Cov Txheej Txheem CVD Siab Rau SiC Epitaxial Kev Loj Hlob
Tsim los rau cov txheej txheem khoom siv semiconductor muaj zog siab ua haujlwm nyob rau hauv kev ntxhov siab kub heev (1500 ° C - 1700 ° C), peb cov CVD SiC thiab TaC coated planetary susceptors, satellite disks, thiab gas deflectors tau tsim los kom zoo tshaj plaws. Tsim los tiv thaiv kev tsim cov khoom me me, kev puas tsuaj ntawm qhov chaw, thiab cov roj reactive etching (H₂, SiH₄, C₃H∯), peb cov txheej txheem siab heev ua kom ntseeg tau tias lub neej ua haujlwm ntev, kev tswj hwm dopant zoo dua, thiab kev sib npaug ntawm cov zaj duab xis tuab thoob plaws.6-nti thiab 8-nti SiC epitaxial wafers.
Ruaj khov txog li 1700 ° C hauv cov chaw txo H₂/silane hnyav.
Tshem tawm cov txheej txheem delamination, micro-cracking, thiab spalling thaum lub sijhawm thermal cycles sai.
Kev ua haujlwm CNC precision uas tsim rau cov tshuab SiC Epi reactors tiam tom ntej (LPE, Aixtron, Nuflare).
| Kev Ntsuas Txuj Ci | Tus nqi ntawm cov lus qhia | Txoj Kev Ntsuas / Txheem |
|---|---|---|
| Cov Kev Xaiv Khoom Siv Txheej | CVD SiC / Tantalum Carbide (TaC) | Txheej Hermetic Siab Purity |
| Cov Khoom Siv Hauv Paus | Purified Isostatic Graphite | Kev Ua Phem Ntau Yam <5 ppm |
| Kev Tiv Thaiv Kev Kub Ntxhov | Delta T > 500 ° C Ramp Rate | Tsis muaj kev tawg / tev tawv |
| Qhov Roughness ntawm qhov chaw (Ra) | ≤ 0.4 μm (Daim iav ci ntsa iab) | Tiv thaiv Wafer Sticking & Particles |
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