A agace gatoagomba kunyura mu mpinduka eshatu kugira ngo abe chip nyayo ya semiconductor: icya mbere, ingot ifite ishusho nk'iy'agace icibwamo wafer; mu buryo bwa kabiri, transistors zishyirwa imbere ya wafer mu buryo bwabanje; amaherezo, gupakira birakorwa, ni ukuvuga, mu buryo bwo gukata,agace gatoiba chip yuzuye ya semiconductor. Bigaragara ko inzira yo gupakira ari iyo mu nzira yo gupakira inyuma. Muri iyi nzira, wafer izacibwamo utubumbe twinshi twa hexahedron. Iyi nzira yo kubona utubumbe twigenga yitwa "Singulation", naho inzira yo gukata wafer board mu tubumbe twigenga yitwa "wafer cutting (Die Sawing)". Vuba aha, hamwe no kunoza ishyirwa mu bikorwa rya semiconductor, ubunini bwauduce duto twa waferyarushijeho kuba mito, birumvikana ko bizana ingorane nyinshi mu buryo bwo "guhinduranya".
Iterambere ry'uburyo bwo gukata wafer
Imikorere y'imbere n'iy'inyuma yahindutse binyuze mu mikoranire mu buryo butandukanye: iterambere ry'imikorere y'inyuma rishobora kugena imiterere n'aho uduce duto twa hexahedron dutandukanijwe n'icyuma kiri kuagace gato, kimwe n'imiterere n'aho bya pads (inzira z'amashanyarazi zihurira) kuri wafer; ahubwo, iterambere ry'imikorere yo mu gice cy'imbere ryahinduye inzira n'uburyo bwoagace gatoGukata umugongo no "gukata inyuma" mu buryo bwo gukata inyuma. Kubwibyo, uko isura y'ipaki irushaho kuba nziza bizagira ingaruka zikomeye ku buryo ipaki ikora inyuma. Byongeye kandi, umubare, uburyo ikorwamo n'ubwoko bwo gukata nabyo bizahinduka bitewe n'impinduka mu isura y'ipaki.
Gukata ibice by'umwanditsi
Mu minsi ya mbere, "kumenagura" hakoreshejwe imbaraga zo hanze ni bwo buryo bwonyine bwo gukata bwashoboraga kugabanyaagace gatomu gihe cy’ibumba rya hexahedron. Ariko, ubu buryo bufite ingaruka mbi zo gucika cyangwa gusenya inkombe y’agace gato. Byongeye kandi, kubera ko uduce tw’icyuma tuba turi ku buso buto tudakurwaho burundu, ubuso buto bucagaguye nabwo buba bugoye cyane.
Kugira ngo iki kibazo gikemuke, habayeho uburyo bwo “Guca”, ni ukuvuga mbere yo “kumena”, ubuso bw’ahoagace gatoicibwa kugeza kuri kimwe cya kabiri cy'ubujyakuzimu. “Gukora inyandiko”, nk'uko izina ribigaragaza, bivuga gukoresha impeller kugira ngo uce igice cy'imbere cy'umugati mbere y'igihe. Mu minsi ya mbere, imigati myinshi iri munsi ya santimetero 1.8 yakoreshaga ubu buryo bwo gukata bwa mbere “gukata” hagati y'udupira hanyuma “gucika”.
Gukata ibyuma cyangwa Gukata ibyuma
Uburyo bwo gukata "Scribing" bwagiye buhinduka uburyo bwo gukata "Blade dicing", ari bwo buryo bwo gukata hakoreshejwe icyuma inshuro ebyiri cyangwa eshatu zikurikiranye. Uburyo bwo gukata "Blade" bushobora gukosora ibintu bito bikura iyo "bimenetse" nyuma yo "gukora", kandi bushobora kurinda uduce duto mu gihe cyo "gukora singulation". Gukata "Blade" bitandukanye n'uburyo bwo gukata bwabanje "dicing", ni ukuvuga ko, nyuma yo gukata "icyuma", ntabwo ari "gucika", ahubwo ni ugukata nanone hakoreshejwe icyuma. Kubwibyo, byitwa kandi "intambwe dicing".
Kugira ngo ikigega cy’umugozi kirindwe kwangirika inyuma mu gihe cyo gukata, hagomba gushyirwaho agapira kare kugira ngo habeho "gusimbuza" neza. Mu gihe cyo gusya inyuma, agapira kagomba gushyirwa imbere ya kapira. Ariko ibinyuranye n’ibyo, mu gukata "agapira", agapira kagomba gushyirwa inyuma ya kapira. Mu gihe cyo gukata agapira ka eutectic (gusimbuza agapira, gushyiraho uduce twatandukanyijwe kuri PCB cyangwa frame ihamye), agapira gafatanye inyuma kazahita gagwa. Bitewe n’ubushyuhe bwinshi mu gihe cyo gukata, amazi ya DI agomba gusukwa buri gihe mu mpande zose. Byongeye kandi, impeller igomba gushyirwaho uduce twa diyama kugira ngo uduce dushobore gukatwa neza. Muri iki gihe, agapira (ubugari bw’agapira: ubugari bw’agapira) kagomba kuba kamwe kandi katagomba kurenza ubugari bw’agapira.
Kuva kera, gukata ni bwo buryo busanzwe bukoreshwa cyane mu gukata. Akamaro kabwo gakomeye ni uko bushobora gukata umubare munini wa wafers mu gihe gito. Ariko, niba umuvuduko wo kugaburira igice wiyongera cyane, amahirwe yo gukuraho chiplet edge aziyongera. Kubwibyo, umubare w'izunguruka rya impeller ugomba kugenzurwa inshuro zigera ku 30.000 ku munota. Bigaragara ko ikoranabuhanga rya semiconductor process akenshi ari ibanga rikusanywa buhoro buhoro mu gihe kirekire cyo gukusanya no kugerageza no gukosa (mu gice gikurikira kivuga ku guhuza kwa eutectic, tuzaganira ku bikubiye ku gukata na DAF).
Gukata mbere yo gusya (DBG): uburyo bwo gukata bwahinduye uburyo
Iyo hakozwe ikata ry'icyuma kuri wafer ifite umurambararo wa santimetero 2.8, nta mpamvu yo guhangayikishwa n'uko icupa ry'icyuma ritobora cyangwa ricika. Ariko uko umurambararo wa wafer wiyongera ukagera kuri santimetero 21 kandi ubugari bukaba buto cyane, ibintu byo gukata no gucika bitangira kugaragara. Kugira ngo bigabanye cyane ingaruka ku icupa ry'icyuma mu gihe cyo gukata, uburyo bwa DBG bwo "gukata mbere yo gusya" busimbura uburyo bwa gakondo bwo gukata. Bitandukanye n'uburyo bwa gakondo bwo "gukata ry'icyuma" bugabanya buri gihe, DBG ibanza gukora ikata ry'icyuma, hanyuma ikagabanya buhoro buhoro ubugari bwa wafer ikomeza kugabanya uruhande rw'inyuma kugeza igihe chip icitsemo ibice. Dushobora kuvuga ko DBG ari verisiyo yavuguruye y'uburyo bwa mbere bwo "gukata ry'icyuma". Kubera ko bushobora kugabanya ingaruka zo gukata bwa kabiri, uburyo bwa DBG bwamamaye cyane mu "gupakira ku rwego rwa wafer".
Gukata uduce twa laser
Uburyo bwo gukata imashini (WLCSP) bushingiye cyane cyane ku gukata imashini hakoreshejwe laser. Gukata imashini hakoreshejwe laser bishobora kugabanya ibintu nko gukurura no gucika, bityo bikabona imashini nziza, ariko iyo ubugari bwa wafer burenze 100μm, umusaruro uzagabanuka cyane. Kubwibyo, ikoreshwa cyane ku imashini zifite ubugari buri munsi ya 100μm (zito cyane). Gukata imashini hakoreshejwe laser bigabanya silicon hakoreshejwe laser ifite ingufu nyinshi ku mwobo wa wafer. Ariko, iyo ukoresheje uburyo busanzwe bwo gukata imashini hakoreshejwe laser (Conventional Laser), icyuma gikingira kigomba gushyirwa ku buso bwa wafer mbere y'igihe. Kubera ko gushyushya cyangwa guhanagura ubuso bwa wafer hakoreshejwe laser, ubwo buryo bwo gukorana buzatuma imashini zica ku buso bwa wafer, kandi ibice bya silicon byaciwe nabyo bizifatanya n'ubuso. Bigaragara ko uburyo busanzwe bwo gukata imashini hakoreshejwe laser bunaca ubuso bwa wafer mu buryo butaziguye, kandi muri urwo rwego, bisa n'uburyo bwo gukata "icyuma".
Gukata ibice by’inyuma (SD) ni uburyo bwo kubanza gukata imbere muri wafer ukoresheje ingufu za laser, hanyuma ugashyira igitutu cyo hanze kuri kaseti ifatanye n’inyuma kugira ngo uyimene, bityo ugatandukanya chip. Iyo igitutu gishyizwe kuri kaseti inyuma, wafer izamurwa ako kanya bitewe no kurambura kwa kaseti, bityo igatandukanya chip. Ibyiza bya SD ugereranije n’uburyo busanzwe bwo gukata laser ni: icya mbere, nta myanda ya silikoni ihari; icya kabiri, kerf (Kerf: ubugari bw’umuyoboro w’icyuma) ni nto, bityo haboneka chip nyinshi. Byongeye kandi, gukata no kwangirika bizagabanuka cyane hakoreshejwe uburyo bwa SD, ari nabyo by’ingenzi ku bwiza rusange bwo gukata. Kubwibyo, uburyo bwa SD bushobora kuba ikoranabuhanga rikunzwe cyane mu gihe kizaza.
Gukata Plasma
Gukata plasma ni ikoranabuhanga riherutse guterwa rikoresha gukata plasma mu gihe cyo gukora (Fab). Gukata plasma bikoresha ibikoresho bya semi-gaz aho gukoresha ibinyobwa, bityo ingaruka ku bidukikije ni ntoya. Kandi uburyo bwo gukata wafer yose icyarimwe burakoreshwa, bityo umuvuduko wo "gukata" uba wihuta cyane. Ariko, uburyo bwa plasma bukoresha gaze ya chemical reaction nk'ibikoresho fatizo, kandi inzira yo gukata iragoye cyane, bityo inzira yayo iragoye cyane. Ariko ugereranije no gukata "blade" no gukata laser, gukata plasma ntabwo byangiza ubuso bwa wafer, bityo bigabanya igipimo cy'ubusembwa no kubona izindi chips.
Vuba aha, kubera ko ubugari bwa wafer bwagabanutseho 30μm, kandi hakoreshwa ibikoresho byinshi by'umuringa (Cu) cyangwa ibikoresho bike bya dielectric (Low-k). Kubwibyo, kugira ngo hirindwe uduce duto (Burr), uburyo bwo gukata plasma nabwo buzakundwa. Birumvikana ko ikoranabuhanga ryo gukata plasma naryo rikomeje gutera imbere. Ndizera ko mu gihe cya vuba aha, nta mpamvu yo kwambara agapfukamunwa kadasanzwe mu gihe cyo gukata plasma, kuko iki ari cyo cyerekezo gikomeye cy'iterambere ryo gukata plasma.
Kubera ko ubunini bw'amacupa ya wafer bwakomeje kugabanuka kuva kuri 100μm kugera kuri 50μm hanyuma bukagera kuri 30μm, uburyo bwo gukata bwo kubona amacupa yigenga nabwo bwagiye buhinduka kandi buva ku gukata "kumena" no "kuba" kugeza ku gukata hakoreshejwe laser no gukata plasma. Nubwo uburyo bwo gukata bugenda bukura bwongereye ikiguzi cyo gukora igikorwa cyo gukata ubwacyo, ku rundi ruhande, binyuze mu kugabanya cyane ibintu bidakenewe nko gukata no gucika bikunze kubaho mu gukata amacupa ya semiconductor no kongera umubare w'amacupa yabonetse kuri buri wafer, ikiguzi cyo gukora amacupa ya chip imwe cyagaragaje ko kirimo kugabanuka. Birumvikana ko kwiyongera k'umubare w'amacupa yabonetse kuri buri gice cy'agace ka wafer bifitanye isano rya hafi no kugabanuka k'ubugari bw'umuhanda wo gukata. Hakoreshejwe gukata plasma, hafi 20% by'amacupa ashobora kuboneka ugereranije no gukoresha uburyo bwo gukata "kuba", ari na yo mpamvu ikomeye ituma abantu bahitamo gukata plasma. Hamwe n'iterambere n'impinduka za wafer, imiterere y'amacupa n'uburyo bwo gupakira, inzira zitandukanye zo gukata nka ikoranabuhanga ryo gutunganya amacupa ya wafer na DBG nazo ziragenda zigaragara.
Igihe cyo kohereza: Ukwakira 10-2024