ʻO ke kau ʻana o ka ʻili lahilahi ke uhi ʻana i kahi papa o ka ʻili ma luna o ka mea substrate nui o ka semiconductor. Hiki ke hana ʻia kēia ʻili me nā mea like ʻole, e like me ka insulating compound silicon dioxide, semiconductor polysilicon, metala keleawe, a pēlā aku. ʻO nā lako i hoʻohana ʻia no ka uhi ʻana ua kapa ʻia ʻo ia he lako waiho ʻili lahilahi.
Mai ka manaʻo o ke kaʻina hana hana ʻāpana semiconductor, aia ia ma ke kaʻina hana mua.
Hiki ke hoʻokaʻawale ʻia ke kaʻina hana hoʻomākaukau ʻili lahilahi i ʻelua mau māhele e like me kāna ʻano hana ʻili: ka waiho ʻana o ka mahu kino (PVD) a me ka waiho ʻana o ka mahu kemika(CVD), ma waena o ia mau mea, ʻoi aku ka nui o nā lako hana CVD.
ʻO ka waiho ʻana o ka mahu kino (PVD) e pili ana i ka mahu ʻana o ka ʻili o ke kumu mea a me ka waiho ʻana ma luna o ka ʻili o ka substrate ma o ke kinoea/plasma haʻahaʻa, me ka mahu ʻana, ka sputtering, ka ion beam, a pēlā aku;
ka waiho ʻana o ka mahu kemika (CVD) pili i ke kaʻina hana o ke kau ʻana i kahi ʻili paʻa ma luna o ka wafer silicon ma o kahi hopena kemika o ka hui kinoea. Wahi a nā kūlana hopena (kaomi, ka mea mua), ua māhele ʻia i ke kaomi lewaCVD(APCVD), kaomi haʻahaʻaCVD(LPCVD), CVD i hoʻonui ʻia e ka plasma (PECVD), CVD plasma density kiʻekiʻe (HDPCVD) a me ka waiho ʻana o ka papa atomika (ALD).
LPCVD: Loaʻa i ka LPCVD ka hiki ke uhi ʻanuʻu maikaʻi, ka hoʻonohonoho maikaʻi a me ka kaohi ʻana i ke ʻano, ka nui o ka waiho ʻana a me ka hopena, a hoʻemi nui i ke kumu o ka haumia o nā ʻāpana. ʻO ka hilinaʻi ʻana i nā lako hoʻomehana ma ke ʻano he kumu wela e mālama ai i ka hopena, he mea nui loa ka kaohi ʻana i ka mahana a me ke kaomi kinoea. Hoʻohana nui ʻia i ka hana ʻana o ka papa Poly o nā cell TopCon.
PECVD: Hilinaʻi ka PECVD i ka plasma i hana ʻia e ka hoʻokomo alapine lekiō e hoʻokō i ka mahana haʻahaʻa (ʻoi aku ma mua o 450 degere) o ke kaʻina hana waiho ʻili lahilahi. ʻO ka waiho ʻana i ka mahana haʻahaʻa kona pono nui, no laila e mālama ana i ka ikehu, e hōʻemi ana i nā kumukūʻai, e hoʻonui ana i ka hiki ke hana, a e hōʻemi ana i ka palaho ola o nā mea lawe liʻiliʻi i nā wafers silicon i hoʻokumu ʻia e ka mahana kiʻekiʻe. Hiki ke hoʻopili ʻia i nā kaʻina hana o nā cell like ʻole e like me PERC, TOPCON, a me HJT.
ALD: ʻO ke ʻano like o ke kiʻiʻoniʻoni maikaʻi, mānoanoa a me nā lua ʻole, nā ʻano uhi ʻanuʻu maikaʻi, hiki ke hoʻokō ʻia ma ka mahana haʻahaʻa (mahana lumi-400 ℃), hiki ke hoʻomalu maʻalahi a pololei i ka mānoanoa o ke kiʻiʻoniʻoni, pili nui i nā substrates o nā ʻano like ʻole, a ʻaʻole pono e hoʻomalu i ke ʻano like o ke kahe o ka reactant. Akā ʻo ka hemahema, lohi ka wikiwiki o ka hoʻokumu ʻana o ke kiʻiʻoniʻoni. E like me ka zinc sulfide (ZnS) light-emitting layer i hoʻohana ʻia e hana i nā nanostructured insulators (Al2O3/TiO2) a me nā hōʻike electroluminescent lahilahi-kiʻi (TFEL).
ʻO ka hoʻokaʻawale ʻana o ka papa atomika (ALD) kahi hana uhi hakahaka e hana ana i kahi ʻili lahilahi ma luna o ka ʻili o kahi substrate papa ma ka papa ma ke ʻano o kahi papa atomika hoʻokahi. I ka makahiki 1974, ua hoʻomohala ka mea loea mea Finnish ʻo Tuomo Suntola i kēia ʻenehana a lanakila i ka 1 miliona euro Millennium Technology Award. Ua hoʻohana mua ʻia ka ʻenehana ALD no nā hōʻike electroluminescent panel pālahalaha, akā ʻaʻole i hoʻohana nui ʻia. ʻAʻole a hiki i ka hoʻomaka ʻana o ke kenekulia 21 i hoʻomaka ai ka hoʻohana ʻana o ka ʻenehana ALD e ka ʻoihana semiconductor. Ma ka hana ʻana i nā mea ultra-thin high-dielectric e pani i ka silicon oxide kuʻuna, ua hoʻoponopono pono ia i ka pilikia o ke au leakage i hoʻokumu ʻia e ka hōʻemi ʻana o ka laulā laina o nā transistors hopena kahua, e koi ana i ke kānāwai o Moore e hoʻomohala hou aku i nā laulā laina liʻiliʻi. Ua ʻōlelo ʻo Kauka Tuomo Suntola i kekahi manawa hiki i ka ALD ke hoʻonui nui i ka nui o ka hoʻohui ʻana o nā ʻāpana.
Hōʻike ka ʻikepili lehulehu ua hana ʻia ka ʻenehana ALD e Kauka Tuomo Suntola o PICOSUN ma Finland i ka makahiki 1974 a ua hoʻomohala ʻia ma nā ʻāina ʻē, e like me ke kiʻiʻoniʻoni dielectric kiʻekiʻe i loko o ka ʻāpana 45/32 nanometer i hoʻomohala ʻia e Intel. Ma Kina, ua hoʻolauna koʻu ʻāina i ka ʻenehana ALD ma mua o 30 mau makahiki ma hope o nā ʻāina ʻē. I ʻOkakopa 2010, ua mālama ʻo PICOSUN ma Finland a me ke Kulanui ʻo Fudan i ka hālāwai hoʻololi hoʻonaʻauao ALD kūloko mua, e hoʻolauna ana i ka ʻenehana ALD i Kina no ka manawa mua.
Ke hoʻohālikelike ʻia me ka waiho ʻana o ka mahu kemika kuʻuna (CVD) a me ka waiho ʻana o ka mahu kino (PVD), ʻo nā pono o ALD he kūlike ʻekolu-dimensional maikaʻi loa, ke ʻano like o ka ʻiliʻili nui, a me ka kaohi mānoanoa pololei, i kūpono no ka ulu ʻana i nā ʻiliʻili lahilahi loa ma nā ʻano ʻili paʻakikī a me nā ʻano hiʻohiʻona kiʻekiʻe.
—Kumu ʻikepili: Kahua hana micro-nano o ke Kulanui ʻo Tsinghua—
I ka wā ma hope o Moore, ua hoʻomaikaʻi nui ʻia ka paʻakikī a me ka nui o ke kaʻina hana o ka hana wafer. Ma ka lawe ʻana i nā ʻāpana logic ma ke ʻano he laʻana, me ka hoʻonui ʻia ʻana o ka helu o nā laina hana me nā kaʻina hana ma lalo o 45nm, ʻoi aku hoʻi nā laina hana me nā kaʻina hana o 28nm a ma lalo, ʻoi aku ka kiʻekiʻe o nā koi no ka mānoanoa o ka uhi ʻana a me ka kaohi pololei. Ma hope o ka hoʻolauna ʻana o ka ʻenehana hōʻike lehulehu, ua piʻi nui ka helu o nā ʻanuʻu hana ALD a me nā lako e pono ai; ma ke kahua o nā ʻāpana hoʻomanaʻo, ua ulu ka hana hana nui mai 2D NAND a i 3D NAND structure, ua hoʻomau ka piʻi ʻana o ka helu o nā papa kūloko, a ua hōʻike mālie nā ʻāpana i nā ʻano kiʻekiʻe, nā ʻano hiʻohiʻona kiʻekiʻe, a ua hoʻomaka ka hana koʻikoʻi o ALD e puka mai. Mai ka manaʻo o ka hoʻomohala ʻana o nā semiconductors i ka wā e hiki mai ana, e pāʻani ka ʻenehana ALD i kahi hana koʻikoʻi i ka wā ma hope o Moore.
No ka laʻana, ʻo ALD wale nō ka ʻenehana waiho ʻana e hiki ke hoʻokō i nā koi uhi a me ka hana kiʻiʻoniʻoni o nā hale paʻakikī 3D i hoʻopaʻa ʻia (e like me 3D-NAND). Hiki ke ʻike maopopo ʻia kēia ma ke kiʻi ma lalo nei. ʻAʻole uhi piha ka kiʻiʻoniʻoni i waiho ʻia ma CVD A (uliuli) i ka ʻaoʻao haʻahaʻa o ke ʻano; ʻoiai inā hana ʻia kekahi mau hoʻoponopono hana i CVD (CVD B) e hoʻokō i ka uhi ʻana, ʻaʻole maikaʻi loa ka hana kiʻiʻoniʻoni a me ka haku mele kemika o ka ʻāpana lalo (wahi keʻokeʻo ma ke kiʻi); i ka hoʻohālikelike ʻana, hōʻike ka hoʻohana ʻana i ka ʻenehana ALD i ka uhi piha ʻana o ka kiʻiʻoniʻoni, a ua hoʻokō ʻia nā waiwai kiʻiʻoniʻoni kiʻekiʻe a like ma nā wahi āpau o ke ʻano.
—-Kiʻi Nā Pōmaikaʻi o ka ʻenehana ALD i hoʻohālikelike ʻia me CVD (Puna: ASM)—-
ʻOiai ʻo CVD ke kuleana nui loa o ka mākeke i ka wā pōkole, ua lilo ʻo ALD i hoʻokahi o nā ʻāpana ulu wikiwiki loa o ka mākeke lako hana wafer. Ma kēia mākeke ALD me ka hiki ke ulu nui a me kahi kuleana koʻikoʻi i ka hana ʻana i nā chip, ʻo ASM kahi hui alakaʻi ma ke kahua o nā lako ALD.
Ka manawa hoʻouna: Iune-12-2024