Tom qab lubcov khoom siv av nplaumThaum lub substrate raug sintered thiab tsim, nws qhov chaw yuav tsum tau metallized, thiab tom qab ntawd tus qauv nto yog ua los ntawm kev hloov duab kom ua tiav kev sib txuas hluav taws xob ntawm cov ceramic substrate. Kev metallization ntawm qhov chaw yog ib kauj ruam tseem ceeb hauv kev tsim cov ceramic substrates. Qhov no yog vim tias lub peev xwm ntub ntawm cov hlau rau cov ceramic nto ntawm qhov kub siab txiav txim siab lub zog sib txuas ntawm cov hlau thiab ceramics. Lub zog sib txuas zoo yog qhov tseem ceeb rau kev ruaj khov ntawm kev ua tau zoo ntawm LED ntim. Tam sim no, cov txheej txheem metallization feem ntau ntawm cov ceramic nto tuaj yeem faib ua ntau hom, suav nrog cov txheej txheem co-burning (HTCC thiab LTCC), txoj kev zaj duab xis tuab (TFC), txoj kev tso tooj liab ncaj qha (DBC), txoj kev tso txhuas ncaj qha (DBA), thiab txoj kev zaj duab xis nyias (DPC).
Txoj Kev Sib Koom Tes Tua Hluav Taws (HTCC/LTCC)
Muaj ob hom kev sib koom ua ke: ib qho yog kev sib koom ua ke kub siab (HTCC), thiab lwm qhov yog kev sib koom ua ke kub qis (LTCC). Cov txheej txheem ntawm ob qho tib si yeej zoo ib yam. Cov txheej txheem tsim khoom tseem ceeb suav nrog kev npaj slurry, casting thiab tsim cov strips, ziab cov khoom ntsuab, drilling los ntawm cov qhov, kev luam ntawv thiab kev sau cov qhov, kev luam ntawv, txheej thiab sintering, thiab kev txiav kawg thiab lwm yam txheej txheem tom qab kho. Hmoov alumina yog sib xyaw nrog cov organic binders los ua slurry, thiab tom qab ntawd cov slurry raug ua tiav rau hauv cov ntawv nrog lub scraper. Tom qab ziab, lub cev ntsuab ceramic raug tsim [10]. Tom qab ntawd, raws li qhov yuav tsum tau tsim, cov qhov raug ua tiav rau ntawm lub cev ntsuab thiab puv nrog hmoov hlau. Qhov chaw ntawm lub cev ntsuab yog coated nrog ib kab qauv los ntawm kev siv tshuab luam ntawv. Thaum kawg, lub cev ntsuab ntawm txhua txheej raug stacked thiab nias ua ke, thiab tom qab ntawd sintered thiab tsim nyob rau hauv lub cub tawg sib koom ua ke. Txawm hais tias cov txheej txheem ntawm ob txoj kev sib koom ua ke zoo ib yam, qhov kub sintering sib txawv heev. Qhov kub sib koom ua ke rau HTCC yog 1300 txog 1600 ℃, thaum qhov kub sintering rau LTCC yog 850 txog 900 ℃. Qhov laj thawj tseem ceeb rau qhov sib txawv no yog qhov tseeb tias LTCC sintering slurry muaj cov khoom siv iav uas tuaj yeem txo qhov kub sintering, uas tsis muaj nyob hauv HTCC co-fired slurry. Txawm hais tias cov khoom siv iav tuaj yeem txo qhov kub sintering, lawv ua rau muaj kev txo qis ntawm cov thermal conductivity ntawm lub substrate.
Cov Yeeb Yaj Kiab Tuab (TFC)
Txoj kev ua zaj duab xis tuab yog hais txog cov txheej txheem tsim khoom uas cov tshuaj nplaum conductive tau coated ncaj qha rau ntawm cov khoom siv ceramic los ntawm kev luam ntawv, thiab tom qab ntawd cov txheej hlau tau lo rau cov khoom siv ceramic los ntawm kev kub siab sintering. Kev xaiv cov slurry conductor zaj duab xis tuab yog qhov tseem ceeb hauv kev txiav txim siab cov txheej txheem zaj duab xis tuab. Nws yog tsim los ntawm ib theem ua haujlwm (piv txwv li, hmoov hlau nrog qhov loj me me dua 2μm), theem binder (binder), thiab tus neeg nqa khoom organic. Cov hmoov hlau feem ntau suav nrog Au, Pt, Au/Pt, Au/Pd, Ag, Ag/Pt, Ag/Pd, Cu, Ni, Al thiab W, ntawm cov Ag, Ag/Pd thiab Cu slurries yog qhov feem ntau. Cov binder feem ntau yog cov khoom siv iav, hlau oxide lossis sib xyaw ntawm ob qho tib si. Nws lub luag haujlwm yog txuas cov ceramic thiab cov hlau thiab txiav txim siab qhov lo ntawm cov slurry zaj duab xis tuab rau lub hauv paus ceramic. Nws yog qhov tseem ceeb rau kev tsim cov slurry zaj duab xis tuab. Lub luag haujlwm tseem ceeb ntawm cov organic carrier yog los faib cov theem ua haujlwm thiab cov theem binder, thaum tswj hwm qee qhov viscosity ntawm cov zaj duab xis tuab slurry los npaj rau kev luam ntawv tom ntej. Nws yuav maj mam volatilize thaum lub sijhawm sintering.
Tooj Liab Txuas Ncaj Qha (DBC)
DBC yog ib txoj kev metallization rau kev sib txuas cov ntawv ci tooj liab ntawm cov chaw ceramic (feem ntau yog Al2O3 thiab AlN). Nws yog ib qho txheej txheem tshiab tsim nrog kev nce ntawm cov thev naus laus zis ntim khoom chip on Board (COB). Lub hauv paus ntsiab lus yog los qhia cov ntsiab lus oxygen ntawm Cu thiab ceramics, thiab tom qab ntawd tsim cov kua Cu / O eutectic ntawm 1065 txog 1083 ℃. Theem no tom qab ntawd reacts nrog cov ceramic matrix thiab cov ntawv ci tooj liab los tsim CuAlO2 lossis Cu (AlO2) 2, thiab nyob rau hauv qhov kev ua ntawm theem nruab nrab, cov ntawv ci tooj liab tau sib txuas rau lub matrix. Txij li thaum Al N yog cov khoom tsis-oxide ceramics, qhov tseem ceeb rau cov txheej tooj liab ntawm nws qhov chaw nyob hauv kev tsim cov txheej hloov pauv Al2O3 ntawm nws qhov chaw, thiab ua tiav kev sib txuas zoo ntawm cov ntawv ci tooj liab thiab cov ceramic hauv qab kev ua ntawm cov txheej hloov pauv.
Kev Sib Txuas Ncaj Qha Aluminium (DAB)
Txoj kev txheej txhuas ncaj qha siv qhov zoo ntawm qhov ntub dej ntawm txhuas rau cov khoom siv ceramics hauv cov kua kom ua tiav qhov kev sib txuas ntawm ob qho. Thaum qhov kub nce siab tshaj 660 ℃, cov khoom txhuas khov kho ua kua. Tom qab cov kua txhuas ntub rau ntawm qhov chaw ceramic, thaum qhov kub poob qis, cov nuclei siv lead ua los ntawm cov txhuas ntawm qhov chaw ceramic crystallize thiab loj hlob. Thaum txias rau chav tsev kub, kev sib xyaw ua ke ntawm ob qho no tau ua tiav. Vim yog qhov ua haujlwm siab ntawm txhuas, nws yooj yim rau oxidation ntawm qhov kub siab los tsim cov zaj duab xis Al2O3 uas muaj nyob rau ntawm qhov chaw ntawm cov kua txhuas, txo qhov ntub dej ntawm cov kua txhuas ntawm qhov chaw ceramic thiab ua rau kev sib txuas nyuaj rau ua tiav. Yog li ntawd, nws yuav tsum tau tshem tawm ua ntej kev sib txuas lossis kev sib txuas yuav tsum tau ua nyob rau hauv cov xwm txheej tsis muaj oxygen. Peng Rong et al. [23,27] tau siv txoj kev ntawm graphite pwm tuag-casting los nthuav cov txhuas molten ntshiab ntawm qhov chaw ntawm Al2O3 substrate thiab AlN substrate nyob rau hauv siab. Vim yog qhov tsis muaj fluidity ntawm Al2O3 zaj duab xis, nws tseem nyob hauv qhov pwm qhov. Tom qab txias, tau txais ib qho DAB substrate zoo.
Tooj Liab Plated Ncaj Qha (DPC)
Txoj kev ua zaj duab xis nyias yog ib qho txheej txheem uas feem ntau siv cov khoom siv vapor deposition (xws li lub tshuab nqus tsev evaporation, magnetron sputtering, thiab lwm yam) thiab lwm yam txheej txheem los tsim ib txheej hlau ntawm qhov chaw ntawm ceramics, thiab tom qab ntawd siv masking, etching thiab lwm yam kev ua haujlwm los tsim ib txheej hlau circuit. Ntawm lawv, lub cev vapor deposition yog cov txheej txheem tsim zaj duab xis nyias feem ntau.
Lub sijhawm tshaj tawm: Lub Xya Hli-16-2025