ekuphuhliseni izinzwa zegesi ezifanelekileyo kwishishini le-semiconductor, ebonelela ngezisombululo ezifanelekileyo kwiingxaki ezahlukeneyo ezidibana nabasebenzisi, kwaye ephucula rhoqo imisebenzi yemveliso kunye nokuphucula iinkqubo.
Ixesha leposi: Julayi-16-2024