WaferiGukata ni imwe mu mibanire y'ingenzi mu gukora semiconductor zikoresha ingufu. Iyi ntambwe yagenewe gutandukanya neza imiyoboro cyangwa uduce duto tw’amashanyarazi dukozwe mu buryo bunyuranye n’udupira twa semiconductor.
Urufunguzo rwaagace gatogukata ni ukugira ngo ubashe gutandukanya uduce duto duto mu gihe ugenzura ko imiterere n'insinga byoroshye byinjira muagace gatontabwo byangiritse. Intsinzi cyangwa gutsindwa kw'uburyo bwo gukata ntibigira ingaruka gusa ku bwiza bw'itandukaniro n'umusaruro wa chip, ahubwo binafitanye isano itaziguye n'imikorere myiza y'uburyo bwose bwo kuyikora.
▲Amoko atatu asanzwe yo gukata wafer | Inkomoko: KLA CHINA
Muri iki gihe, gahunda rusangeagace gatoinzira zo gukata zigabanyijemo ibice bikurikira:
Gukata icyuma: bihendutse, akenshi bikoreshwa mu gukata icyuma kininiuduce duto twa wafer
Gukata hakoreshejwe laser: bihendutse, akenshi bikoreshwa ku dupfunyika dufite ubunini burenze 30μm
Gukata plasma: bihendutse, hari imipaka myinshi, akenshi bikoreshwa ku dupfunyika dufite ubunini buri munsi ya 30μm
Gukata icyuma cya mekanike
Gukata icyuma ni uburyo bwo gukata ku murongo w'icyuma ukoresheje icyuma gisya kizenguruka vuba cyane (icyuma cy'icyuma). Iki cyuma gisanzwe gikozwe mu bikoresho bya diyama bikozwe mu buryo bworoshye cyane cyangwa buto cyane, bukwiriye gukata cyangwa gusya ku dupira twa silikoni. Ariko, nk'uburyo bwo gukata icyuma hakoreshejwe ikoranabuhanga, gukata icyuma gishingiye ku gukuraho ibikoresho bifatika, bishobora gutuma impande z'icyuma zicika cyangwa zicika, bityo bigira ingaruka ku bwiza bw'umusaruro no kugabanya umusaruro.
Ubwiza bw'umusaruro wa nyuma ukorwa n'uburyo bwo gukata hakoreshejwe imashini buterwa n'ibipimo byinshi, birimo umuvuduko wo gukata, ubunini bw'icyuma, umurambararo w'icyuma, n'umuvuduko wo kuzunguruka kw'icyuma.
Gukata burundu ni bwo buryo bw'ibanze bwo gukata icyuma, buca burundu igikoresho cyo gukoraho ukoresheje ibikoresho bihamye (nk'agapira ko gukata).
▲ Uburyo bwo gukata icyuma cyose | Isoko ry'ishusho
Gukata igice kimwe ni uburyo bwo gutunganya butanga umuyoboro uca hagati mu gice cy'umurimo. Mu gukomeza gukora igikorwa cyo gukata, hashobora gukorwa ingingo z'igishishwa n'iz'urushinge.
▲ Uburyo bwo gukata icyuma cya mekanike - igice cyo gukata | Ishusho y'aho uherereye
Gukata kabiri ni uburyo bwo gutunganya bukoresha urukero rubiri rufite imigozi ibiri kugira ngo rukore urukero rwuzuye cyangwa igice ku mirongo ibiri ikorwa icyarimwe. Urukero rubiri rufite imigozi ibiri. Uburyo bwo gukora urukero bushobora kugerwaho binyuze muri ubu buryo.
▲ Uburyo bwo gukata icyuma cya mekanike - gukata kabiri | Umuyoboro w'ishusho
Gukata intambwe bikoresha urukero rubiri rufite imigozi ibiri kugira ngo bicike burundu n'igice mu byiciro bibiri. Koresha ibyuma byabugenewe mu gukata urwego rw'insinga ku buso bwa wafer n'ibyuma byabugenewe mu gukata kristale imwe ya silikoni isigaye kugira ngo bikoreshwe neza.
▲ Gukata icyuma gikozwe mu mashini - gutema intambwe | Umuyoboro w'ishusho
Gukata Bevel ni uburyo bwo gutunganya bukoresha icyuma gifite impande isa na V ku mpande ziciwe igice kugira ngo gikate wafer mu byiciro bibiri mu gihe cyo gukata intambwe. Uburyo bwo gukata bukorwa mu gihe cyo gukata. Kubwibyo, imbaraga nyinshi z'ibihumyo n'uburyo bwo gutunganya neza bishobora kugerwaho.
▲ Gukata icyuma gikozwe mu mashini - gukata imigozi | Ishusho y'aho uherereye
Gukata hakoreshejwe laser
Gukata hakoreshejwe laser ni ikoranabuhanga rikoresha laser ritanyuranya n’ibikoresho bya wafer, rikoresha laser ikoresheje icyuma gitandukanya uduce duto n’udupira twa semiconductor. Umupira wa laser ukoresha ingufu nyinshi uba ureba hejuru y’icyuma gifata wafer, ugahindura umwuka cyangwa ugakuraho ibintu ku murongo wagenwe mbere binyuze mu nzira zo gukata cyangwa gushonga kw’ubushyuhe.
▲ Ishusho yo gukata hakoreshejwe laser | Ifoto ikomoka kuri: KLA CHINA
Ubwoko bwa laser zikoreshwa cyane muri iki gihe burimo laser za ultraviolet, laser za infrared, na laser za femtosecond. Muri zo, laser za ultraviolet zikunze gukoreshwa mu gukuraho ubukonje neza bitewe n'ingufu zazo nyinshi za photon, kandi agace kagizweho ingaruka n'ubushyuhe ni gato cyane, bishobora kugabanya neza ibyago byo kwangirika k'ubushyuhe kuri wafer n'udupira tuyikikije. Laser za infrared zikwiriye cyane wafer nini kuko zishobora kwinjira cyane mu bikoresho. Laser za Femtosecond zigira uburyo bwo gukuraho ibikoresho neza kandi neza hamwe no kohereza ubushyuhe mu buryo buciriritse binyuze mu miyoboro y'urumuri rugufi cyane.
Gukata hakoreshejwe laser bifite inyungu zikomeye ugereranyije no gukata icyuma gisanzwe. Ubwa mbere, nk'uburyo bwo kudakora ku kintu kimwe, gukata hakoreshejwe laser ntibisaba imbaraga zifatika kuri wafer, bigabanya ibibazo byo gucikamo ibice no kwangirika bikunze kugaragara mu gukata hakoreshejwe ikoranabuhanga. Iyi miterere ituma gukata hakoreshejwe laser biba byiza cyane mu gutunganya wafer zoroshye cyangwa zoroshye cyane, cyane cyane izifite imiterere igoye cyangwa nziza.
▲ Ishusho yo gukata hakoreshejwe laser | Urusobe rw'amashusho
Byongeye kandi, ubuhanga bwo gukata hakoreshejwe laser butuma ibasha kwerekeza umuyoboro wa laser ku mwanya muto cyane, igashyigikira imiterere igoye yo gukata, kandi igatandukanya intera ntoya hagati y’udupira. Iyi miterere ni ingenzi cyane ku bikoresho bya semiconductor bigezweho bifite ingano igabanuka.
Ariko, guca imashini hakoreshejwe laser nabyo bifite imbogamizi zimwe na zimwe. Ugereranyije no guca imashini hakoreshejwe icyuma, biratinda kandi birahenze cyane, cyane cyane mu gukora ibikoresho byinshi. Byongeye kandi, guhitamo ubwoko bwiza bwa laser no kunoza ibipimo kugira ngo ibikoresho bikureho neza kandi bigabanye ubushyuhe bishobora kugorana ku bikoresho bimwe na bimwe n'ubunini.
Gukata hakoreshejwe laser
Mu gihe cyo gukata hakoreshejwe laser, umuyoboro wa laser uba wibanda neza ahantu runaka ku buso bwa wafer, kandi ingufu za laser ziyoborwa hakurikijwe imiterere yo gukata yagenwe, buhoro buhoro ukata wafer ugana hasi. Bitewe n'ibisabwa mu gukata, iki gikorwa gikorwa hakoreshejwe laser ikoresha pulsed cyangwa laser ikoresha continuous wave. Kugira ngo hirindwe kwangirika kwa wafer bitewe no gushyuha cyane kwa laser, amazi akonjesha akoreshwa mu gukonjesha no kurinda wafer kwangirika k'ubushyuhe. Muri icyo gihe, amazi akonjesha ashobora kandi gukuraho neza uduce twakozwe mu gihe cyo gukata, gukumira kwanduza no kwemeza ko gukata ari byiza.
Gukata bitagaragara hakoreshejwe laser
Laser ishobora kandi kwibandwaho kugira ngo yohereze ubushyuhe mu gice cy’ingenzi cya wafer, uburyo bwitwa "gukata laser itagaragara". Kuri ubu buryo, ubushyuhe buva kuri laser butera icyuho mu mirongo y’aho wafer iherereye. Utu duce twangiritse tugira ingaruka nk’izo zo kwinjira iyo wafer irambuwe.
▲Inzira nyamukuru yo gukata bitagaragara hakoreshejwe laser
Uburyo bwo gukata butagaragara ni uburyo bwo gufata lazeri imbere mu mubiri, aho kuba uburyo bwo gufata lazeri aho lazeri yinjizwa hejuru y’ubutaka. Mu buryo bwo gukata butagaragara, ingufu z’imirasire ya lazeri zifite uburebure bw’umurambararo bugaragarira mu bikoresho bya wafer substrate zirakoreshwa. Uburyo bugabanyijemo intambwe ebyiri z’ingenzi, imwe ni uburyo bushingiye kuri lazeri, indi ni uburyo bwo gutandukanya ibintu hakoreshejwe ikoranabuhanga.
▲Umuringoti wa laser utera icyuho munsi y'ubuso bwa wafer, kandi impande z'imbere n'inyuma ntizibangamirwa | Umuyoboro w'ishusho
Mu ntambwe ya mbere, iyo umurimbo wa laser urimo gupima umurimbo, umurimbo wa laser wibanda ku kintu runaka kiri muri wafer, bigatuma imbere hacikamo uduce duto. Ingufu z'umurimbo zituma imbere havuka uduce duto, tutaragera mu bunini bwose bwa wafer kugera hejuru no hasi.
▲Igereranya rya wafers za silikoni zifite ubugari bwa 100μm zaciwe hakoreshejwe uburyo bw'icyuma n'uburyo bwo gukata butagaragara bwa laser | Ishusho y'urusobe rw'amashusho
Mu ntambwe ya kabiri, agace k'imashini kari hasi ya wafer karagutse cyane, bigatera stress yo gukurura mu myenge iri imbere muri wafer, iterwa na laser mu ntambwe ya mbere. Iyi stress ituma myenge igera hejuru no hepfo ya wafer, hanyuma igatandukanya wafer mo uduce duto dukurikije utu duce duto. Mu gukata bitagaragara, gukata igice cyangwa igice cyo hepfo bikunze gukoreshwa kugira ngo byorohereze gutandukanya wafer mu duce duto cyangwa uduce duto.
Ibyiza by'ingenzi byo gukata laser itagaragara kuruta gukata laser:
• Nta gikoresho gikonjesha gikenewe
• Nta myanda yakozwe
• Nta bice byagizweho ingaruka n'ubushyuhe bishobora kwangiza imiyoboro y'amashanyarazi
Gukata plasma
Gukata plasma (bizwi kandi nka plasma etching cyangwa dry etching) ni ikoranabuhanga rigezweho ryo gukata wafer rikoresha reactive ion etching (RIE) cyangwa deep reactive ion etching (DRIE) kugira ngo ritandukanye uduce duto n'udupira duto. Iri koranabuhanga rigera ku gukata hakoreshejwe imiti ikuraho ibintu ku mirongo yagenwe mbere y’uko bicibwa hakoreshejwe plasma.
Mu gihe cyo gukata plasma, wafer ya semiconductor ishyirwa mu cyumba cy’ubushyuhe, imvange ya gaze igenzurwa ishyirwa mu cyumba, hanyuma hagakoreshwa amashanyarazi kugira ngo hakorwe plasma irimo ions nyinshi zikora na radicals. Izi nyoni zikora zikorana n’ibikoresho bya wafer kandi zigakuramo ibikoresho bya wafer ku murongo wa scribe binyuze mu guhuza uburyo bwo gukora imiti no gusohora amazi mu buryo bw’umubiri.
Akamaro gakomeye ko gukata plasma ni uko bigabanya umuvuduko wa mashini kuri wafer na chip kandi bigabanya kwangirika guterwa no gukoraho. Ariko, iyi nzira iragoye kandi itwara igihe kinini kurusha ubundi buryo, cyane cyane iyo ikoreshwa ku dupira tunini cyangwa ibikoresho bifite ubushobozi bwo gukata cyane, bityo ikoreshwa ryabyo mu gukora ibintu byinshi ni rike.
▲Umuyoboro w'inkomoko y'amashusho
Mu nganda zikora ibikoresho bya semiconductor, uburyo bwo gukata wafer bugomba gutoranywa hashingiwe ku bintu byinshi, birimo imiterere y'ibikoresho bya wafer, ingano ya chip na geometry, ubwiza n'ubunyangamugayo bikenewe, hamwe n'ikiguzi rusange cy'umusaruro n'imikorere myiza.
Igihe cyo kohereza: 20 Nzeri 2024