Mushure mezvedongoSubstrate inopisirwa uye inogadzirwa, pamusoro payo panofanira kunge paine simbi, uye patani yekumusoro inogadzirwa kuburikidza nekutamiswa kwemufananidzo kuti uwane mashandiro emagetsi esubstrate yeceramic. Surface metallization idanho rakakosha mukugadzirwa kwe ceramic substrates. Izvi zvinodaro nekuti kugona kwesimbi kunyorovesa pamusoro pe ceramic pakupisa kwakanyanya kunosarudza simba rekubatanidza pakati pesimbi ne ceramics. Simba rakanaka rekubatanidza ivimbiso yakakosha yekugadzikana kwekushanda kwe LED packaging. Parizvino, nzira dzakajairika dze metallization pamusoro pe ceramic dzinogona kupatsanurwa kuita mafomu akasiyana-siyana, kusanganisira nzira dzekupisa pamwe chete (HTCC ne LTCC), thick film method (TFC), direct copper deposition method (DBC), direct aluminum deposition method (DBA), uye thin film method (DPC).
Nzira yekubatanidza pfuti (HTCC/LTCC)
Kune mhando mbiri dzenzira dzekubatanidza: imwe ndeyekubatanidza kupisa kwakanyanya (HTCC), uye imwe ndeyekubatanidza kupisa kwakaderera (LTCC). Kuyerera kwemaitiro ese ari maviri kwakafanana. Kuyerera kukuru kwemaitiro ekugadzira kunosanganisira kugadzirira slurry, kukanda nekugadzira mitsetse, kuomesa miviri yakasvibirira, kuboora maburi, kudhinda screen nekuzadza maburi, macircuits ekudhinda screen, kuisa layering ne sintering, uye kucheka kwekupedzisira nedzimwe nzira dzekurapa. Upfu hweAlumina hunosanganiswa ne organic binders kuti hugadzire slurry, uye ipapo slurry inogadziriswa kuita mapepa ne scraper. Mushure mekuomesa, muviri we ceramic green unoumbwa [10]. Zvadaro, zvichienderana nezvinodiwa zvekugadzira, kuburikidza nemaburi anogadziriswa pamuviri wegirini uye anozadzwa nesimbi powder. Pamusoro pemuviri wegirini unoputirwa ne line pattern ne screen printing technology. Pakupedzisira, miviri yakasvibirira ye layer yega yega inounganidzwa uye inomanikidzwa pamwe chete, uye yozopisirwa uye inoumbwa mu co-fire oven. Kunyangwe maitiro e nzira mbiri dzekubatanidza ari akafanana, tembiricha yekupisa inosiyana zvikuru. Tembiricha yekubatanidza HTCC iri pakati pe1300 ne1600℃, nepo tembiricha yekubatanidza LTCC iri pakati pe850 ne900℃. Chikonzero chikuru chemusiyano uyu ndechekuti LTCC sintering slurry ine zvinhu zvegirazi zvinogona kuderedza tembiricha yekubatanidza, izvo zvisiri mu HTCC co-fired slurry. Kunyangwe zvinhu zvegirazi zvichigona kuderedza tembiricha yekubatanidza slurry, zvinotungamira kudzikira kukuru mukupisa kwe substrate.
Firimu Gobvu reCeramic (TFC)
Nzira yefirimu gobvu inoreva maitiro ekugadzira apo conductive paste inoputirwa zvakananga pa ceramic substrate nekudhinda kwechidzitiro, uye ipapo simbi inonamirwa zvakasimba ku ceramic substrate kuburikidza nekupisa kwakanyanya. Kusarudzwa kwe thick-film conductor slurry chinhu chakakosha pakusarudza maitiro e thick-film. Inoumbwa ne functional phase (kureva, simbi powder ine saizi ye particle isingasviki 2μm), binder phase (binder), uye organic carrier. Common metal powders anosanganisira Au, Pt, Au/Pt, Au/Pd, Ag, Ag/Pt, Ag/Pd, Cu, Ni, Al uye W, pakati payo Ag, Ag/Pd uye Cu slurrys ndiwo anonyanya kuwanikwa. Binder inowanzova girazi, metal oxide kana musanganiswa wezvose. Basa rayo nderekubatanidza ceramic nesimbi uye kuona kunamira kwe thick film slurry kune base ceramic. Ndiyo kiyi yekugadzira thick film slurry. Basa guru remuchina wekugadzira zvinhu zvakasikwa nderekuparadzira chikamu chinoshanda uye chikamu chinosunga, ukuwo uchichengetedza kusimba kwechikamu chakakora chefirimu kuti ugadzirire kudhindwa kwechidzitiro kunotevera. Zvishoma nezvishoma zvichachinja-chinja panguva yekupiswa kwechinhu.
Mhangura Yakabatana Yakananga (DBC)
DBC inzira yesimbi yekubatanidza foil yemhangura pamusoro pezvinhu zveceramic (kunyanya Al2O3 neAlN). Iyi inzira itsva yakagadzirwa nekuwedzera kwetekinoroji yekurongedza chip on Board (COB). Nheyo huru ndeyekuisa zvinhu zveokisijeni pakati peCu neceramics, uye wobva wagadzira Cu/O eutectic liquid phase pa1065 kusvika 1083℃. Chikamu ichi chinosangana ne ceramic matrix ne copper foil kugadzira CuAlO2 kana Cu(AlO2)2, uye pasi pekushanda kwechikamu chepakati, copper foil inosungirirwa kune matrix. Sezvo Al N iri ye non-oxide ceramics, kiyi ye coating yemhangura pamusoro payo iri mukuumba Al2O3 transition layer pamusoro payo, uye kuwana kubatana kunobudirira pakati pe copper foil ne base ceramic pasi pekushanda kwe transition layer.
Aruminiyamu Yakabatana (DAB)
Nzira yekuputira aruminiyamu zvakananga inoshandisa mukana wekunyorova kwearuminiyamu kuceramics dziri mumvura kuti ikwanise kubatana kweaviri. Kana tembiricha yakwira pamusoro pe660℃, aruminiyamu yakasimba inonyungudika. Mushure mekunge aruminiyamu yemvura yanyorovesa pamusoro peceramic, sezvo tembiricha yadzikira, makristaro anopiwa nearuminiyamu ari pamusoro peceramic anonamira uye anokura. Kana yatonhodzwa kusvika patembiricha yemukamuri, musanganiswa weaviri unowanikwa. Nekuda kwekuita kwakanyanya kwearuminiyamu, inowanzo oxidation pakupisa kwakanyanya kuti igadzire firimu reAl2O3 riri pamusoro pealuminium liquid, zvichideredza zvakanyanya kunyorova kwearuminiyamu pamusoro peceramic uye zvichiita kuti kubatana kuve kwakaoma kuwana. Naizvozvo, inofanira kubviswa isati yabatanidzwa kana kuti kubatana kunofanira kuitwa mumamiriro ezvinhu asina oxygen. Peng Rong et al. [23,27] vakatora nzira ye graphite mold die-casting kuparadzira pure mold aluminium pamusoro peAl2O3 substrate neAlN substrate pasi pekumanikidzwa. Nekuda kwekushaikwa kwekunyorova kwefirimu reAl2O3, yakaramba iri mumold cavity. Mushure mekutonhodza, substrate yeDAB yakabatana zvakanaka yakawanikwa.
Mhangura Yakanyatsoiswa Mapepa (DPC)
Nzira yefirimu rakatetepa inzira inonyanya kushandisa physical vapor deposition (yakadai se vacuum evaporation, magnetron sputtering, nezvimwewo) nedzimwe nzira dzekugadzira simbi pamusoro peceramics, uye wobva washandisa masking, etching nedzimwe nzira dzekugadzira simbi circuit layer. Pakati padzo, physical vapor deposition ndiyo nzira inonyanya kushandiswa yekugadzira thin film.
Nguva yekutumira: Chikunguru-16-2025