Ukufakwa kwefilimu encane kuwukumboza ungqimba lwefilimu ezintweni eziyinhloko ze-semiconductor. Le filimu ingenziwa ngezinto ezahlukahlukene, njenge-insulating compound silicon dioxide, i-semiconductor polysilicon, ithusi lensimbi, njll. Imishini esetshenziselwa ukumboza ibizwa ngokuthi imishini yokufakwa kwefilimu encane.
Ngokombono wenqubo yokukhiqiza ama-chip e-semiconductor, itholakala enqubweni engaphambili.
Inqubo yokulungiselela ifilimu encane ingahlukaniswa ngezigaba ezimbili ngokuya ngendlela yayo yokwenza ifilimu: ukufakwa komphunga ngokomzimba (i-PVD) kanye nokufakwa komphunga wamakhemikhali(I-CVD), phakathi kwazo imishini yenqubo ye-CVD ibalwa ngesilinganiso esiphezulu.
Ukufakwa komhwamuko ongokoqobo (i-PVD) kubhekisela ekushiseni kobuso bomthombo wezinto ezibonakalayo kanye nokufakwa kobuso be-substrate ngegesi/i-plasma enomfutho ophansi, okuhlanganisa ukuhwamuka, ukuchitheka, umsebe we-ion, njll.;
Ukufakwa komphunga wamakhemikhali (I-CVD) ibhekisela enkambisweni yokufaka ifilimu eqinile ebusweni be-silicon wafer ngokusebenzisa ukusabela kwamakhemikhali kwengxube yegesi. Ngokwezimo zokusabela (ingcindezi, isandulela), ihlukaniswe yaba ukucindezela komoyaI-CVD(APCVD), umfutho ophansiI-CVD(LPCVD), i-plasma ethuthukisiwe i-CVD (PECVD), i-high density plasma CVD (HDPCVD) kanye ne-atomic layer deposition (ALD).
I-LPCVD: I-LPCVD inekhono elingcono lokumboza izinyathelo, ukwakheka okuhle nokulawula isakhiwo, izinga eliphezulu lokufakwa kanye nokukhipha, futhi inciphisa kakhulu umthombo wokungcola kwezinhlayiya. Ukuthembela emishinini yokushisa njengomthombo wokushisa ukuze kulondolozwe ukusabela, ukulawula izinga lokushisa kanye nokucindezela kwegesi kubaluleke kakhulu. Kusetshenziswa kabanzi ekukhiqizweni kwezingqimba ze-Poly zamaseli e-TopCon.
I-PECVD: I-PECVD ithembele ku-plasma ekhiqizwa yi-radio frequency induction ukuze ifinyelele izinga lokushisa eliphansi (ngaphansi kwama-degrees angu-450) lenqubo yokubeka ifilimu encane. Ukubeka izinga lokushisa eliphansi kuyinzuzo yayo eyinhloko, ngaleyo ndlela yonga amandla, inciphise izindleko, ikhulise amandla okukhiqiza, futhi inciphise ukubola kwesikhathi sokuphila kwezinkampani ezincane kuma-silicon wafers okubangelwa izinga lokushisa eliphezulu. Ingasetshenziswa ezinqubweni zamaseli ahlukahlukene njenge-PERC, TOPCON, kanye ne-HJT.
I-ALD: Ukufana okuhle kwefilimu, okuminyene futhi okungenazimbobo, izici ezinhle zokumboza isinyathelo, kungenziwa ekushiseni okuphansi (izinga lokushisa legumbi -400℃), kungalawula kalula nangokunembile ukujiya kwefilimu, kusebenza kabanzi kuma-substrate anezimo ezahlukene, futhi akudingeki kulawulwe ukufana kokugeleza kwe-reactant. Kodwa ububi ukuthi ijubane lokwakheka kwefilimu lihamba kancane. Njengesendlalelo esikhipha ukukhanya se-zinc sulfide (ZnS) esisetshenziselwa ukukhiqiza ama-insulators akhiwe ngendlela encane (Al2O3/TiO2) kanye nezibonisi ze-electroluminescent zefilimu encane (TFEL).
Ukufakwa kwe-Atomic layer (ALD) inqubo yokumboza nge-vacuum eyakha ifilimu encane ebusweni be-substrate layer nge-layer ngesimo se-athomu eyodwa. Ngasekuqaleni kuka-1974, isazi sezinto zaseFinland uTuomo Suntola sathuthukisa lobu buchwepheshe futhi sawina i-1 million euro Millennium Technology Award. Ubuchwepheshe be-ALD ekuqaleni babusetshenziswa ekubonisweni kwe-flat-panel electroluminescent, kodwa abuzange busetshenziswe kabanzi. Kwaze kwaba sekuqaleni kwekhulu lama-21 lapho ubuchwepheshe be-ALD baqala ukwamukelwa yimboni ye-semiconductor. Ngokukhiqiza izinto ezincane kakhulu ze-dielectric ukuze zithathe indawo ye-silicon oxide yendabuko, kwaxazulula ngempumelelo inkinga yamanje yokuvuza ebangelwa ukunciphisa ububanzi bomugqa wama-transistors effect field, okwenza uMthetho kaMoore uthuthuke kakhulu uye ebubanzi bomugqa obuncane. UDkt. Tuomo Suntola wake wathi i-ALD ingakhulisa kakhulu ubuningi bokuhlanganiswa kwezingxenye.
Idatha yomphakathi ikhombisa ukuthi ubuchwepheshe be-ALD basungulwa nguDkt. Tuomo Suntola we-PICOSUN eFinland ngo-1974 futhi buthuthukiswe kwamanye amazwe, njengefilimu ene-dielectric ephezulu ku-chip ye-nanometer engu-45/32 eyathuthukiswa yi-Intel. E-China, izwe lami lethula ubuchwepheshe be-ALD eminyakeni engaphezu kwengu-30 kamuva kunamazwe angaphandle. Ngo-Okthoba 2010, i-PICOSUN eFinland kanye ne-Fudan University babamba umhlangano wokuqala wokushintshana kwezemfundo we-ALD wasekhaya, bethula ubuchwepheshe be-ALD eShayina okokuqala.
Uma kuqhathaniswa nokufakwa komphunga wamakhemikhali wendabuko (I-CVD) kanye nokufakwa komoya ophathekayo (i-PVD), izinzuzo ze-ALD ukuhambisana okuhle kakhulu okunezinhlangothi ezintathu, ukufana kwefilimu endaweni enkulu, kanye nokulawula ukujiya okunembile, okufanelekela ukutshala amafilimu amancane kakhulu ezimweni eziyinkimbinkimbi zobuso kanye nezakhiwo zesilinganiso esiphakeme.
—Umthombo wedatha: Ipulatifomu yokucubungula i-Micro-nano yaseTsinghua University—
Esikhathini sangemva kukaMoore, ubunzima kanye nomthamo wenqubo yokukhiqiza ama-wafer kuthuthukiswe kakhulu. Uma sithatha ama-logic chips njengesibonelo, ngokwanda kwenani lemigqa yokukhiqiza enezinqubo ezingaphansi kuka-45nm, ikakhulukazi imigqa yokukhiqiza enezinqubo ezingu-28nm nangaphansi, izidingo zokujiya kokumboza kanye nokulawula ukunemba ziphakeme. Ngemuva kokwethulwa kobuchwepheshe bokuchayeka okuningi, inani lezinyathelo zenqubo ye-ALD kanye nemishini edingekayo likhuphuke kakhulu; emkhakheni wama-memory chips, inqubo yokukhiqiza ejwayelekile ishintshe kusukela ku-2D NAND kuya ku-3D NAND structure, inani lezingqimba zangaphakathi liqhubekile nokukhula, futhi izingxenye ziye zaveza kancane kancane izakhiwo ze-high-density, high aspect ratio, futhi indima ebalulekile ye-ALD isiqalile ukuvela. Ngokombono wentuthuko yesikhathi esizayo yama-semiconductors, ubuchwepheshe be-ALD buzodlala indima ebaluleke kakhulu esikhathini sangemva kukaMoore.
Isibonelo, i-ALD iyona kuphela ubuchwepheshe bokufaka obungahlangabezana nezidingo zokumbozwa kanye nokusebenza kwefilimu yezakhiwo eziyinkimbinkimbi ze-3D (njenge-3D-NAND). Lokhu kungabonakala ngokucacile esithombeni esingezansi. Ifilimu efakwe ku-CVD A (eluhlaza okwesibhakabhaka) ayimbozi ngokuphelele ingxenye engezansi yesakhiwo; noma ngabe kwenziwa ukulungiswa kwenqubo ethile ku-CVD (CVD B) ukuze kufezwe ukumbozwa, ukusebenza kwefilimu kanye nokwakheka kwamakhemikhali kwendawo engezansi kubi kakhulu (indawo emhlophe esithombeni); ngokuphambene nalokho, ukusetshenziswa kobuchwepheshe be-ALD kubonisa ukumbozwa okuphelele kwefilimu, futhi izakhiwo zefilimu ezisezingeni eliphezulu nezifanayo ziyafezwa kuzo zonke izindawo zesakhiwo.
—-Izinzuzo Zesithombe Sobuchwepheshe be-ALD uma kuqhathaniswa ne-CVD (Umthombo: ASM)—-
Nakuba i-CVD isalokhu ithatha isabelo semakethe esikhulu kunazo zonke esikhathini esifushane, i-ALD isibe ngenye yezingxenye ezikhula ngokushesha emakethe yemishini ye-wafer fab. Kule makethe ye-ALD enamandla amakhulu okukhula kanye nendima ebalulekile ekukhiqizweni kwama-chip, i-ASM iyinkampani ehamba phambili emkhakheni wemishini ye-ALD.
Isikhathi sokuthunyelwe: Juni-12-2024