Samar da na'urorin Semiconductor galibi ya haɗa da na'urori daban-daban, da'irori masu haɗawa da kuma tsarin marufi.
Ana iya raba samar da semiconductor zuwa matakai uku: samar da kayan jikin samfura, samfurawafer ɗin waferMasana'antu da haɗa na'urori. Daga cikinsu, mafi munin gurɓataccen yanayi shine matakin ƙera wafer na samfur.
Ana raba gurɓatattun abubuwa zuwa ruwan shara, iskar gas da kuma sharar gida.
Tsarin kera guntu:
Wafer ɗin siliconbayan niƙa na waje - tsaftacewa - iskar shaka - juriya iri ɗaya - photolithography - haɓakawa - etching - yaɗuwa, dasa ion - ajiyar tururin sinadarai - gogewar injiniyan sinadarai - ƙara ƙarfe, da sauransu.
Ruwan shara
Ana samar da ruwa mai yawa a kowane mataki na aikin kera da gwajin marufi na semiconductor, galibi ruwan sharar gida mai tushen acid, ruwan sharar gida mai ɗauke da ammonia da kuma ruwan sharar gida na halitta.
1. Ruwan shara mai ɗauke da sinadarin fluorine:
Hydrofluoric acid ya zama babban sinadarin da ake amfani da shi wajen hada sinadarin oxidation da etching saboda tasirinsa na oxidizing da corrosion. Ruwan sharar da ke dauke da fluorine a cikin wannan tsari galibi yana fitowa ne daga tsarin yaɗuwa da kuma tsarin goge sinadarai a cikin tsarin kera guntu. A cikin tsarin tsaftacewa na wafers na silicon da kayan aiki masu alaƙa, ana amfani da hydrochloric acid sau da yawa. Duk waɗannan hanyoyin ana kammala su a cikin tankunan etching na musamman ko kayan tsaftacewa, don haka ana iya fitar da ruwan sharar da ke dauke da fluorine daban-daban. Dangane da yawan ruwan, ana iya raba shi zuwa ruwan sharar da ke dauke da fluorine mai yawan maida hankali da kuma ruwan sharar da ke dauke da ammonia mai ƙarancin maida hankali. Gabaɗaya, yawan ruwan sharar da ke dauke da ammonia mai yawan maida hankali zai iya kaiwa 100-1200 mg/L. Yawancin kamfanoni suna sake amfani da wannan ɓangaren na ruwan sharar don hanyoyin da ba sa buƙatar ingancin ruwa mai yawa.
2. Ruwan sharar gida mai tushen acid:
Kusan kowace hanya a cikin tsarin kera da'irori masu haɗawa tana buƙatar a tsaftace guntu. A halin yanzu, sulfuric acid da hydrogen peroxide sune ruwan tsaftacewa da aka fi amfani da su a cikin tsarin kera da'irori masu haɗawa. A lokaci guda, ana amfani da sinadaran acid-base reagents kamar nitric acid, hydrochloric acid da ruwan ammonia.
Ruwan sharar da aka yi da acid-base na tsarin ƙera shi galibi yana fitowa ne daga tsarin tsaftacewa a cikin tsarin ƙera guntu. A cikin tsarin marufi, ana yi wa guntu magani da maganin acid-base yayin amfani da electroplating da kuma nazarin sinadarai. Bayan magani, ana buƙatar a wanke shi da ruwa mai tsarki don samar da ruwan sharar da aka yi da acid-base. Bugu da ƙari, ana amfani da sinadaran acid-base kamar sodium hydroxide da hydrochloric acid a cikin tashar ruwa mai tsarki don sake farfaɗo da anion da cation resins don samar da ruwan sharar da aka yi da acid-base. Ana kuma samar da ruwan wutsiya na wankewa yayin aikin wanke sharar da aka yi da acid-base. A cikin kamfanonin kera da'irori masu haɗawa, adadin ruwan sharar da aka yi da acid-base yana da yawa musamman.
3. Ruwan sharar gida na halitta:
Saboda hanyoyin samarwa daban-daban, adadin sinadaran da ake amfani da su a masana'antar semiconductor ya bambanta sosai. Duk da haka, a matsayin masu tsaftacewa, ana amfani da sinadaran da ke cikin Organic sosai a cikin hanyoyin haɗin gwiwa daban-daban na marufi. Wasu sinadarai suna zama ruwan sharar gida na Organic.
4. Sauran ruwan shara:
Tsarin ƙwanƙwasa na tsarin samar da semiconductor zai yi amfani da adadin ammonia, fluorine da ruwa mai tsafta don kawar da gurɓatawa, ta haka ne zai samar da fitar da ruwan shara mai ɗauke da ammonia mai yawa.
Ana buƙatar tsarin electroplating a cikin tsarin marufi na semiconductor. Ana buƙatar tsaftace guntu bayan electroplating, kuma za a samar da ruwan sharar gida na electroplating a cikin wannan tsari. Tunda ana amfani da wasu karafa wajen electroplating, za a sami hayakin ion na ƙarfe a cikin ruwan sharar gida na electroplating, kamar gubar, tin, diski, zinc, aluminum, da sauransu.
Iskar gas mai shara
Tunda tsarin semiconductor yana da matuƙar buƙata don tsaftar ɗakin tiyata, galibi ana amfani da fanka don fitar da nau'ikan iskar shara daban-daban da ke wargaza yayin aikin. Saboda haka, hayakin sharar gida a masana'antar semiconductor yana da alaƙa da babban adadin hayakin da ƙarancin yawan hayakin da ke fitarwa. Haka kuma hayakin sharar gida galibi yana wargazawa.
Ana iya raba waɗannan hayakin da ke fitar da sharar gida zuwa rukuni huɗu: iskar acidic, iskar alkaline, iskar sharar gida ta halitta da kuma iskar gas mai guba.
1. Iskar sharar gida mai tushen acid:
Iskar sharar da aka yi da acid galibi tana fitowa ne daga yaɗuwa,CVD, CMP da hanyoyin etching, waɗanda ke amfani da maganin tsaftacewa mai tushen acid don tsaftace wafer ɗin.
A halin yanzu, mafi yawan amfani da sinadarin tsaftacewa a cikin tsarin kera semiconductor shine cakuda hydrogen peroxide da sulfuric acid.
Iskar gas da ake samarwa a cikin waɗannan hanyoyin ta haɗa da iskar gas mai guba kamar sulfuric acid, hydrofluoric acid, hydrochloric acid, nitric acid da phosphoric acid, kuma iskar alkaline galibi ammonia ce.
2. Iskar sharar gida ta halitta:
Iskar sharar gida ta halitta galibi tana fitowa ne daga hanyoyi kamar photolithography, haɓakawa, ƙawata da yaɗuwa. A cikin waɗannan hanyoyin, ana amfani da maganin halitta (kamar isopropyl alcohol) don tsaftace saman wafer ɗin, kuma iskar sharar da ke fitowa daga volatilization tana ɗaya daga cikin tushen iskar sharar gida ta halitta;
A lokaci guda, mai hana haske (photoresist) da ake amfani da shi wajen aikin photolithography da etching ya ƙunshi sinadarai masu narkewar sinadarai masu canzawa, kamar butyl acetate, waɗanda ke juyawa zuwa sararin samaniya yayin aikin sarrafa wafer, wanda shine wani tushen iskar sharar gida ta halitta.
3. Iskar gas mai guba:
Iskar gas mai guba galibi tana fitowa ne daga hanyoyin aiki kamar su crystal epitaxy, dry etching da CVD. A cikin waɗannan hanyoyin, ana amfani da nau'ikan iskar gas na musamman masu tsabta don sarrafa wafer, kamar silicon (SiHj), phosphorus (PH3), carbon tetrachloride (CFJ), borane, boron trioxide, da sauransu. Wasu iskar gas na musamman suna da guba, suna shaƙar iska kuma suna lalata iska.
A lokaci guda, a cikin tsarin busasshen gogewa da tsaftacewa bayan adana tururin sinadarai a cikin masana'antar semiconductor, ana buƙatar adadi mai yawa na iskar oxide (PFCS), kamar NFS, C2F&CR, C3FS, CHF3, SF6, da sauransu. Waɗannan mahaɗan perfluorinated suna da ƙarfi a cikin yankin hasken infrared kuma suna kasancewa a cikin yanayi na dogon lokaci. Gabaɗaya ana ɗaukar su a matsayin babban tushen tasirin greenhouse na duniya.
4. Tsarin marufi na iskar gas mai sharar gida:
Idan aka kwatanta da tsarin kera semiconductor, iskar sharar da tsarin marufi na semiconductor ke samarwa abu ne mai sauƙi, galibi iskar acidic, resin epoxy da ƙura.
Iskar sharar da ke ɗauke da sinadarin acid galibi ana samar da ita ne a cikin hanyoyin kamar su electroplating;
Ana samar da iskar gas ta sharar gida a lokacin yin burodi bayan an manna da kuma rufe kayan;
Injin ɗin yanka yana samar da iskar gas mai ɗauke da ƙurar silicon a lokacin yanke wafer.
Matsalolin gurɓatar muhalli
Ga matsalolin gurɓatar muhalli a masana'antar semiconductor, manyan matsalolin da ake buƙatar warwarewa sune:
· Fitar da gurɓatattun iska da mahaɗan halitta masu canzawa (VOCs) masu yawa a cikin tsarin photolithography;
· Fitar da sinadarai masu sinadarin fluorin (PFCS) a cikin tsarin cire sinadarin plasma da kuma adana tururin sinadarai;
· Yawan amfani da makamashi da ruwa wajen samarwa da kuma kare lafiyar ma'aikata;
· Sake amfani da kayan da aka samar da kuma sa ido kan gurɓataccen iska;
· Matsalolin amfani da sinadarai masu haɗari a cikin tsarin marufi.
Tsabtataccen samarwa
Ana iya inganta fasahar samar da tsabta ta na'urar Semiconductor ta hanyar amfani da kayan aiki, hanyoyin aiki da kuma sarrafa tsari.
Inganta albarkatun ƙasa da makamashi
Da farko, ya kamata a kula da tsarkin kayan don rage shigar da ƙazanta da barbashi.
Na biyu, ya kamata a gudanar da gwaje-gwaje daban-daban na zafin jiki, gano zubewa, girgiza, girgizar lantarki mai ƙarfin lantarki da sauran gwaje-gwaje kan abubuwan da ke shigowa ko samfuran da ba a gama ba kafin a fara samarwa.
Bugu da ƙari, ya kamata a kula da tsarkin kayan taimako sosai. Akwai fasahohi da yawa da za a iya amfani da su don samar da makamashi mai tsafta.
Inganta tsarin samarwa
Masana'antar semiconductor da kanta tana ƙoƙarin rage tasirinta ga muhalli ta hanyar inganta fasahar aiwatarwa.
Misali, a shekarun 1970, galibi ana amfani da sinadarai masu narkewa na halitta don tsaftace wafers a cikin fasahar tsaftace da'ira mai haɗawa. A shekarun 1980, ana amfani da maganin acid da alkali kamar sulfuric acid don tsaftace wafers. Har zuwa shekarun 1990, an haɓaka fasahar tsaftace iskar oxygen ta plasma.
Dangane da marufi, yawancin kamfanoni a halin yanzu suna amfani da fasahar lantarki, wadda za ta haifar da gurɓatar ƙarfe mai nauyi ga muhalli.
Duk da haka, masana'antun marufi a Shanghai ba sa amfani da fasahar lantarki, don haka babu wani tasirin ƙarfe mai nauyi akan muhalli. Ana iya gano cewa masana'antar semiconductor tana rage tasirinta a hankali akan muhalli ta hanyar inganta tsari da maye gurbin sinadarai a cikin tsarin haɓaka kanta, wanda kuma ya biyo bayan yanayin ci gaban duniya na yanzu na fafutukar aiwatar da tsari da ƙirar samfura bisa ga muhalli.
A halin yanzu, ana ci gaba da inganta ayyukan gida, ciki har da:
· Sauya da rage iskar gas ta ammonium PFCS, kamar amfani da iskar gas ta PFCs mai ƙarancin tasirin greenhouse don maye gurbin iskar gas da babban tasirin greenhouse, kamar inganta kwararar tsari da rage yawan iskar gas ta PFCS da ake amfani da ita a cikin aikin;
· Inganta tsaftace mai wafer mai yawa zuwa tsaftace mai wafer mai guda ɗaya don rage yawan sinadarai masu tsaftace mai da ake amfani da su a aikin tsaftacewa.
· Tsarin sarrafa tsari mai tsauri:
a. Fahimtar sarrafa tsarin masana'antu ta atomatik, wanda zai iya aiwatar da ingantaccen sarrafawa da samar da tsari, da kuma rage yawan kuskuren aiki da hannu;
b. Abubuwan da suka shafi muhalli na tsari mai tsafta sosai, kusan kashi 5% ko ƙasa da haka na asarar amfanin gona suna faruwa ne ta hanyar mutane da muhalli. Abubuwan da suka shafi muhalli na tsari mai tsafta sosai sun haɗa da tsaftar iska, ruwa mai tsafta sosai, iska mai matsewa, CO2, N2, zafin jiki, danshi, da sauransu. Sau da yawa ana auna matakin tsafta na bita mai tsafta ta hanyar matsakaicin adadin barbashi da aka yarda da shi a kowace naúrar iska, wato, yawan adadin barbashi;
c. Ƙarfafa ganowa, da kuma zaɓar muhimman wurare masu dacewa don ganowa a wuraren aiki da ke da yawan sharar gida yayin aikin samarwa.
Barka da zuwa ga duk wani kwastomomi daga ko'ina cikin duniya don ziyarce mu don ƙarin tattaunawa!
https://www.vet-china.com/
https://www.facebook.com/people/Ningbo-Miami-Advanced-Material-Technology-Co-Ltd/100085673110923/
https://www.linkedin.com/company/100890232/admin/page-posts/published/
https://www.youtube.com/@user-oo9nl2qp6j
Lokacin Saƙo: Agusta-13-2024