Kev tso zaj duab xis nyias yog txheej ib txheej zaj duab xis rau ntawm cov khoom siv tseem ceeb ntawm lub semiconductor. Zaj duab xis no tuaj yeem ua los ntawm ntau yam khoom siv, xws li cov khoom siv rwb thaiv tsev silicon dioxide, semiconductor polysilicon, hlau tooj liab, thiab lwm yam. Cov khoom siv siv rau txheej hu ua cov khoom siv tso zaj duab xis nyias.
Los ntawm qhov kev xav ntawm cov txheej txheem tsim khoom semiconductor chip, nws nyob rau hauv cov txheej txheem pem hauv ntej.
Cov txheej txheem npaj zaj duab xis nyias muaj peev xwm muab faib ua ob pawg raws li nws txoj kev tsim zaj duab xis: lub cev vapor deposition (PVD) thiab tshuaj vapor deposition(CVD), ntawm cov khoom siv CVD txheej txheem suav rau feem pua ntau dua.
Kev tso pa tawm ntawm lub cev (PVD) yog hais txog kev ua pa ntawm qhov chaw ntawm cov khoom siv thiab kev tso rau ntawm qhov chaw ntawm lub substrate los ntawm cov roj / plasma qis, suav nrog kev ua pa, sputtering, ion beam, thiab lwm yam.;
Kev tso pa tshuaj lom neeg (CVD) hais txog cov txheej txheem ntawm kev tso ib zaj duab xis khov kho rau ntawm qhov chaw ntawm silicon wafer los ntawm kev tshuaj lom neeg ntawm cov roj sib tov. Raws li cov xwm txheej tshuaj tiv thaiv (siab, precursor), nws tau muab faib ua atmospheric siabCVD(APCVD), lub zog qisCVD(LPCVD), plasma enhanced CVD (PECVD), high density plasma CVD (HDPCVD) thiab atomic layer deposition (ALD).
LPCVD: LPCVD muaj peev xwm ua tau zoo dua, muaj cov khoom zoo thiab tswj tau cov qauv, muaj tus nqi tso tawm siab thiab tso zis tawm, thiab txo qhov chaw ua kom muaj kuab paug me me. Kev siv cov khoom siv cua sov ua qhov chaw cua sov los tswj cov tshuaj tiv thaiv, kev tswj qhov kub thiab txias thiab lub zog roj yog qhov tseem ceeb heev. Siv dav hauv kev tsim cov Poly txheej ntawm TopCon hlwb.
PECVD: PECVD siv cov plasma uas tsim los ntawm kev siv hluav taws xob los ua kom cov txheej txheem tso zaj duab xis nyias nyias kub tsawg (tsawg dua 450 degrees). Qhov kub tsawg yog nws qhov zoo tshaj plaws, yog li ntawd txuag hluav taws xob, txo cov nqi, nce peev xwm tsim khoom, thiab txo qhov lwj ntawm cov neeg nqa khoom tsawg hauv silicon wafers uas tshwm sim los ntawm qhov kub siab. Nws tuaj yeem siv rau cov txheej txheem ntawm ntau lub hlwb xws li PERC, TOPCON, thiab HJT.
ALD: Cov yeeb yaj kiab zoo sib xws, ntom thiab tsis muaj qhov, cov yam ntxwv zoo ntawm kev npog kauj ruam, tuaj yeem ua tiav ntawm qhov kub qis (chav sov - 400 ℃), tuaj yeem tswj tau qhov tuab ntawm zaj duab xis yooj yim thiab raug, siv tau dav rau cov khoom siv ntawm ntau yam duab, thiab tsis tas yuav tswj qhov sib xws ntawm cov dej ntws reactant. Tab sis qhov tsis zoo yog tias qhov ceev ntawm kev tsim zaj duab xis qeeb. Xws li cov zinc sulfide (ZnS) txheej teeb ci siv los tsim cov nanostructured insulators (Al2O3 / TiO2) thiab cov yeeb yaj kiab nyias nyias electroluminescent (TFEL).
Atomic layer deposition (ALD) yog ib txoj kev txheej txheem nqus tsev uas tsim ib daim nyias nyias rau ntawm qhov chaw ntawm ib txheej substrate los ntawm ib txheej hauv daim ntawv ntawm ib txheej atomic. Thaum ntxov li xyoo 1974, Finnish material physicist Tuomo Suntola tau tsim cov thev naus laus zis no thiab yeej 1 lab euro Millennium Technology Award. ALD thev naus laus zis tau siv thawj zaug rau cov zaub electroluminescent tiaj tus, tab sis nws tsis tau siv dav. Nws tsis yog txog thaum pib ntawm lub xyoo pua 21st uas ALD thev naus laus zis tau pib siv los ntawm kev lag luam semiconductor. Los ntawm kev tsim cov ntaub ntawv ultra-thin high-dielectric los hloov cov silicon oxide ib txwm muaj, nws tau daws qhov teeb meem tam sim no los ntawm kev txo qis ntawm txoj kab dav ntawm cov teb cuam tshuam transistors, ua rau Moore Txoj Cai txhim kho ntxiv mus rau txoj kab dav me dua. Dr. Tuomo Suntola ib zaug tau hais tias ALD tuaj yeem ua rau kom muaj kev sib koom ua ke ntawm cov khoom.
Cov ntaub ntawv pej xeem qhia tau hais tias ALD thev naus laus zis tau tsim los ntawm Dr. Tuomo Suntola ntawm PICOSUN hauv Finland xyoo 1974 thiab tau raug kev lag luam txawv teb chaws, xws li zaj duab xis dielectric siab hauv 45/32 nanometer chip tsim los ntawm Intel. Hauv Suav teb, kuv lub teb chaws tau qhia txog ALD thev naus laus zis ntau dua 30 xyoo tom qab dua li lwm lub teb chaws. Thaum Lub Kaum Hli Ntuj xyoo 2010, PICOSUN hauv Finland thiab Fudan University tau tuav thawj lub rooj sib tham sib pauv kev kawm ALD hauv tebchaws, qhia txog ALD thev naus laus zis rau Suav teb thawj zaug.
Piv nrog rau cov tshuaj lom neeg ib txwm muaj (CVD) thiab lub cev vapor deposition (PVD), qhov zoo ntawm ALD yog qhov zoo heev peb-seem conformality, loj-cheeb tsam zaj duab xis sib xws, thiab kev tswj qhov tuab meej, uas yog tsim rau kev loj hlob ultra-thin zaj duab xis ntawm cov duab nyuaj thiab cov qauv siab aspect ratio.
—Qhov chaw ntawm cov ntaub ntawv: Micro-nano processing platform ntawm Tsinghua University—
Nyob rau hauv lub sijhawm tom qab Moore, qhov nyuaj thiab cov txheej txheem ntawm kev tsim wafer tau zoo dua heev. Piv txwv li, siv cov logic chips, nrog rau kev nce ntxiv ntawm cov kab ntau lawm nrog cov txheej txheem qis dua 45nm, tshwj xeeb tshaj yog cov kab ntau lawm nrog cov txheej txheem ntawm 28nm thiab hauv qab, qhov yuav tsum tau rau cov txheej tuab thiab kev tswj hwm qhov tseeb yog siab dua. Tom qab kev qhia txog ntau yam thev naus laus zis, tus lej ntawm ALD cov kauj ruam txheej txheem thiab cov khoom siv xav tau tau nce ntxiv ntau; hauv thaj chaw ntawm cov cim xeeb chips, cov txheej txheem tsim khoom tseem ceeb tau hloov pauv los ntawm 2D NAND mus rau 3D NAND qauv, tus lej ntawm cov khaubncaws sab hauv tau txuas ntxiv nce ntxiv, thiab cov khoom tau maj mam nthuav tawm cov qauv siab, qhov sib piv siab, thiab lub luag haujlwm tseem ceeb ntawm ALD tau pib tshwm sim. Los ntawm qhov kev xav ntawm kev txhim kho yav tom ntej ntawm semiconductors, ALD thev naus laus zis yuav ua lub luag haujlwm tseem ceeb hauv lub sijhawm tom qab Moore.
Piv txwv li, ALD yog tib lub thev naus laus zis tso tawm uas tuaj yeem ua tau raws li qhov yuav tsum tau ua thiab kev ua tau zoo ntawm cov yeeb yaj kiab ntawm cov qauv 3D sib dhos (xws li 3D-NAND). Qhov no tuaj yeem pom tseeb hauv daim duab hauv qab no. Cov yeeb yaj kiab tso rau hauv CVD A (xiav) tsis npog tag nrho qhov qis ntawm cov qauv; txawm tias qee qhov kev hloov kho cov txheej txheem tau ua rau CVD (CVD B) kom ua tiav kev npog, kev ua tau zoo ntawm cov yeeb yaj kiab thiab cov tshuaj lom neeg ntawm thaj chaw hauv qab tsis zoo heev (thaj chaw dawb hauv daim duab); qhov sib piv, kev siv ALD thev naus laus zis qhia txog kev npog tag nrho cov yeeb yaj kiab, thiab cov khoom zoo thiab sib xws tau ua tiav hauv txhua qhov chaw ntawm cov qauv.
—-Duab Cov txiaj ntsig ntawm ALD thev naus laus zis piv rau CVD (Qhov chaw: ASM)—-
Txawm hais tias CVD tseem nyob hauv feem lag luam loj tshaj plaws hauv lub sijhawm luv luv, ALD tau dhau los ua ib qho ntawm cov khoom lag luam loj hlob sai tshaj plaws ntawm kev lag luam wafer fab. Hauv kev lag luam ALD no nrog lub peev xwm loj hlob zoo thiab lub luag haujlwm tseem ceeb hauv kev tsim cov chips, ASM yog lub tuam txhab ua lag luam hauv kev lag luam ntawm ALD cov khoom siv.
Lub sijhawm tshaj tawm: Lub Rau Hli-12-2024