I-Waferukusika kungenye yezixhumanisi ezibalulekile ekukhiqizweni kwe-power semiconductor. Lesi sinyathelo senzelwe ukuhlukanisa ngokunembile amasekethe noma ama-chips ahlanganisiwe ngamanye kuma-wafer e-semiconductor.
Isihluthulelo se-i-waferukusika ukukwazi ukuhlukanisa ama-chip ngamanye ngenkathi kuqinisekiswa ukuthi izakhiwo ezibucayi kanye nezifunda zifakwe ngaphakathii-waferazonakaliswa. Impumelelo noma ukwehluleka kwenqubo yokusika akuthinti nje kuphela ikhwalithi yokuhlukaniswa kanye nokukhiqiza kwe-chip, kodwa futhi kuhlobene ngqo nokusebenza kahle kwayo yonke inqubo yokukhiqiza.
▲Izinhlobo ezintathu ezivamile zokusika i-wafer | Umthombo: KLA CHINA
Njengamanje, okuvamilei-waferIzinqubo zokusika zihlukaniswe kanje:
Ukusika ama-blade: izindleko eziphansi, ngokuvamile ezisetshenziselwa ukujiyaama-wafer
Ukusika nge-laser: izindleko eziphezulu, ngokuvamile ezisetshenziselwa ama-wafer anobukhulu obungaphezu kwama-30μm
Ukusikwa kwe-plasma: izindleko eziphezulu, imikhawulo eminingi, ngokuvamile esetshenziselwa ama-wafer anobukhulu obungaphansi kwama-30μm
Ukusika i-blade ngomshini
Ukusika ama-blade kuyinqubo yokusika eceleni komugqa we-scribe ngediski yokugaya ejikelezayo ngesivinini esikhulu (i-blade). I-blade ivame ukwenziwa ngezinto zedayimane ezithambile noma eziqinile kakhulu, ezifanele ukunqunywa noma ukugxushwa kuma-wafer e-silicon. Kodwa-ke, njengendlela yokusika ngomshini, ukusika ama-blade kuncike ekususweni kwezinto ezibonakalayo, okungaholela kalula ekuqhekekeni noma ekuqhekekeni komphetho we-chip, ngaleyo ndlela kuthinte ikhwalithi yomkhiqizo kanye nokunciphisa isivuno.
Ikhwalithi yomkhiqizo wokugcina okhiqizwa yinqubo yokusaha ngomshini ithintwa yimingcele eminingi, okuhlanganisa isivinini sokusika, ukujiya kwensingo, ububanzi bensingo, kanye nesivinini sokujikeleza kwensingo.
Ukusika okugcwele kuyindlela eyisisekelo yokusika ama-blade, esika ngokuphelele umsebenzi ngokusika ube yinto eqondile (njenge-tape yokusika).
▲ Ukusika okuphelele kwe-blade yomshini | Inethiwekhi yomthombo wesithombe
Ukusikwa okuyingxenye kuyindlela yokucubungula ekhiqiza umsele ngokusika phakathi nendawo yokusebenza. Ngokwenza inqubo yokugoba ngokuqhubekayo, kungakhiqizwa ikamu kanye nezindawo ezimise okwenaliti.
▲ Ukusikwa kwe-blade yomshini | Inethiwekhi yomthombo wesithombe
Ukusika kabili kuyindlela yokucubungula esebenzisa isaha lokusika kabili elinezipini ezimbili ukwenza ukusika okugcwele noma okuyingxenye emigqeni emibili yokukhiqiza ngesikhathi esisodwa. Isaha lokusika kabili linezimbazo ezimbili ze-spindle. Umthamo ophezulu ungatholakala ngale nqubo.
▲ Ukusika kabili kwe-blade yomshini | Inethiwekhi yomthombo wesithombe
I-Step cut isebenzisa isaha lokusika eliphindwe kabili elinezipini ezimbili ukwenza ukusika okugcwele nokuyingxenye ngezigaba ezimbili. Sebenzisa ama-blade alungiselelwe ukusika ungqimba lwezintambo ebusweni be-wafer kanye nama-blade alungiselelwe i-silicon single crystal esele ukuze kufezwe ukucutshungulwa kwekhwalithi ephezulu.
▲ Ukusika i-blade ngomshini - ukusika izinyathelo | Inethiwekhi yomthombo wesithombe
Ukusika i-bevel kuyindlela yokucubungula esebenzisa i-blade enohlangothi oluyi-V onqenqemeni olusikiwe uhhafu ukusika i-wafer ngezigaba ezimbili ngesikhathi senqubo yokusika isinyathelo. Inqubo yokuhlikihla yenziwa ngesikhathi senqubo yokusika. Ngakho-ke, amandla aphezulu okubumba kanye nokucubungula kwekhwalithi ephezulu kungafinyelelwa.
▲ Ukusika i-blade ngomshini - ukusika i-bevel | Inethiwekhi yomthombo wesithombe
Ukusika nge-laser
Ukusika nge-laser ubuchwepheshe bokusika i-wafer obungaxhumani obusebenzisa umsebe we-laser ogxile ukuhlukanisa ama-chips ngamanye kuma-wafer e-semiconductor. Umsebe we-laser onamandla aphezulu ugxile ebusweni be-wafer futhi ukhipha noma ususe izinto ezihambisana nomugqa wokusika onqunyiwe ngezinqubo zokususa noma zokubola kokushisa.
▲ Umdwebo wokusika nge-laser | Umthombo wesithombe: KLA CHINA
Izinhlobo zama-laser ezisetshenziswa kabanzi njengamanje zifaka phakathi ama-ultraviolet lasers, ama-infrared lasers, kanye nama-femtosecond lasers. Phakathi kwazo, ama-ultraviolet lasers avame ukusetshenziselwa ukukhipha ukushisa okuqondile ngenxa yamandla awo aphezulu e-photon, futhi indawo ethintekile ukushisa incane kakhulu, okunganciphisa ngempumelelo ingozi yokulimala kokushisa kwe-wafer kanye nama-chips ayo azungezile. Ama-infrared lasers afaneleka kangcono kuma-wafer amakhulu ngoba angangena ngokujulile entweni. Ama-Femtosecond lasers athola ukususwa kwezinto ngokunemba okuphezulu nangokusebenza kahle ngokudluliselwa kokushisa okuncane kakhulu ngama-pulse okukhanya amafushane kakhulu.
Ukusikwa kwe-laser kunezinzuzo ezibalulekile kunokusika kwe-blade yendabuko. Okokuqala, njengenqubo engathintani, ukusikwa kwe-laser akudingi ingcindezi yomzimba ku-wafer, kunciphisa izinkinga zokuqhekeka nokuqhekeka ezivame ukwenziwa ekusikweni kwemishini. Lesi sici senza ukusikwa kwe-laser kufaneleke kakhulu ekucubunguleni ama-wafer abuthakathaka noma amancane kakhulu, ikakhulukazi lawo anezakhiwo eziyinkimbinkimbi noma izici ezincane.
▲ Umdwebo wokusika nge-laser | Inethiwekhi yomthombo wesithombe
Ngaphezu kwalokho, ukunemba okuphezulu nokunemba kokusika nge-laser kwenza ikwazi ukugxila umsebe we-laser kusayizi omncane kakhulu webala, isekele amaphethini okusika ayinkimbinkimbi, futhi ifinyelele ukuhlukaniswa kwesikhala esincane phakathi kwama-chip. Lesi sici sibaluleke kakhulu kumadivayisi e-semiconductor athuthukile anosayizi onciphayo.
Kodwa-ke, ukusika nge-laser nakho kunemikhawulo ethile. Uma kuqhathaniswa nokusika ama-blade, kuhamba kancane futhi kuyabiza kakhulu, ikakhulukazi ekukhiqizweni okukhulu. Ngaphezu kwalokho, ukukhetha uhlobo lwe-laser olufanele kanye nokwenza ngcono amapharamitha ukuqinisekisa ukususwa kwezinto okuphumelelayo kanye nendawo encane ethinteke ekushiseni kungaba yinselele ezintweni ezithile kanye nobukhulu.
Ukusika kwe-laser ablation
Ngesikhathi sokusika i-laser ablation, umsebe we-laser ugxile ngqo endaweni ethile ebusweni be-wafer, futhi amandla e-laser aqondiswa ngokwephethini yokusika enqunyiwe, kancane kancane usika i-wafer uye phansi. Kuye ngezidingo zokusika, lo msebenzi wenziwa kusetshenziswa i-laser evunguzayo noma i-laser yamagagasi aqhubekayo. Ukuze kuvinjelwe umonakalo we-wafer ngenxa yokushisa okweqile kwendawo kwe-laser, amanzi okupholisa asetshenziselwa ukupholisa nokuvikela i-wafer ekulimaleni kokushisa. Ngesikhathi esifanayo, amanzi okupholisa angasusa ngempumelelo izinhlayiya ezikhiqizwe ngesikhathi senqubo yokusika, avimbele ukungcola futhi aqinisekise ikhwalithi yokusika.
Ukusika okungabonakali kwe-laser
I-laser ingagxila futhi ekudluliseleni ukushisa emzimbeni oyinhloko we-wafer, indlela ebizwa ngokuthi “ukusika kwe-laser okungabonakali”. Kule ndlela, ukushisa okuvela ku-laser kudala izikhala emizileni yokubhala. Lezi zindawo ezibuthakathaka zibe sezithola umphumela ofanayo wokungena ngokuphuka lapho i-wafer yelulwa.
▲Inqubo eyinhloko yokusika okungabonakali kwe-laser
Inqubo yokusika engabonakali iyinqubo yelaser yokumunca yangaphakathi, kunokuba kube yi-laser ablation lapho i-laser imuncwa khona ebusweni. Ngokusika okungabonakali, kusetshenziswa amandla e-laser beam anobude obungacacile kangako ezintweni ze-wafer substrate. Inqubo ihlukaniswe ngezinyathelo ezimbili eziyinhloko, enye inqubo esekelwe ku-laser, kanti enye inqubo yokuhlukanisa ngomshini.
▲Umsebe we-laser udala ukubhoboka ngaphansi kobuso be-wafer, futhi izinhlangothi zangaphambili nangemuva azithinteki | Inethiwekhi yomthombo wesithombe
Esinyathelweni sokuqala, njengoba ugongolo lwe-laser luskena i-wafer, ugongolo lwe-laser lugxila endaweni ethile ngaphakathi kwe-wafer, lwakha indawo yokuqhekeka ngaphakathi. Amandla ogongolo abangela uchungechunge lwemifantu ngaphakathi, engakadluleli kulo lonke ubukhulu be-wafer iye phezulu naphansi.
▲Ukuqhathaniswa kwama-wafer e-silicon angu-100μm obukhulu anqunywe ngendlela ye-blade kanye nendlela yokusika engabonakali ye-laser | Inethiwekhi yomthombo wesithombe
Esigabeni sesibili, i-chip tape engezansi kwe-wafer inwetshwa ngokomzimba, okubangela ukucindezeleka kokuqina emifantwini engaphakathi kwe-wafer, okubangelwa inqubo ye-laser esigabeni sokuqala. Lokhu kucindezeleka kubangela ukuthi imifantu idlulele phezulu nangaphansi kwe-wafer, bese ihlukanisa i-wafer ibe ama-chips kulezi zindawo zokusika. Ekusikeni okungabonakali, ukusika okuyingxenye noma ukusika okuyingxenye ohlangothini olungezansi kuvame ukusetshenziselwa ukwenza kube lula ukuhlukaniswa kwama-wafer abe ama-chips noma ama-chips.
Izinzuzo ezibalulekile zokusika nge-laser engabonakali ngaphezu kokususwa kwe-laser:
• Akukho sithako sokupholisa esidingekayo
• Akukho mfucumfucu ekhiqizwayo
• Azikho izindawo ezithintekile ekushiseni ezingalimaza izifunda ezibucayi
Ukusika nge-plasma
Ukusika nge-plasma (okwaziwa nangokuthi i-plasma etching noma i-dry etching) ubuchwepheshe obuthuthukisiwe bokusika nge-wafer obusebenzisa i-reactive ion etching (RIE) noma i-deep reactive ion etching (DRIE) ukuhlukanisa ama-chips ngamanye kuma-semiconductor wafers. Ubuchwepheshe bufinyelela ekusikeni ngokususa izinto ngamakhemikhali emigqeni yokusika enqunyiwe kusetshenziswa i-plasma.
Ngesikhathi senqubo yokusika i-plasma, i-semiconductor wafer ifakwa ekamelweni le-vacuum, ingxube yegesi ephendulayo elawulwayo ifakwa ekamelweni, bese kusetshenziswa insimu kagesi ukukhiqiza i-plasma equkethe ukugcwala okuphezulu kwama-ion aphendulayo nama-radical. Lezi zinhlobo eziphendulayo ziyasebenzisana nezinto ze-wafer futhi zisusa ngokukhetha izinto ze-wafer emgqeni we-scribe ngokuhlanganiswa kokusabela kwamakhemikhali kanye nokuchitheka ngokomzimba.
Inzuzo eyinhloko yokusikwa kwe-plasma ukuthi kunciphisa ukucindezeleka komshini ku-wafer kanye ne-chip futhi kunciphisa umonakalo ongaba khona obangelwa ukuthintana ngokomzimba. Kodwa-ke, le nqubo iyinkimbinkimbi kakhulu futhi idla isikhathi kunezinye izindlela, ikakhulukazi lapho kubhekene nama-wafer amakhulu noma izinto ezinokumelana okuphezulu kokugqwala, ngakho-ke ukusetshenziswa kwayo ekukhiqizweni okukhulu kunqunyelwe.
▲Inethiwekhi yomthombo wesithombe
Ekukhiqizweni kwe-semiconductor, indlela yokusika i-wafer idinga ukukhethwa ngokusekelwe ezicini eziningi, kufaka phakathi izakhiwo zezinto ze-wafer, usayizi we-chip kanye ne-geometry, ukunemba okudingekayo kanye nokunemba, kanye nezindleko zokukhiqiza kanye nokusebenza kahle.
Isikhathi sokuthunyelwe: Septhemba-20-2024