Emva kweiseramikhiI-substrate iyasikwa ize yenziwe, umphezulu wayo kufuneka wenziwe ngesinyithi, uze emva koko ipateni yomphezulu yenziwe ngokudluliselwa komfanekiso ukuze kufezekiswe ukusebenza konxibelelwano lombane lwe-substrate yeseramikhi. Ukwenziwa kwesinyithi kumphezulu linyathelo elibalulekileyo ekwenziweni kwe-substrate zeseramikhi. Oku kungenxa yokuba amandla okumanzisa esinyithi kwiindawo zeseramikhi kumaqondo obushushu aphezulu amisela amandla okubopha phakathi kweesinyithi kunye neeseramikhi. Amandla okubopha amahle sisiqinisekiso esibalulekileyo sokuzinza kokusebenza kokupakisha kwe-LED. Okwangoku, iindlela eziqhelekileyo zokwenziwa kwesinyithi kwiindawo zeseramikhi zinokuhlulwahlulwa zibe ziintlobo ezahlukeneyo, kubandakanya iindlela zokutshisa kunye (HTCC kunye ne-LTCC), indlela yefilimu etyebileyo (TFC), indlela yokubeka ithusi ngqo (DBC), indlela yokubeka i-aluminium ngqo (DBA), kunye nendlela yefilimu encinci (DPC).
Indlela yokudubulana ngokubambisana (HTCC/LTCC)
Kukho iintlobo ezimbini zeendlela zokudubula kunye: enye kukudubula kunye nobushushu obuphezulu (HTCC), kwaye enye kukudubula kunye nobushushu obuphantsi (LTCC). Ukuhamba kwenkqubo kwazo zombini kuyafana. Ukuhamba kwenkqubo ephambili yemveliso kubandakanya ukulungiswa kweslurry, ukuphosa kunye nokuvelisa imicu, ukomisa imizimba eluhlaza, ukubhoboza ngemingxunya, ukuprinta kwesikrini kunye nemingxuma yokugcwalisa, iisekethe zokuprinta isikrini, ukubekwa kunye nokusila, kunye nokusika kokugqibela kunye nezinye iinkqubo emva konyango. Umgubo we-alumina uxutywa nee-organic binders ukwenza i-slurry, kwaye emva koko i-slurry icutshungulwa ibe ngamaphepha nge-scraper. Emva koko, umzimba oluhlaza we-ceramic wenziwa [10]. Emva koko, ngokweemfuno zoyilo, ngemingxuma icutshungulwa emzimbeni oluhlaza kwaye izaliswe ngumgubo wesinyithi. Umphezulu womzimba oluhlaza ugqunywe ngepateni yomgca ngetekhnoloji yokuprinta isikrini. Ekugqibeleni, imizimba eluhlaza yomaleko ngamnye iyahlanganiswa kwaye icinezelwe kunye, kwaye emva koko i-sluntered kwaye yenziwe kwi-co-fire oven. Nangona iinkqubo zeendlela ezimbini zokudubula kunye zifana phantse, amaqondo obushushu okutshisa ahluka kakhulu. Ubushushu bokusebenzisana kwi-HTCC buyi-1300 ukuya kwi-1600℃, ngelixa ubushushu bokusebenzisana kwi-LTCC buyi-850 ukuya kwi-900℃. Isizathu esiphambili salo mahluko kukuba i-LTCC sintering slurry iqulethe izinto zeglasi ezinokunciphisa ubushushu bokusebenzisana, ezingekhoyo kwi-HTCC co-fired slurry. Nangona izinto zeglasi zinokunciphisa ubushushu bokusebenzisana, zikhokelela ekunciphiseni okukhulu kobushushu be-substrate.
Ifilimu Eqinileyo yeCeramic (TFC)
Indlela yefilimu etyebileyo ibhekisa kwinkqubo yokuvelisa apho intlama eqhubayo igqunywa ngokuthe ngqo kwi-substrate yeseramikhi ngokuprinta kwesikrini, ize emva koko umaleko wesinyithi unamathele ngokuqinileyo kwi-substrate yeseramikhi ngokusebenzisa ukuthungwa kobushushu obuphezulu. Ukukhethwa kwe-slurry ye-conductor yefilimu etyebileyo yinto ebalulekileyo ekumiseleni inkqubo yefilimu etyebileyo. Yenziwe yinqanaba elisebenzayo (oko kukuthi, umgubo wesinyithi onobukhulu besuntswana obungaphantsi kwe-2μm), isigaba se-binder (i-binder), kunye ne-organic carrier. Iipowder zesinyithi eziqhelekileyo ziquka i-Au, Pt, Au/Pt, Au/Pd, Ag, Ag/Pt, Ag/Pd, Cu, Ni, Al kunye ne-W, phakathi kwazo i-Ag, Ag/Pd kunye ne-Cu slurries zezona zixhaphakileyo. I-binder ngokubanzi zizinto zeglasi, i-oxide yesinyithi okanye umxube wazo zombini. Umsebenzi wayo kukudibanisa i-ceramic kunye nesinyithi kunye nokumisela ukunamathela kwe-slurry yefilimu etyebileyo kwi-ceramic esisiseko. Yisitshixo sokuveliswa kwe-slurry yefilimu etyebileyo. Umsebenzi oyintloko wesithwali sezinto eziphilayo kukusasaza isigaba esisebenzayo kunye nesigaba sokubopha, ngelixa kugcinwa i-viscosity ethile ye-slurry yefilimu etyebileyo ukulungiselela ukuprintwa kwesikrini okulandelayo. Kuya kuncipha kancinci kancinci ngexesha lenkqubo yokusila.
Ubhedu oluQokelelweyo (i-DBC)
I-DBC yindlela yokwenza isinyithi yokubopha i-copper foil kwiindawo ze-ceramic (ikakhulu i-Al2O3 kunye ne-AlN). Yinkqubo entsha ephuhliswe ngokunyuka kwetekhnoloji yokupakisha ye-chip on Board (COB). Umgaqo osisiseko kukungenisa izinto ze-oxygen phakathi kwe-Cu kunye ne-ceramics, uze wenze i-Cu/O eutectic liquid phase kwi-1065 ukuya kwi-1083℃. Eli nqanaba emva koko liphendula nge-ceramic matrix kunye ne-copper foil ukuvelisa i-CuAlO2 okanye i-Cu(AlO2)2, kwaye phantsi kwesenzo sesigaba esiphakathi, i-copper foil ibotshelelwe kwi-matrix. Ekubeni i-Al N ikwi-non-oxide ceramics, isitshixo sombala we-copper kumphezulu wayo sisekubumbeni umaleko wenguqu ye-Al2O3 kumphezulu wayo, kunye nokufezekisa ukubopha okusebenzayo phakathi kwe-copper foil kunye ne-base ceramic phantsi kwesenzo somaleko wenguqu.
I-Aluminiyam eQokelelweyo (i-DAB)
Indlela yokugquma i-aluminium ngokuthe ngqo isebenzisa ithuba lokumanzisa kakuhle kwe-aluminium kwiiseramikhi ezikwimeko yolwelo ukuze kufezekiswe ukubophana kwezi zimbini. Xa ubushushu bunyuka ngaphezu kwama-660℃, i-aluminium eqinileyo iyanyibilika. Emva kokuba i-aluminium engamanzi imanzise umphezulu weseramikhi, njengoko ubushushu buhla, ii-nuclei zekristale ezibonelelwa yi-aluminium kumphezulu weseramikhi ziyanyibilika kwaye zikhule. Xa zipholile kubushushu begumbi, ukudibana kwezi zimbini kuyafezekiswa. Ngenxa yokusabela okuphezulu kwe-aluminium, ithambekele ekutshiseni okuphezulu ukuze yenze ifilimu ye-Al2O3 ekhoyo kumphezulu we-aluminium engamanzi, nto leyo enciphisa kakhulu ukumanzisa kolwelo lwe-aluminium kumphezulu weseramikhi kwaye yenza kube nzima ukufezekisa ukubophana. Ke ngoko, kufuneka isuswe ngaphambi kokuba ibophene okanye ukubopha kufuneka kwenziwe phantsi kweemeko ezingena-oxygen. UPeng Rong et al. [23,27] bamkele indlela yokuphosa i-graphite mold ukuze basasaze i-aluminium enyibilikisiweyo ecocekileyo kumphezulu we-Al2O3 substrate kunye ne-AlN substrate phantsi koxinzelelo. Ngenxa yokungabikho kokuguquguquka kwefilimu ye-Al2O3, yahlala kwindawo yokubumba. Emva kokupholisa, kufunyenwe i-substrate ye-DAB ebotshelelwe kakuhle.
Ubhedu oluQokelelweyo ngokuthe ngqo (i-DPC)
Indlela yefilimu encinci yinkqubo esebenzisa kakhulu ukufunxwa komphunga ngokwasemzimbeni (njengokufuma nge-vacuum, ukutshiza nge-magnetron, njl.njl.) kunye nezinye iindlela zokwenza umaleko wesinyithi phezu komphezulu weseramikhi, ize emva koko isebenzise ukugquma, ukukrola kunye neminye imisebenzi ukwenza umaleko wesekethe yesinyithi. Phakathi kwazo, ukufunxwa komphunga ngokwasemzimbeni yeyona nkqubo ixhaphakileyo yokwenza ifilimu encinci.
Ixesha leposi: Julayi-16-2025