WaferʻO ka ʻoki ʻana kekahi o nā loulou koʻikoʻi i ka hana semiconductor mana. Ua hoʻolālā ʻia kēia ʻanuʻu e hoʻokaʻawale pololei i nā kaapuni hoʻohui ʻia a i ʻole nā chips mai nā wafers semiconductor.
ʻO ke kī iwaferʻo ka ʻoki ʻana i hiki ke hoʻokaʻawale i nā ʻāpana pākahi me ka hōʻoia ʻana i nā ʻano palupalu a me nā kaapuni i hoʻokomo ʻia i loko owaferʻaʻole i hōʻino ʻia. ʻO ka holomua a i ʻole ka hāʻule ʻana o ke kaʻina hana ʻoki ʻaʻole wale ia e pili i ka maikaʻi o ka hoʻokaʻawale ʻana a me ka hua o ka ʻāpana, akā pili pono nō hoʻi i ka pono o ke kaʻina hana holoʻokoʻa.
▲ʻEkolu mau ʻano maʻamau o ka ʻoki ʻana i ka wafer | Puna: KLA CHINA
I kēia manawa, ʻo ka mea maʻamauwaferua māhele ʻia nā kaʻina hana ʻoki i:
ʻOki ʻana i ka pahi: haʻahaʻa ke kumukūʻai, hoʻohana pinepine ʻia no ka ʻoi aku ka mānoanoanā wafers
ʻO ka ʻoki ʻana i ka laser: kumukūʻai kiʻekiʻe, hoʻohana pinepine ʻia no nā wafers me ka mānoanoa o 30μm
ʻO ka ʻoki ʻana i ka plasma: ke kumukūʻai kiʻekiʻe, nā kapu hou aku, hoʻohana pinepine ʻia no nā wafers me ka mānoanoa ma lalo o 30μm
ʻOki ʻana i ka pahi mīkini
ʻO ka ʻoki ʻana i ka pahi he hana ia o ka ʻoki ʻana ma ka laina kākau e kahi diski wili wikiwiki (pahi). Hana pinepine ʻia ka pahi me ka mea daimana abrasive a i ʻole ultra-thin, kūpono no ka ʻoki ʻana a i ʻole ke grooving ma nā wafers silicon. Eia nō naʻe, ma ke ʻano he ʻano ʻoki mechanical, hilinaʻi ka ʻoki ʻana i ka pahi i ka wehe ʻana i nā mea kino, hiki ke alakaʻi maʻalahi i ka chipping a i ʻole ka haki ʻana o ka lihi chip, a laila e hoʻopilikia ana i ka maikaʻi o ka huahana a me ka hōʻemi ʻana i ka hua.
Hoʻopilikia ʻia ka maikaʻi o ka huahana hope loa i hana ʻia e ke kaʻina hana ʻoki mechanical e nā palena he nui, me ka wikiwiki o ka ʻoki ʻana, ka mānoanoa o ka pahi, ke anawaena o ka pahi, a me ka wikiwiki o ka wili ʻana o ka pahi.
ʻO ka ʻoki piha ke ʻano ʻoki pahi maʻalahi loa, kahi e ʻoki loa ai i ka ʻāpana hana ma ka ʻoki ʻana i kahi mea paʻa (e like me ka lipine ʻoki).
▲ ʻOki ʻana i ka pahi mīkini-ʻoki piha | Pūnaewele kumu kiʻi
ʻO ka ʻoki hapa kahi ʻano hana e hana ai i kahi ʻauwaha ma ka ʻoki ʻana i waenakonu o ka mea hana. Ma ka hana mau ʻana i ke kaʻina hana ʻauwaha, hiki ke hana ʻia nā kiko i ke ʻano o ka lau nahele a me ke kui.
▲ ʻOki ʻana i ka pahi mīkini-ʻoki hapalua | Pūnaewele kumu kiʻi
ʻO ka ʻoki pālua kahi ʻano hana e hoʻohana ana i ka ʻoki ʻoki pālua me ʻelua mau spindle e hana i nā ʻoki piha a hapa paha ma nā laina hana ʻelua i ka manawa like. Loaʻa i ka ʻoki pālua ʻelua mau koʻi spindle. Hiki ke hoʻokō ʻia ka throughput kiʻekiʻe ma o kēia kaʻina hana.
▲ ʻOki ʻana i ka pahi mīkini-ʻoki pālua | Pūnaewele kumu kiʻi
Hoʻohana ka ʻoki ʻanuʻu i kahi ʻoki ʻoki pālua me nā wili ʻelua e hana i nā ʻoki piha a me ka hapalua i ʻelua mau pae. E hoʻohana i nā pahi i hoʻomaikaʻi ʻia no ka ʻoki ʻana i ka papa uea ma ka ʻili o ka wafer a me nā pahi i hoʻomaikaʻi ʻia no ke koena o ka kristal silicon hoʻokahi e hoʻokō ai i ka hana kiʻekiʻe.
▲ ʻOki ʻana i ka pahi mīkini - ʻoki ʻana i ka ʻanuʻu | Pūnaewele kumu kiʻi
ʻO ka ʻoki ʻana i ka bevel kahi ʻano hana e hoʻohana ana i ka pahi me kahi lihi ʻano V ma ka lihi ʻoki hapa e ʻoki i ka wafer i ʻelua mau pae i ka wā o ke kaʻina ʻoki ʻana. Hana ʻia ke kaʻina chamfering i ka wā o ke kaʻina ʻoki. No laila, hiki ke hoʻokō ʻia ka ikaika hoʻoheheʻe kiʻekiʻe a me ka hana kiʻekiʻe.
▲ ʻOki ʻana i ka pahi mīkini - ʻoki bevel | Pūnaewele kumu kiʻi
ʻOki ʻana me ka laser
ʻO ka ʻoki laser kahi ʻenehana ʻoki wafer pili ʻole e hoʻohana ana i kahi kukuna laser i kālele ʻia e hoʻokaʻawale i nā ʻāpana pākahi mai nā wafers semiconductor. Hoʻopili ʻia ke kukuna laser ikehu kiʻekiʻe ma luna o ka ʻili o ka wafer a hoʻomaloʻo a wehe paha i nā mea ma ka laina ʻoki i hoʻoholo mua ʻia ma o nā kaʻina hana ablation a i ʻole ka hoʻoheheʻe wela.
▲ Kiʻikuhi ʻoki laser | Puna kiʻi: KLA CHINA
ʻO nā ʻano lasers i hoʻohana nui ʻia i kēia manawa, ʻo ia nā lasers ultraviolet, nā lasers infrared, a me nā lasers femtosecond. I waena o lākou, hoʻohana pinepine ʻia nā lasers ultraviolet no ka ablation anuanu pololei ma muli o ko lākou ikehu photon kiʻekiʻe, a he liʻiliʻi loa ka ʻāpana i hoʻopilikia ʻia e ka wela, hiki ke hōʻemi pono i ka pilikia o ka hōʻino wela i ka wafer a me kona mau ʻāpana a puni. ʻOi aku ka maikaʻi o nā lasers infrared no nā wafers mānoanoa no ka mea hiki iā lākou ke komo hohonu i loko o ka mea. Hoʻokō nā lasers Femtosecond i ka wehe ʻana i nā mea kiʻekiʻe a me ka pono me ka hoʻoili wela kokoke ʻole ma o nā pulse māmā ultrashort.
He nui nā pono o ka ʻoki ʻana i ka laser ma mua o ka ʻoki ʻana i ka pahi kuʻuna. ʻO ka mea mua, ma ke ʻano he hana pili ʻole, ʻaʻole pono ka ʻoki ʻana i ka laser i ke kaomi kino ma luna o ka wafer, e hōʻemi ana i nā pilikia haki a me ka haki ʻana i maʻamau i ka ʻoki ʻana i ka mīkini. ʻO kēia hiʻohiʻona e kūpono loa ai ka ʻoki ʻana i ka laser no ka hana ʻana i nā wafers palupalu a lahilahi paha, ʻoi aku hoʻi nā mea me nā ʻano paʻakikī a i ʻole nā hiʻohiʻona maikaʻi.
▲ Kiʻikuhi ʻoki laser | Pūnaewele kumu kiʻi
Eia kekahi, ʻo ke kiʻekiʻe o ka pololei a me ka pololei o ka ʻoki ʻana i ka laser e hiki ai iā ia ke hoʻohuli i ke kukuna laser i kahi nui liʻiliʻi loa, kākoʻo i nā ʻano ʻoki paʻakikī, a hoʻokō i ka hoʻokaʻawale ʻana o ka mamao liʻiliʻi ma waena o nā ʻāpana. He mea nui loa kēia hiʻohiʻona no nā mea semiconductor holomua me nā nui e hoʻemi ana.
Eia nō naʻe, he mau palena ko ka ʻoki ʻana i ka laser. Ke hoʻohālikelike ʻia me ka ʻoki ʻana i ka pahi, ʻoi aku ka lohi a me ke kumukūʻai, ʻoi aku hoʻi i ka hana nui. Eia kekahi, ʻo ke koho ʻana i ke ʻano laser kūpono a me ka hoʻonui ʻana i nā palena e hōʻoia i ka wehe pono ʻana i nā mea a me ka liʻiliʻi o ka wahi i hoʻopilikia ʻia e ka wela hiki ke paʻakikī no kekahi mau mea a me nā mānoanoa.
ʻOki ʻana i ka ablation laser
I ka wā o ka ʻoki ʻana i ka laser ablation, ua kau pono ʻia ke kukuna laser ma kahi kikoʻī ma luna o ka ʻili o ka wafer, a ua alakaʻi ʻia ka ikehu laser e like me ke ʻano ʻoki i hoʻoholo mua ʻia, e ʻoki mālie ana ma o ka wafer a i lalo. Ma muli o nā koi ʻoki, hana ʻia kēia hana me ka hoʻohana ʻana i ka laser pulsed a i ʻole ka laser nalu hoʻomau. I mea e pale ai i ka hōʻino ʻia ʻana o ka wafer ma muli o ka hoʻomehana kūloko nui o ka laser, hoʻohana ʻia ka wai hoʻoluʻu e hoʻoluʻu a pale i ka wafer mai ka hōʻino wela. I ka manawa like, hiki i ka wai hoʻoluʻu ke wehe pono i nā ʻāpana i hana ʻia i ka wā o ke kaʻina hana ʻoki, pale i ka haumia a hōʻoia i ka maikaʻi o ka ʻoki ʻana.
ʻO ka ʻoki ʻike ʻole ʻia e ka laser
Hiki ke hoʻopili ʻia ka laser e hoʻoili i ka wela i loko o ke kino nui o ka wafer, kahi ʻano i kapa ʻia ʻo "invisible laser cutting". No kēia ʻano hana, hana ka wela mai ka laser i nā hakahaka ma nā ala kākau. A laila hoʻokō kēia mau wahi i hoʻonāwaliwali ʻia i kahi hopena komo like ma ka haki ʻana i ka wā e kīkoʻo ʻia ai ka wafer.
▲Kaʻina hana nui o ka ʻoki ʻike ʻole ʻia ʻana o ka laser
ʻO ke kaʻina hana ʻoki ʻike ʻole ʻia he kaʻina hana laser omo kūloko, ma mua o ka ablation laser kahi e omo ʻia ai ka laser ma luna o ka ʻili. Me ka ʻoki ʻike ʻole ʻia, hoʻohana ʻia ka ikehu kukuna laser me kahi nalu e semi-transparent i ka mea substrate wafer. Ua māhele ʻia ke kaʻina hana i ʻelua mau ʻanuʻu nui, ʻo kekahi he kaʻina hana laser, a ʻo kekahi he kaʻina hana hoʻokaʻawale mechanical.
▲Hoʻokumu ke kukuna laser i kahi perforation ma lalo o ka ʻili wafer, a ʻaʻole i hoʻopilikia ʻia nā ʻaoʻao mua a me hope | Pūnaewele kumu kiʻi
I ka hana mua, i ka nānā ʻana o ke kukuna laser i ka wafer, e kālele ana ke kukuna laser ma kahi kikoʻī i loko o ka wafer, e hana ana i kahi kiko māwae i loko. Hoʻokumu ka ikehu kukuna i kahi moʻo o nā māwae i loko, ʻaʻole i hoʻolōʻihi ʻia ma o ka mānoanoa holoʻokoʻa o ka wafer a hiki i nā ʻili luna a me lalo.
▲Hoʻohālikelike o nā wafers silicon mānoanoa 100μm i ʻoki ʻia e ke ʻano pahi a me ke ʻano ʻoki ʻike ʻole ʻia o ka laser | Pūnaewele kumu kiʻi
Ma ka lua o ka hana, ua hoʻonui kino ʻia ka lipine ʻāpana ma lalo o ka wafer, kahi e hoʻoulu ai i ke kaumaha tensile i loko o nā māwae i loko o ka wafer, i hoʻoulu ʻia i ke kaʻina hana laser i ka hana mua. ʻO kēia kaumaha ke kumu o nā māwae e hoʻolōʻihi pololei i nā ʻili o luna a me lalo o ka wafer, a laila e hoʻokaʻawale i ka wafer i loko o nā ʻāpana ma kēia mau wahi ʻoki. I ka ʻoki ʻike ʻole ʻia, hoʻohana pinepine ʻia ka hapalua ʻoki a i ʻole ka hapalua ʻoki ʻaoʻao lalo e hoʻomaʻalahi i ka hoʻokaʻawale ʻana o nā wafer i loko o nā ʻāpana a i ʻole nā ʻāpana.
Nā pōmaikaʻi nui o ka ʻoki ʻana i ka laser ʻike ʻole ʻia ma mua o ka ablation laser:
• ʻAʻole pono ka mea hoʻomaʻalili
• ʻAʻohe ʻōpala i hana ʻia
• ʻAʻohe wahi i hoʻopilikia ʻia e ka wela e hiki ke hōʻino i nā kaapuni koʻikoʻi
ʻOki ʻana i ka plasma
ʻO ka ʻoki plasma (ʻike ʻia hoʻi ʻo plasma etching a i ʻole dry etching) he ʻenehana ʻoki wafer holomua e hoʻohana ana i ka reactive ion etching (RIE) a i ʻole deep reactive ion etching (DRIE) e hoʻokaʻawale i nā ʻāpana pākahi mai nā wafers semiconductor. Hoʻokō ka ʻenehana i ka ʻoki ʻana ma ka wehe ʻana i nā mea ma nā laina ʻoki i hoʻoholo mua ʻia me ka hoʻohana ʻana i ka plasma.
I ke kaʻina hana ʻoki plasma, ua waiho ʻia ka wafer semiconductor i loko o kahi keʻena vacuum, ua hoʻokomo ʻia kahi hui kinoea reactive i kāohi ʻia i loko o ke keʻena, a ua hoʻopili ʻia kahi kahua uila e hana i kahi plasma e loaʻa ana kahi kiʻekiʻe o nā ion reactive a me nā radicals. Hoʻopili kēia mau ʻano reactive me ka mea wafer a wehe koho i ka mea wafer ma ka laina scribe ma o ka hui pū ʻana o ka hopena kemika a me ka sputtering kino.
ʻO ka pōmaikaʻi nui o ka ʻoki ʻana i ka plasma, ʻo ia ka hoʻemi ʻana i ke kaumaha mechanical ma ka wafer a me ka chip a me ka hōʻemi ʻana i ka pōʻino hiki ke hana ʻia e ka pili kino. Eia nō naʻe, ʻoi aku ka paʻakikī o kēia kaʻina hana a me ka hoʻopau manawa ma mua o nā ʻano hana ʻē aʻe, ʻoiai ke hana nei me nā wafers mānoanoa a i ʻole nā mea me ke kū'ē kiʻekiʻe o ke etching, no laila ua kaupalena ʻia kona hoʻohana ʻana i ka hana nui.
▲Pūnaewele kumu kiʻi
I ka hana ʻana o ka semiconductor, pono e koho ʻia ke ʻano ʻoki wafer ma muli o nā kumu he nui, me nā waiwai o ka mea wafer, ka nui a me ke ʻano o ka chip, ka pololei a me ka pololei e pono ai, a me ke kumukūʻai hana holoʻokoʻa a me ka pono.
Ka manawa hoʻouna: Sep-20-2024