A i-waferkufanele adlule ezinguqukweni ezintathu ukuze abe yi-chip yangempela ye-semiconductor: okokuqala, i-ingot ebunjwe njengebhulokhi inqunywa ibe ama-wafer; enqubweni yesibili, ama-transistors aqoshwa ngaphambili kwe-wafer enqubweni yangaphambilini; ekugcineni, ukupakishwa kwenziwa, okungukuthi, ngenqubo yokusika,i-waferiba yi-chip ephelele ye-semiconductor. Kungabonakala ukuthi inqubo yokupakisha ingeyenqubo yangemuva. Kule nqubo, i-wafer izonqunywa ibe ama-chip amaningana e-hexahedron ngamanye. Le nqubo yokuthola ama-chip azimele ibizwa ngokuthi “i-Singulation”, kanti inqubo yokusika ibhodi le-wafer ibe ama-cuboid azimele ibizwa ngokuthi “i-wafer cutting (Die Sawing)”. Muva nje, ngokuthuthukiswa kokuhlanganiswa kwe-semiconductor, ukujiya kweama-waferisinciphile futhi inciphile, okubangela ubunzima obukhulu enkambisweni "yokubumbana".
Ukuvela kokusika i-wafer
Izinqubo zangaphambili kanye ne-back-end zithuthuke ngokusebenzisana ngezindlela ezahlukene: ukuvela kwezinqubo ze-back-end kunganquma isakhiwo kanye nendawo yama-chips amancane e-hexahedron ahlukaniswe ne-die e-i-wafer, kanye nesakhiwo kanye nendawo yama-pad (izindlela zokuxhuma kagesi) ku-wafer; ngokuphambene nalokho, ukuvela kwezinqubo zangaphambili kushintshe inqubo kanye nendlelai-waferukuncishiswa komhlane kanye "nokusika izingcezu ezifile" enkambisweni yokusika izingcezu ezingemuva. Ngakho-ke, ukubukeka okuyinkimbinkimbi kwephakeji kuzoba nomthelela omkhulu enkambisweni yokusika izingcezu ezingemuva. Ngaphezu kwalokho, inombolo, inqubo kanye nohlobo lokusika kuzoshintsha ngokufanele ngokuya ngoshintsho ekubukekeni kwephakeji.
Ukusika Ababhali
Ezinsukwini zokuqala, "ukuphula" ngokusebenzisa amandla angaphandle kwakuyiyona ndlela kuphela yokuhlukanisa eyayingahlukanisai-waferku-hexahedron dies. Kodwa-ke, le ndlela inezinkinga zokuqhekeka noma ukuqhekeka komphetho we-chip encane. Ngaphezu kwalokho, njengoba ama-burrs ebusweni bensimbi engasuswanga ngokuphelele, ubuso obusikiwe nabo bunzima kakhulu.
Ukuze kuxazululwe le nkinga, indlela yokusika ethi “Scribing” yasungulwa, okungukuthi, ngaphambi “kokuphula”, ubuso be-“i-waferkusikwa cishe kube yisigamu sokujula. Igama elithi “ukubhala”, njengoba lisho, libhekisela ekusebenziseni i-impeller ukuze kusahwe (kusikwe uhhafu) uhlangothi olungaphambili lwe-wafer kusengaphambili. Ezinsukwini zokuqala, ama-wafer amaningi angaphansi kwamasentimitha angu-1.2 ayesebenzisa le ndlela yokusika “yokusika” kuqala phakathi kwama-chips bese “ephuka”.
Ukusika Ama-Blade noma Ukusaha Ama-Blade
Indlela yokusika ethi “Scribing” yathuthuka kancane kancane yaba yindlela yokusika ethi “Blade dicing” (noma yokusaha), okuyindlela yokusika kusetshenziswa i-blade izikhathi ezimbili noma ezintathu zilandelana. Indlela yokusika ethi “Blade” ingenza isimangalo sokuthi ama-chips amancane aqhekezeka lapho “ephuka” ngemva “kokubhala”, futhi ingavikela ama-chips amancane ngesikhathi senqubo “yokugoba”. Ukusika “Blade” kuhlukile ekusikeni “kokugoba” kwangaphambilini, okungukuthi, ngemva kokusika “i-blade”, akusikho “ukuphula”, kodwa ukusika futhi nge-blade. Ngakho-ke, ibizwa nangokuthi “indlela yokusika isinyathelo”.
Ukuze kuvikelwe i-wafer ekulimaleni kwangaphandle ngesikhathi senqubo yokusika, ifilimu izofakwa ku-wafer kusengaphambili ukuqinisekisa ukuthi "i-singling" iphephile. Ngesikhathi senqubo "yokugaya ngemuva", ifilimu izonamathiselwa ngaphambili kwe-wafer. Kodwa ngokuphambene nalokho, ekusikeni "kwe-blade", ifilimu kufanele ifakwe ngemuva kwe-wafer. Ngesikhathi sokubopha i-die eutectic (ukubopha i-die, ukulungisa ama-chips ahlukanisiwe ku-PCB noma uhlaka oluqinile), ifilimu enamathiselwe ngemuva izowa ngokuzenzakalelayo. Ngenxa yokungqubuzana okukhulu ngesikhathi sokusika, amanzi e-DI kufanele afuthwe njalo kuzo zonke izinkomba. Ngaphezu kwalokho, i-impeller kufanele ifakwe izinhlayiya zedayimane ukuze izingcezu zikwazi ukunqunywa kangcono. Ngalesi sikhathi, ukusika (ubukhulu be-blade: ububanzi be-groove) kumele kufane futhi akumele kudlule ububanzi be-groove yokusika.
Sekuyisikhathi eside, ukusaha kube yindlela yokusika yendabuko esetshenziswa kakhulu. Inzuzo yayo enkulu ukuthi ingasika inani elikhulu lama-wafer ngesikhathi esifushane. Kodwa-ke, uma ijubane lokudla lesilayi likhuliswa kakhulu, amathuba okuqhekeka komphetho we-chiplet azokhula. Ngakho-ke, inani lokujikeleza kwe-impeller kufanele lilawulwe cishe izikhathi ezingu-30,000 ngomzuzu. Kungabonakala ukuthi ubuchwepheshe benqubo ye-semiconductor buvame ukuba yimfihlo eqoqwe kancane kancane phakathi nesikhathi eside sokuqongelela kanye nokuzama kanye nephutha (esigabeni esilandelayo mayelana nokubopha kwe-eutectic, sizoxoxa ngokuqukethwe mayelana nokusika kanye ne-DAF).
Ukusika ngaphambi kokugaya (DBG): ukulandelana kokusika kushintshe indlela
Uma ukusika ama-blade kwenziwa ku-wafer engu-8 intshi ububanzi, asikho isidingo sokukhathazeka ngokuqhekeka noma ukuqhekeka komphetho we-chiplet. Kodwa njengoba ububanzi be-wafer bukhula bube ngamasentimitha angu-21 futhi ukujiya kuba mncane kakhulu, izinto zokuqhekeka nokuqhekeka ziqala ukuvela futhi. Ukuze kuncishiswe kakhulu umthelela ongokwenyama ku-wafer ngesikhathi senqubo yokusika, indlela ye-DBG "yokusika ngaphambi kokugaya" ithatha indawo yochungechunge lokusika lwendabuko. Ngokungafani nendlela yendabuko "yokusika ama-blade" enquma njalo, i-DBG kuqala yenza ukusika "kwe-blade", bese inciphisa kancane kancane ukuqina kwe-wafer ngokuncishisa njalo uhlangothi lwangemuva kuze kube yilapho i-chip ihlukana. Kungashiwo ukuthi i-DBG inguqulo ethuthukisiwe yendlela yangaphambilini yokusika "i-blade". Ngenxa yokuthi inganciphisa umthelela wokunqunywa kwesibili, indlela ye-DBG iye yathandwa ngokushesha "ekupaketheni kwezinga le-wafer".
Ukusika nge-Laser
Inqubo ye-wafer-level chip scale package (WLCSP) isebenzisa kakhulu ukusika nge-laser. Ukusika nge-laser kunganciphisa izinto ezifana nokuqhekeka nokuqhekeka, ngaleyo ndlela kutholakale ama-chips asezingeni elingcono, kodwa uma ubukhulu be-wafer bungaphezu kuka-100μm, umkhiqizo uzoncipha kakhulu. Ngakho-ke, isetshenziswa kakhulu kuma-wafer anobukhulu obungaphansi kuka-100μm (obuncane kakhulu). Ukusika nge-laser kunciphisa i-silicon ngokusebenzisa i-laser enamandla aphezulu emgodini we-wafer's scribe. Kodwa-ke, uma usebenzisa indlela yokusika nge-laser evamile (i-Conventional Laser), ifilimu evikelayo kumele ifakwe ebusweni be-wafer kusengaphambili. Ngenxa yokuthi ukushisa noma ukukhanyisela ubuso be-wafer nge-laser, lokhu kuxhumana ngokomzimba kuzokhiqiza imifantu ebusweni be-wafer, futhi izingcezu ze-silicon ezisikiwe nazo zizonamathela ebusweni. Kungabonakala ukuthi indlela yokusika nge-laser yendabuko nayo inquma ngqo ubuso be-wafer, futhi kulokhu, ifana nendlela yokusika "i-blade".
I-Stealth Dicing (SD) iyindlela yokuqala yokusika ingaphakathi le-wafer ngamandla e-laser, bese usebenzisa ingcindezi yangaphandle etheyipini enamathiselwe ngemuva ukuze uyiphule, ngaleyo ndlela uhlukanise i-chip. Uma ingcindezi ifakwa etheyipini ngemuva, i-wafer izophakanyiswa ngokushesha ngenxa yokwelulwa kwetheyipi, ngaleyo ndlela ihlukanise i-chip. Izinzuzo ze-SD kunendlela yendabuko yokusika i-laser yilezi: okokuqala, akukho mfucumfucu ye-silicon; okwesibili, i-kerf (i-Kerf: ububanzi bomsele we-scribe) incane, ngakho-ke kungatholakala ama-chip amaningi. Ngaphezu kwalokho, into yokuqhekeka nokuqhekeka izoncishiswa kakhulu kusetshenziswa indlela ye-SD, okubalulekile kwikhwalithi iyonke yokusika. Ngakho-ke, indlela ye-SD cishe izoba ubuchwepheshe obuthandwa kakhulu esikhathini esizayo.
Ukusika nge-Plasma
Ukusika i-plasma ubuchwepheshe obusanda kuthuthukiswa obusebenzisa ukugoba kwe-plasma ukusika ngesikhathi senqubo yokukhiqiza (i-Fab). Ukusika i-plasma kusebenzisa izinto ezisebenzisa igesi encane esikhundleni soketshezi, ngakho-ke umthelela emvelweni mncane kakhulu. Futhi indlela yokusika i-wafer yonke ngesikhathi esisodwa iyasetshenziswa, ngakho-ke ijubane "lokusika" lishesha kakhulu. Kodwa-ke, indlela ye-plasma isebenzisa igesi yokusabela kwamakhemikhali njengezinto zokusetshenziswa, futhi inqubo yokugoba iyinkimbinkimbi kakhulu, ngakho-ke ukuhamba kwayo kwenqubo kunzima kakhulu. Kodwa uma kuqhathaniswa nokusika "i-blade" kanye nokusika nge-laser, ukusika i-plasma akubangeli umonakalo ebusweni be-wafer, ngaleyo ndlela kunciphisa izinga lokukhubazeka nokuthola ama-chips engeziwe.
Muva nje, njengoba ubukhulu be-wafer buncishisiwe baba ngu-30μm, futhi kusetshenziswa izinto eziningi zethusi (Cu) noma izinto ezihlala njalo ze-dielectric (Low-k). Ngakho-ke, ukuze kuvinjelwe ama-burrs (Burr), izindlela zokusika i-plasma nazo zizothandwa. Vele, ubuchwepheshe bokusika i-plasma buhlala buthuthuka. Ngikholwa ukuthi maduze nje, ngolunye usuku ngeke kube nesidingo sokugqoka imaski ekhethekile lapho usika, ngoba lokhu kuyindlela enkulu yokuthuthukiswa kokusika i-plasma.
Njengoba ubukhulu bama-wafer buncishisiwe njalo kusuka ku-100μm kuya ku-50μm bese kuba ngu-30μm, izindlela zokusika zokuthola ama-chips azimele nazo bezishintsha futhi zithuthuka kusukela ekusikeni “kokuphuka” kanye “ne-blade” kuya ekusikeni nge-laser kanye nokusika i-plasma. Nakuba izindlela zokusika ezikhula ngokushesha zikhuphule izindleko zokukhiqiza zenqubo yokusika ngokwayo, ngakolunye uhlangothi, ngokunciphisa kakhulu izinto ezingathandeki njengokuqhekeka nokuqhekeka okuvame ukwenzeka ekusikeni ama-chip e-semiconductor kanye nokwandisa inani lama-chips atholakala nge-wafer ngayinye, izindleko zokukhiqiza ze-chip eyodwa zibonise umkhuba wokwehla. Vele, ukwanda kwenani lama-chips atholakala ngeyunithi ngayinye ye-wafer kuhlobene kakhulu nokwehla kobubanzi bomgwaqo wokusika. Ukusebenzisa ukusika kwe-plasma, cishe ama-chips angu-20% angatholakala uma kuqhathaniswa nokusebenzisa indlela yokusika “i-blade”, okuyisizathu esikhulu esenza abantu bakhethe ukusika i-plasma. Ngokuthuthuka kanye nokushintsha kwama-wafer, ukubukeka kwama-chip kanye nezindlela zokupakisha, izinqubo ezahlukene zokusika ezifana nobuchwepheshe bokucubungula ama-wafer kanye ne-DBG nazo ziyavela.
Isikhathi sokuthunyelwe: Okthoba-10-2024