A chikwama cha mkateayenera kusintha zinthu zitatu kuti akhale semiconductor chip yeniyeni: choyamba, ingot yooneka ngati buloko imadulidwa kukhala ma wafer; mu njira yachiwiri, ma transistors amalembedwa kutsogolo kwa wafer kudzera mu njira yapitayi; pomaliza pake, kulongedza kumachitika, ndiko kuti, kudzera mu njira yodulira,chikwama cha mkateimakhala chip yonse ya semiconductor. Zikuoneka kuti njira yopakira ndi ya njira yobwerera m'mbuyo. Mu njira iyi, wafer idzadulidwa m'ma chip angapo a hexahedron. Njira iyi yopezera ma chips odziyimira pawokha imatchedwa "Singulation", ndipo njira yodula bolodi la wafer kukhala ma cuboid odziyimira pawokha imatchedwa "wafer cutting (Die Sawing)". Posachedwapa, ndi kusintha kwa kuphatikiza kwa semiconductor, makulidwe ama waferyayamba kuonda kwambiri, zomwe zimapangitsa kuti pakhale zovuta zambiri pa "singulation".
Kusintha kwa kugawa kwa wafer
Njira zoyendetsera kutsogolo ndi kumbuyo zasintha kudzera mu mgwirizano m'njira zosiyanasiyana: kusintha kwa njira zoyendetsera kumbuyo kumatha kudziwa kapangidwe ndi malo a tchipisi tating'onoting'ono ta hexahedron tolekanitsidwa ndi die pachikwama cha mkate, komanso kapangidwe ndi malo a ma pads (njira zolumikizira zamagetsi) pa wafer; m'malo mwake, kusintha kwa njira zoyambira kwasintha njira ndi njira yogwiritsira ntchitochikwama cha mkateKuchepetsa msana ndi "kufa kudula" mu njira yopangira kumbuyo. Chifukwa chake, mawonekedwe okhwima a phukusili adzakhala ndi zotsatira zabwino pa njira yopangira kumbuyo. Kuphatikiza apo, chiwerengero, njira ndi mtundu wa kudula zidzasinthanso malinga ndi kusintha kwa mawonekedwe a phukusi.
Kudula Magawo a Mlembi
Kale, "kuswa" pogwiritsa ntchito mphamvu zakunja inali njira yokhayo yodulira yomwe inkatha kugawanitsachikwama cha mkateKuika hexahedron mu ufa. Komabe, njira iyi ili ndi kuipa kwa kudula kapena kusweka m'mphepete mwa chip chaching'ono. Kuphatikiza apo, popeza ma burrs omwe ali pamwamba pa chitsulo sachotsedwa kwathunthu, pamwamba pake pamakhala pouma kwambiri.
Pofuna kuthetsa vutoli, njira yodulira ya "Kulemba" idayamba, kutanthauza kuti, pamwamba pa "kuswa" isanathe.chikwama cha mkateAmadulidwa pafupifupi theka la kuya kwake. “Kulemba,” monga momwe dzinalo likusonyezera, kumatanthauza kugwiritsa ntchito impeller kudula (kudula theka) mbali yakutsogolo ya wafer pasadakhale. Kale, ma wafer ambiri osakwana mainchesi 1.5 ankagwiritsa ntchito njira yodulira iyi poyamba “kudula” pakati pa tchipisi kenako “kuswa”.
Kudula Masamba kapena Kudula Masamba
Njira yodulira ya "Scribing" inayamba pang'onopang'ono kukhala njira yodulira ya "Blade dicing", yomwe ndi njira yodulira pogwiritsa ntchito tsamba kawiri kapena katatu motsatizana. Njira yodulira ya "Blade" ikhoza kubwezeretsa vuto la tchipisi tating'onoting'ono tomwe timatuluka "tikasweka" titatha "kulemba", ndipo imatha kuteteza tchipisi tating'onoting'ono panthawi ya "singulation". Kudula kwa "Blade" ndikosiyana ndi kudula kwa "dicing" kwakale, ndiko kuti, pambuyo pa kudula "tsamba", sikuswa "kuswa", koma kudulanso ndi tsamba. Chifukwa chake, imatchedwanso njira ya "step dicing".
Pofuna kuteteza wafer ku kuwonongeka kwakunja panthawi yodula, filimu idzayikidwa pa wafer pasadakhale kuti iwonetsetse kuti "ikusunthidwa" bwino. Panthawi yopukutira kumbuyo, filimuyo idzalumikizidwa kutsogolo kwa wafer. Koma m'malo mwake, podula "tsamba", filimuyo iyenera kulumikizidwa kumbuyo kwa wafer. Panthawi yopukutira die bonding (die bonding, kukonza tchipisi tolekanitsidwa pa PCB kapena chimango chokhazikika), filimuyo yolumikizidwa kumbuyo idzagwa yokha. Chifukwa cha kukangana kwakukulu panthawi yodula, madzi a DI ayenera kupopedwa mosalekeza kuchokera mbali zonse. Kuphatikiza apo, impeller iyenera kulumikizidwa ndi tinthu ta diamondi kuti zidutswazo zidulidwe bwino. Panthawiyi, kudula (kukhuthala kwa tsamba: m'lifupi mwa groove) kuyenera kukhala kofanana ndipo sikuyenera kupitirira m'lifupi mwa groove yodula.
Kwa nthawi yayitali, kudula kwakhala njira yodulira yomwe imagwiritsidwa ntchito kwambiri. Ubwino wake waukulu ndikuti imatha kudula ma wafer ambiri munthawi yochepa. Komabe, ngati liwiro lodyetsa la chidutswacho lawonjezeka kwambiri, kuthekera kwa chiplet edge peeling kudzawonjezeka. Chifukwa chake, kuchuluka kwa kuzungulira kwa impeller kuyenera kulamulidwa pafupifupi nthawi 30,000 pamphindi. Zitha kuwoneka kuti ukadaulo wa njira ya semiconductor nthawi zambiri ndi chinsinsi chomwe chimasonkhanitsidwa pang'onopang'ono panthawi yayitali yosonkhanitsa ndi kuyesa ndi zolakwika (mu gawo lotsatira la eutectic bonding, tikambirana za zomwe zili zokhudza kudula ndi DAF).
Kudula musanapule (DBG): ndondomeko yodulira yasintha njira
Pamene kudula tsamba kukuchitidwa pa wafer wa mainchesi 8 m'mimba mwake, palibe chifukwa chodera nkhawa ndi chiplet m'mphepete mwake kusweka kapena kusweka. Koma pamene kukula kwa wafer kumawonjezeka kufika pa mainchesi 21 ndipo makulidwe ake amakhala ochepa kwambiri, zochitika zosweka ndi kusweka zimayamba kuwonekeranso. Pofuna kuchepetsa kwambiri kukhudzidwa kwa thupi pa wafer panthawi yodula, njira ya DBG ya "kudula musanapukute" imalowa m'malo mwa njira yachikhalidwe yodulira. Mosiyana ndi njira yachikhalidwe yodulira "tsamba" yomwe imadula mosalekeza, DBG poyamba imachita kudula "tsamba", kenako pang'onopang'ono imachepetsera makulidwe a wafer mwa kupendeketsa mbali yakumbuyo mpaka chip itagawanika. Tinganene kuti DBG ndi njira yosinthidwa ya njira yakale yodulira "tsamba". Chifukwa imatha kuchepetsa kukhudzidwa kwa kudula kwachiwiri, njira ya DBG yatchuka mwachangu mu "ma phukusi a wafer-level".
Kudula kwa Laser
Njira yodulira ya wafer-level chip scale package (WLCSP) imagwiritsa ntchito kwambiri kudula kwa laser. Kudula kwa laser kumatha kuchepetsa zochitika monga kung'ambika ndi kusweka, motero kupeza ma chips abwino, koma makulidwe a wafer akapitirira 100μm, kupanga kudzachepa kwambiri. Chifukwa chake, imagwiritsidwa ntchito kwambiri pa ma wafers okhala ndi makulidwe osakwana 100μm (ochepa thupi). Kudula kwa laser kumadula silicon poika laser yamphamvu kwambiri pamzere wodulira wa wafer. Komabe, pogwiritsa ntchito njira yodulira ya laser yachikhalidwe (Conventional Laser), filimu yoteteza iyenera kuyikidwa pamwamba pa wafer pasadakhale. Chifukwa chotenthetsera kapena kuyatsa pamwamba pa wafer ndi laser, kulumikizana kumeneku kumapanga mizere pamwamba pa wafer, ndipo zidutswa za silicon zodulidwazo zidzamamatiranso pamwamba. Zitha kuwoneka kuti njira yachikhalidwe yodulira laser imadulanso mwachindunji pamwamba pa wafer, ndipo pankhaniyi, ndi yofanana ndi njira yodulira ya "tsamba".
Kudula Mobisa (SD) ndi njira yoyamba kudula mkati mwa wafer ndi mphamvu ya laser, kenako n’kuika mphamvu yakunja pa tepi yolumikizidwa kumbuyo kuti isweke, motero kulekanitsa chip. Pamene kupanikizika kuyikidwa pa tepi kumbuyo, wafer idzakwezedwa nthawi yomweyo mmwamba chifukwa cha kutambasula tepiyo, motero kulekanitsa chip. Ubwino wa SD kuposa njira yachikhalidwe yodulira laser ndi: choyamba, palibe zinyalala za silicon; chachiwiri, kerf (Kerf: m'lifupi mwa mzere wa scribe) ndi wopapatiza, kotero ma chips ambiri angapezeke. Kuphatikiza apo, vuto la kung’ambika ndi kusweka lidzachepetsedwa kwambiri pogwiritsa ntchito njira ya SD, yomwe ndi yofunika kwambiri pa khalidwe lonse la kudula. Chifukwa chake, njira ya SD ikhoza kukhala ukadaulo wotchuka kwambiri mtsogolo.
Kudula kwa Plasma
Kudula plasma ndi ukadaulo waposachedwa womwe umagwiritsa ntchito kudula plasma pogwiritsa ntchito njira yopangira (Fab). Kudula plasma kumagwiritsa ntchito zinthu za semi-gas m'malo mwa zakumwa, kotero kukhudza chilengedwe kumakhala kochepa. Ndipo njira yodulira wafer yonse nthawi imodzi imagwiritsidwa ntchito, kotero liwiro la "kudula" limakhala lachangu. Komabe, njira ya plasma imagwiritsa ntchito mpweya wa chemical reaction ngati zopangira, ndipo njira yodulira ndi yovuta kwambiri, kotero kuyenda kwake kumakhala kovuta. Koma poyerekeza ndi kudula "tsamba" ndi kudula kwa laser, kudula plasma sikuwononga pamwamba pa wafer, motero kumachepetsa kuchuluka kwa zolakwika ndikupeza ma chips ambiri.
Posachedwapa, popeza makulidwe a wafer achepetsedwa kufika pa 30μm, ndipo zinthu zambiri zamkuwa (Cu) kapena zochepa zamagetsi (Low-k) zimagwiritsidwa ntchito. Chifukwa chake, pofuna kupewa ma burrs (Burr), njira zodulira plasma nazonso zidzakondedwa. Zachidziwikire, ukadaulo wodulira plasma ukukulanso nthawi zonse. Ndikukhulupirira kuti posachedwa, tsiku lina sipadzakhala chifukwa chovala chigoba chapadera podula, chifukwa uwu ndi njira yayikulu yopangira kudula plasma.
Popeza makulidwe a ma wafer akhala akuchepetsedwa nthawi zonse kuchokera pa 100μm kufika pa 50μm kenako kufika pa 30μm, njira zodulira zopezera ma chips odziyimira pawokha zakhala zikusintha ndikukula kuchokera pa kudula "kusweka" ndi "tsamba" kupita ku kudula kwa laser ndi kudula kwa plasma. Ngakhale njira zodulira zomwe zikukulirakulira zawonjezera mtengo wopanga njira yodulira yokha, kumbali ina, pochepetsa kwambiri zinthu zosafunikira monga kung'amba ndi kusweka komwe kumachitika nthawi zambiri podula ma chips a semiconductor ndikuwonjezera chiwerengero cha ma chips omwe amapezeka pa wafer imodzi, mtengo wopanga wa chip imodzi wawonetsa kutsika. Zachidziwikire, kuwonjezeka kwa chiwerengero cha ma chips omwe amapezeka pa dera la wafer kukugwirizana kwambiri ndi kuchepa kwa m'lifupi mwa msewu wodula. Pogwiritsa ntchito kudula kwa plasma, pafupifupi ma chips 20% angapezeke poyerekeza ndi kugwiritsa ntchito njira yodulira ya "tsamba", yomwe ndi chifukwa chachikulu chomwe anthu amasankhira kudula kwa plasma. Ndi chitukuko ndi kusintha kwa ma wafers, mawonekedwe a ma chips ndi njira zopakira, njira zosiyanasiyana zodulira monga ukadaulo wopangira ma wafer ndi DBG zikuwonekeranso.
Nthawi yotumizira: Okutobala-10-2024