A chifukidziroanofanira kuchinja zvinhu zvitatu kuti ave semiconductor chip chaiyo: chekutanga, ingot yakaita sebhuroko inochekwa kuita mawafer; mukuita kwechipiri, ma transistors anonyorwa pamberi pewafer kuburikidza nekuita kwekare; pakupedzisira, kurongedza kunoitwa, ndiko kuti, kuburikidza nekuita kwekucheka,chifukidziroinova chip yakakwana ye semiconductor. Zvinogona kuonekwa kuti maitiro ekurongedza ndeemuitiro wekumashure. Mukuita uku, wafer ichachekwa kuita machipisi akasiyana-siyana ehexahedron. Maitiro aya ekuwana machipisi akazvimiririra anonzi "Singulation", uye maitiro ekucheka wafer board kuita ma cuboid akazvimiririra anonzi "wafer cutting (Die Sawing)". Munguva pfupi yapfuura, nekuvandudzwa kwekubatanidzwa kwe semiconductor, ukobvu hwemawaferyave kutetepa zvishoma nezvishoma, izvo zvinounza kuoma kukuru kune maitiro e "singulation".
Kushanduka kwekucheka kwewafer
Maitiro epamberi nepashure akashanduka kuburikidza nekudyidzana nenzira dzakasiyana-siyana: kushanduka kwemaitiro epashure kunogona kuona chimiro nenzvimbo yemachipisi madiki ehexahedron akaparadzaniswa nedhiri riri pachifukidziro, pamwe chete nemaumbirwo nenzvimbo yemapedhi (nzira dzekubatanidza magetsi) pawafer; pane zvinopesana, kushanduka kwemaitiro epamberi kwakachinja maitiro nenzira yechifukidzirokutetepa kwemusana uye "kufa kwekucheka" mukuita kwechikamu chekumashure. Nokudaro, chitarisiko chakanyanya kuoma chechikamu chichave nemhedzisiro huru pakuita kwechikamu chekumashure. Uyezve, nhamba, maitiro uye rudzi rwekucheka zvichachinjawo zvinoenderana nekuchinja kwechitarisiko chechikamu.
Kunyora Madhayi
Mumazuva ekutanga, "kuputsa" nekushandisa simba rekunze ndiyo chete nzira yekuchekerera yaigona kupatsanurachifukidziroKuisa simbi mu hexahedron inofa. Zvisinei, nzira iyi ine zvayakaipira pakutsemuka kana kutsemuka kwemucheto wechipunu chidiki. Pamusoro pezvo, sezvo maburi ari pamusoro pesimbi asina kubviswa zvachose, nzvimbo yakachekwa yacho inonetsawo.
Kuti dambudziko iri rigadziriswe, nzira yekucheka "Scribing" yakatanga kushandiswa, kureva kuti, pamusoro pe "kupwanya" usati watanga.chifukidziroinochekwa kusvika hafu yehudzamu. "Kunyora", sekureva kwezita, zvinoreva kushandisa impeller kucheka (kucheka hafu) divi repamberi rewafer pachine nguva. Kare, mawafer mazhinji ari pasi pemasendimita matanhatu aishandisa nzira iyi yekucheka kekutanga "kucheka" pakati pemachipisi uye "kupwanya".
Kucheka Nebanga kana Kucheka Nebanga
Nzira yekucheka "Scribing" yakazokura zvishoma nezvishoma ikava nzira yekucheka "Blade dicing" (kana kucheka), inova nzira yekucheka uchishandisa banga kaviri kana katatu zvakatevedzana. Nzira yekucheka "Blade" inogona kutsiva chiitiko chekuti machipisi madiki anobuda "pakupwanyika" mushure me "kunyora", uye inogona kudzivirira machipisi madiki panguva ye "singulation". Kucheka "Blade" kwakasiyana nekucheka "dicing" kwakapfuura, kureva kuti, mushure mekucheka "banga", haisi "kupwanyika", asi kucheka zvakare nebanga. Saka, inonziwo nzira ye "step dicing".
Kuti chivharo chisakuvadzwe nekunze panguva yekucheka, firimu rinoiswa pachivharo pachine nguva kuti chive nechokwadi chekuti "chinogovaniswa" zvakachengeteka. Munguva yekucheka "musana", firimu rinosungirirwa kumberi kwechivharo. Asi zvakasiyana, pakucheka "blade", firimu rinofanira kusungirirwa kuseri kwechivharo. Munguva yekubatanidza chivharo (die bonding, kugadzirisa machipisi akaparadzaniswa paPCB kana furemu yakagadziriswa), firimu rakasungirirwa kuseri richadonha roga. Nekuda kwekukweshana kwakanyanya panguva yekucheka, mvura yeDI inofanira kupfapfaidzwa nguva dzose kubva kumativi ese. Pamusoro pezvo, impeller inofanira kusungirirwa nezvidimbu zvedhaimani kuitira kuti zvidimbu zvigone kuchekwa zviri nani. Panguva ino, kucheka (blade thickness: groove width) kunofanirwa kunge kwakafanana uye hakufanirwe kudarika upamhi hwe dicing groove.
Kwenguva yakareba, kucheka kwave kuri nzira yekucheka inoshandiswa zvakanyanya. Chinhu chikuru chayo ndechekuti inogona kucheka mawafer akawanda munguva pfupi. Zvisinei, kana kumhanya kwekudya kwechidimbu kwakawedzerwa zvakanyanya, mukana wekubvisa chiplet edge uchawedzera. Nokudaro, huwandu hwekutenderera kweimpeller hunofanira kudzorwa kanenge ka30,000 paminiti. Zvinogona kuonekwa kuti tekinoroji ye semiconductor process inowanzova chakavanzika chinounganidzwa zvishoma nezvishoma kuburikidza nenguva refu yekuunganidza uye kuedza nekukanganisa (muchikamu chinotevera pamusoro pe eutectic bonding, tichakurukura zviri mukati nezvekucheka uye DAF).
Kucheka usati wakuya (DBG): nzira yekucheka yakachinja maitiro
Kana kucheka kwebanga kuchiitwa pawafer ine dhayamita ye 8-inch, hapana chikonzero chekunetseka nezvekubviswa kwemucheto wechiplet kana kutsemuka. Asi sezvo dhayamita yewafer ichiwedzera kusvika 21 inches uye ukobvu hwacho huchinyanya kutetepa, zvinhu zvekutsemuka nekutsemuka zvinotanga kuoneka zvakare. Kuti kuderedze zvakanyanya kukanganiswa kwemuviri pawafer panguva yekucheka, nzira yeDBG ye "kucheka usati wakuya" inotsiva nzira yekucheka yechinyakare. Kusiyana nenzira yekucheka ye "blade" yechinyakare inocheka nguva dzose, DBG inotanga yacheka "blade", uye yobva yatetepa zvishoma nezvishoma ukobvu hwewafer nekuramba ichitetepa divi rekumashure kusvika chip yatsemuka. Zvinogona kutaurwa kuti DBG ishanduro yakagadziridzwa yenzira yekare yekucheka "blade". Nekuti inogona kuderedza kukanganiswa kwekucheka kwechipiri, nzira yeDBG yakakurumidza kufarirwa mu "wafer-level packaging".
Kucheka neLaser
Maitiro ekucheka chipu chewafer-level chip (WLCSP) anonyanya kushandisa laser cutting. Laser cutting inogona kuderedza zvinhu zvakaita sekukwenya nekutsemuka, zvichiita kuti pave nemachipisi emhando yepamusoro, asi kana ukobvu hwewafer hwapfuura 100μm, kubereka kunodzikira zvikuru. Nokudaro, inonyanya kushandiswa pamawafer ane ukobvu husingasviki 100μm (hutete). Laser cutting inocheka silicon nekushandisa high-energy laser kune wafer's scribe groove. Zvisinei, kana uchishandisa conventional laser (Conventional Laser) cutting method, firimu rekudzivirira rinofanira kuiswa pamusoro pewafer pachine nguva. Nekuti kupisa kana kuvhenekera pamusoro pewafer ne laser, izvi zvinosangana nemuviri zvinogadzira magrooves pamusoro pewafer, uye zvidimbu zvesilicon zvakachekwa zvinonamatirawo pamusoro. Zvinogona kuonekwa kuti nzira yekucheka nelaser yechinyakare inochekawo zvakananga pamusoro pewafer, uye panyaya iyi, yakafanana nenzira yekucheka "blade".
Kucheka Zvisina Kunaka (SD) inzira yekutanga yekucheka mukati mewafer nesimba relaser, wozoisa simba rekunze kune tepi yakabatana kumusana kuti ipwanye, nokudaro ichiparadzanisa chip. Kana kudzvanywa kwaiswa patepi iri kumusana, wafer inosimudzwa ipapo ipapo nekuda kwekutambanudza tepi, nokudaro ichiparadzanisa chip. Mabhenefiti eSD pane nzira yechinyakare yekucheka nelaser ndeaya: chekutanga, hapana tsvina yesilicon; chechipiri, kerf (Kerf: upamhi hwemugero wescribe) yakamanikana, saka machipisi akawanda anogona kuwanikwa. Pamusoro pezvo, chiitiko chekukwenya nekutsemuka chichaderedzwa zvakanyanya uchishandisa nzira yeSD, iyo yakakosha kune mhando yese yekucheka. Nokudaro, nzira yeSD inogona kuve tekinoroji inozivikanwa zvikuru mune ramangwana.
Kucheka Plasma
Kucheka plasma tekinoroji yakagadziridzwa munguva pfupi yapfuura inoshandisa kucheka kweplasma panguva yekugadzira (Fab). Kucheka plasma kunoshandisa zvinhu zve semi-gas panzvimbo pemvura, saka kukanganisa nharaunda kudiki. Uye nzira yekucheka wafer yese panguva imwe chete inotorwa, saka kumhanya kwe "kucheka" kunokurumidza. Zvisinei, nzira yeplasma inoshandisa gasi remakemikari sezvinhu zvakabikwa, uye maitiro ekucheka akaomarara, saka kufamba kwayo kwakaoma. Asi kana tichienzanisa nekucheka "blade" nekucheka ne laser, kucheka plasma hakukanganisi pamusoro pewafer, nokudaro zvichideredza mwero wezvikanganiso uye kuwana machipisi akawanda.
Munguva pfupi yapfuura, sezvo ukobvu hwewafer hwakaderedzwa kusvika 30μm, uye zvinhu zvakawanda zvemhangura (Cu) kana low dielectric constant (Low-k) zvinoshandiswa. Saka, kudzivirira maburrs (Burr), nzira dzekucheka plasma dzichafarirwawo. Ehe, tekinoroji yekucheka plasma iri kuramba ichikura. Ndinotenda kuti mune ramangwana, hapana chikonzero chekupfeka mask yakakosha pakucheka, nekuti iyi inzira huru yekuvandudza plasma.
Sezvo ukobvu hwemawafer hwave huchidzikira kubva pa100μm kusvika pa50μm uyezve kusvika pa30μm, nzira dzekucheka dzekuwana machipisi akazvimiririra dzave dzichichinjawo uye dzichikura kubva pakucheka "kutyoka" uye "banga" kusvika pakucheka nelaser uye kucheka neplasma. Kunyangwe nzira dzekucheka dzichiwedzera kukura dzakawedzera mutengo wekugadzira maitiro ekucheka pachawo, kune rumwe rutivi, nekuderedza zvakanyanya zviitiko zvisingadiwe zvakaita sekukwenya nekutsemuka zvinowanzoitika mukucheka machipisi e semiconductor uye kuwedzera huwandu hwemachipisi anowanikwa pawafer imwe neimwe, mutengo wekugadzira chip imwe chete waratidza kudzikira. Ehe, kuwedzera kwehuwandu hwemachipisi anowanikwa pawafer imwe neimwe kwakabatana zvakanyanya nekudzikira kwehupamhi hwemugwagwa wekucheka. Uchishandisa kucheka kweplasma, machipisi anoda kusvika 20% anogona kuwanikwa zvichienzaniswa nekushandisa nzira yekucheka "banga", inovawo chikonzero chikuru nei vanhu vachisarudza kucheka kweplasma. Nekuvandudzwa nekuchinja kwemawafer, chitarisiko chechip uye nzira dzekurongedza, maitiro akasiyana-siyana ekucheka akadai setekinoroji yekugadzira wafer neDBG ari kubudawo.
Nguva yekutumira: Gumiguru-10-2024