Ngemva kwe-i-ceramicI-substrate iyashiswa futhi yakheke, ubuso bayo budinga ukwenziwa ngensimbi, bese iphethini yobuso yenziwa ngokudluliswa kwesithombe ukuze kufezwe ukusebenza kokuxhumeka kukagesi kwe-substrate ye-ceramic. Ukwenziwa ngensimbi ebusweni kuyisinyathelo esibalulekile ekwakhiweni kwe-substrate ye-ceramic. Lokhu kungenxa yokuthi ikhono lokumanzisa lezinsimbi ezindaweni ze-ceramic emazingeni okushisa aphezulu linquma amandla okubopha phakathi kwezinsimbi ne-ceramics. Amandla amahle okubopha ayisiqinisekiso esibalulekile sokuzinza kokusebenza kokupakisha kwe-LED. Njengamanje, izindlela ezivamile zokwenziwa ngensimbi ezindaweni ze-ceramic zingahlukaniswa cishe ngezindlela eziningana, kufaka phakathi izindlela zokushisa ngokubambisana (i-HTCC ne-LTCC), indlela yefilimu ejiyile (i-TFC), indlela yokufaka ithusi ngqo (i-DBC), indlela yokufaka i-aluminium ngqo (i-DBA), kanye nendlela yefilimu encane (i-DPC).
Indlela Yokudubulana Ngokubambisana (HTCC/LTCC)
Kunezinhlobo ezimbili zezindlela zokudubula ngokubambisana: enye iwukudubula ngokubambisana ngokushisa okuphezulu (HTCC), kanti enye iwukudubula ngokubambisana ngokushisa okuphansi (LTCC). Ukugeleza kwenqubo kokubili kuyafana ngokuyisisekelo. Ukugeleza kwenqubo yokukhiqiza okuyinhloko kufaka phakathi ukulungiswa kwe-slurry, ukuphonsa nokukhiqiza imichilo, ukomisa imizimba eluhlaza, ukubhoboza imigodi, ukuphrinta kwesikrini nokugcwalisa imigodi, izifunda zokuphrinta kwesikrini, ukubekwa kwezendlalelo nokusila, kanye nokusika kokugcina kanye nezinye izinqubo zangemva kokwelashwa. Impuphu ye-alumina ixutshwa nezihlanganisi eziphilayo ukuze kwakhiwe i-slurry, bese i-slurry icutshungulwa ibe amashidi nge-scraper. Ngemva kokomisa, kwakheka umzimba oluhlaza we-ceramic [10]. Ngemuva kwalokho, ngokwezidingo zomklamo, kucutshungulwa ngemigodi emzimbeni oluhlaza futhi kugcwaliswe ngempuphu yensimbi. Ubuso bomzimba oluhlaza bumbozwe ngephethini yomugqa ngobuchwepheshe bokuphrinta kwesikrini. Ekugcineni, imizimba eluhlaza yesendlalelo ngasinye ihlanganiswa futhi icindezelwe ndawonye, bese i-sintered futhi yenziwe esithandweni sokudubula ngokubambisana. Nakuba izinqubo zezindlela ezimbili zokudubula ngokubambisana zicishe zifane, amazinga okushisa okushisa ahlukahluka kakhulu. Izinga lokushisa lokuhlanganisa i-HTCC lingu-1300 kuya ku-1600℃, kanti izinga lokushisa lokuhlanganisa i-LTCC lingu-850 kuya ku-900℃. Isizathu esiyinhloko salo mehluko siseqinisweni lokuthi i-LTCC sintering slurry iqukethe izinto zeglasi ezinganciphisa izinga lokushisa lokuhlanganisa i-slurry, ezingekho ku-HTCC co-fired slurry. Nakuba izinto zeglasi zinganciphisa izinga lokushisa lokuhlanganisa i-slurry, ziholela ekunciphiseni okukhulu kokushisa kwe-substrate.
I-Thick Film Ceramic (TFC)
Indlela yefilimu ejiyile ibhekisela enkambisweni yokukhiqiza lapho i-conductive paste ifakwa khona ngqo kwi-ceramic substrate ngokunyathelisa kwesikrini, bese ungqimba lwensimbi lunamathela ngokuqinile kwi-ceramic substrate ngokusebenzisa ukushisa okuphezulu. Ukukhethwa kwe-thick-film conductor slurry kuyisici esibalulekile ekunqumeni inqubo yefilimu ejiyile. Yakhiwe yisigaba esisebenzayo (okungukuthi, impuphu yensimbi enosayizi wezinhlayiya ezingaphansi kuka-2μm), isigaba se-binder (binder), kanye nesithwali sezinto eziphilayo. Izimpuphu zensimbi ezivamile zifaka phakathi i-Au, Pt, Au/Pt, Au/Pd, Ag, Ag/Pt, Ag/Pd, Cu, Ni, Al kanye ne-W, phakathi kwazo i-Ag, Ag/Pd kanye ne-Cu slurries ezivame kakhulu. I-binder ngokuvamile iyinto yengilazi, i-metal oxide noma ingxube yakho kokubili. Umsebenzi wayo ukuxhuma i-ceramic kanye nensimbi nokunquma ukunamathela kwe-thick film slurry kwi-base ceramic. Kuyisihluthulelo sokukhiqizwa kwe-thick film slurry. Umsebenzi oyinhloko wesithwali sezinto eziphilayo ukusabalalisa isigaba esisebenzayo kanye nesigaba sokubopha, ngenkathi kugcinwa ukuthambekela okuthile kwe-slurry yefilimu ejiyile ukulungiselela ukuphrinta kwesikrini okulandelayo. Kuzoshintsha kancane kancane ngesikhathi senqubo yokuhlanza.
Ithusi Elihlanganisiwe Ngokuqondile (i-DBC)
I-DBC iyindlela yokwenza insimbi yokubopha i-foil yethusi ezindaweni ze-ceramic (ikakhulukazi i-Al2O3 kanye ne-AlN). Kuyinqubo entsha ethuthukiswe ngokukhuphuka kobuchwepheshe bokupakisha be-chip on Board (COB). Isimiso esiyisisekelo ukwethula izakhi ze-oxygen phakathi kwe-Cu ne-ceramics, bese kwakha isigaba se-Cu/O eutectic liquid ku-1065 kuya ku-1083℃. Lesi sigaba bese siphendula nge-ceramic matrix kanye ne-copper foil ukuze kukhiqizwe i-CuAlO2 noma i-Cu(AlO2)2, futhi ngaphansi kwesenzo sesigaba esiphakathi, i-copper foil ihlanganiswa ne-matrix. Njengoba i-Al N ingeyobumba obungewona i-oxide, isihluthulelo sokugqoka ithusi ebusweni bayo sisekwakheni ungqimba lokuguquka lwe-Al2O3 ebusweni bayo, kanye nokufeza ukubopha okuphumelelayo phakathi kwe-copper foil kanye ne-base ceramic ngaphansi kwesenzo sengqimba yokuguquka.
I-Aluminium Eqondile Ehlanganisiwe (i-DAB)
Indlela yokumboza i-aluminium eqondile isebenzisa ukumanzisa okuhle kwe-aluminium kuma-ceramics asesimweni soketshezi ukuze kufezwe ukubophana kwalawa amabili. Lapho izinga lokushisa likhuphuka ngaphezu kuka-660℃, i-aluminium eqinile iyancibilika. Ngemva kokuba i-aluminium ewuketshezi imanzise ubuso be-ceramic, njengoba izinga lokushisa lehla, ama-nuclei ekristalu anikezwa yi-aluminium ebusweni be-ceramic ayaqina futhi akhule. Uma epholile afinyelele ekushiseni kwegumbi, inhlanganisela yalawa amabili iyafinyelelwa. Ngenxa yokusabela okuphezulu kwe-aluminium, ithambekele ekushiseni okuphezulu ukuze yakhe ifilimu ye-Al2O3 ekhona ebusweni boketshezi lwe-aluminium, okunciphisa kakhulu ukumanzisa koketshezi lwe-aluminium ebusweni be-ceramic futhi kwenze kube nzima ukufeza ukubophana. Ngakho-ke, kumele kususwe ngaphambi kokuba ukubophana noma ukubopha kufanele kwenziwe ngaphansi kwezimo ezingenawo umoya-mpilo. UPeng Rong nabanye [23,27] bamukele indlela yokukhipha i-graphite mold die-casting ukuze basakaze i-aluminium encibilikisiwe emsulwa ebusweni be-substrate ye-Al2O3 kanye ne-substrate ye-AlN ngaphansi kwengcindezi. Ngenxa yokuntuleka kokugeleza kwefilimu ye-Al2O3, yahlala emgodini wesikhunta. Ngemva kokupholisa, kwatholakala i-substrate ye-DAB eboshwe kahle.
Ithusi Eliqoshwe Ngokuqondile (i-DPC)
Indlela yefilimu encane yinqubo esebenzisa kakhulu ukufakwa komusi ongokoqobo (njengokuhwamuka kwe-vacuum, ukusputtering kwe-magnetron, njll.) kanye namanye amasu ukwakha ungqimba lwensimbi phezu kobumba, bese kusetshenziswa ukufihla, ukuqopha kanye neminye imisebenzi ukwakha ungqimba lwesekethe yensimbi. Phakathi kwazo, ukufakwa komusi ongokoqobo kuyinqubo evame kakhulu yokukhiqiza ifilimu encane.
Isikhathi sokuthunyelwe: Julayi-16-2025