Kev tsim cov khoom siv semiconductor feem ntau suav nrog cov khoom siv sib cais, cov voj voog sib xyaw thiab lawv cov txheej txheem ntim khoom.
Kev tsim khoom semiconductor tuaj yeem muab faib ua peb theem: kev tsim khoom siv lub cev, khoomncuav mog qab zibkev tsim khoom thiab kev sib dhos khoom siv. Ntawm lawv, qhov kev ua qias tuaj loj tshaj plaws yog theem tsim khoom wafer.
Cov pa phem feem ntau yog muab faib ua cov dej khib nyiab, cov pa roj khib nyiab thiab cov khib nyiab khov.
Cov txheej txheem tsim khoom siv nti:
Silicon wafertom qab sib tsoo sab nraud - ntxuav - oxidation - tiv taus sib xws - photolithography - kev txhim kho - etching - diffusion, ion implantation - tshuaj lom neeg vapor deposition - tshuaj lom neeg mechanical polishing - metallization, thiab lwm yam.
Cov dej khib nyiab
Muaj ntau cov dej khib nyiab tsim tawm hauv txhua kauj ruam ntawm kev tsim khoom semiconductor thiab kev sim ntim khoom, feem ntau yog cov dej khib nyiab acid-base, cov dej khib nyiab uas muaj ammonia thiab cov dej khib nyiab organic.
1. Cov dej khib nyiab uas muaj fluorine:
Hydrofluoric acid ua cov kuab tshuaj tseem ceeb siv rau hauv cov txheej txheem oxidation thiab etching vim nws cov khoom oxidizing thiab corrosive. Cov dej khib nyiab uas muaj fluorine hauv cov txheej txheem feem ntau yog los ntawm cov txheej txheem diffusion thiab cov txheej txheem polishing tshuaj lom neeg hauv cov txheej txheem tsim cov chip. Hauv cov txheej txheem ntxuav ntawm silicon wafers thiab cov khoom siv cuam tshuam, hydrochloric acid kuj siv ntau zaus. Tag nrho cov txheej txheem no tau ua tiav hauv cov thoob dej etching tshwj xeeb lossis cov khoom siv ntxuav, yog li cov dej khib nyiab uas muaj fluorine tuaj yeem tso tawm ntawm nws tus kheej. Raws li qhov concentration, nws tuaj yeem faib ua cov dej khib nyiab uas muaj fluorine ntau thiab cov dej khib nyiab uas muaj ammonia tsawg. Feem ntau, qhov concentration ntawm cov dej khib nyiab uas muaj ammonia ntau tuaj yeem ncav cuag 100-1200 mg / L. Feem ntau cov tuam txhab rov ua dua qhov no ntawm cov dej khib nyiab rau cov txheej txheem uas tsis xav tau cov dej zoo.
2. Cov dej khib nyiab uas muaj kua qaub-raws li:
Yuav luag txhua txoj hauv kev tsim cov khoom siv hluav taws xob sib xyaw ua ke yuav tsum tau ntxuav cov chip. Tam sim no, sulfuric acid thiab hydrogen peroxide yog cov kua ntxuav uas siv ntau tshaj plaws hauv cov txheej txheem tsim cov khoom siv hluav taws xob sib xyaw ua ke. Tib lub sijhawm, cov tshuaj reagents acid-base xws li nitric acid, hydrochloric acid thiab ammonia dej kuj tseem siv tau.
Cov dej khib nyiab acid-base ntawm cov txheej txheem tsim khoom feem ntau yog los ntawm cov txheej txheem ntxuav hauv cov txheej txheem tsim cov chip. Hauv cov txheej txheem ntim khoom, cov chip raug kho nrog cov kua qaub-base thaum lub sijhawm electroplating thiab kev tshuaj xyuas tshuaj lom neeg. Tom qab kev kho mob, nws yuav tsum tau ntxuav nrog dej ntshiab los tsim cov dej khib nyiab acid-base. Tsis tas li ntawd, cov tshuaj acid-base reagents xws li sodium hydroxide thiab hydrochloric acid kuj tseem siv rau hauv chaw nres tsheb dej ntshiab los tsim cov anion thiab cation resins los tsim cov dej khib nyiab acid-base. Cov dej ntxuav tw kuj tseem tsim tawm thaum lub sijhawm ntxuav cov roj khib nyiab acid-base. Hauv cov tuam txhab tsim khoom sib xyaw ua ke, cov dej khib nyiab acid-base yog qhov loj heev.
3. Cov dej khib nyiab organic:
Vim muaj ntau yam txheej txheem tsim khoom sib txawv, qhov ntau ntawm cov kuab tshuaj organic siv hauv kev lag luam semiconductor sib txawv heev. Txawm li cas los xij, ua cov neeg ntxuav, cov kuab tshuaj organic tseem siv dav hauv ntau qhov txuas ntawm kev tsim khoom ntim. Qee cov kuab tshuaj ua cov dej khib nyiab organic.
4. Lwm cov dej khib nyiab:
Cov txheej txheem etching ntawm cov txheej txheem tsim khoom semiconductor yuav siv ntau cov ammonia, fluorine thiab dej ntshiab siab rau kev ntxuav cov pa phem, yog li tsim cov dej khib nyiab uas muaj ammonia ntau.
Cov txheej txheem electroplating yog qhov yuav tsum tau ua hauv cov txheej txheem ntim semiconductor. Cov chip yuav tsum tau ntxuav tom qab electroplating, thiab cov dej khib nyiab ntxuav electroplating yuav tsim tawm hauv cov txheej txheem no. Vim tias qee cov hlau siv hauv electroplating, yuav muaj cov pa roj carbon dioxide hauv cov dej khib nyiab ntxuav electroplating, xws li cov hlau lead, tin, disc, zinc, txhuas, thiab lwm yam.
Cov pa roj khib nyiab
Vim tias cov txheej txheem semiconductor muaj qhov yuav tsum tau ua kom huv si ntawm chav ua haujlwm, feem ntau cov kiv cua siv los rho tawm ntau hom roj pov tseg uas yaj thaum lub sijhawm ua haujlwm. Yog li ntawd, cov pa roj pov tseg hauv kev lag luam semiconductor yog cov pa tawm ntau thiab cov pa tawm tsawg. Cov pa roj pov tseg kuj tseem yaj.
Cov pa roj pov tseg no feem ntau muab faib ua plaub pawg: roj acidic, roj alkaline, roj organic pov tseg thiab roj lom.
1. Cov pa roj pov tseg uas muaj kua qaub thiab cov kua qaub:
Cov pa roj pov tseg acid-base feem ntau yog los ntawm kev sib kis,CVD, CMP thiab cov txheej txheem etching, uas siv cov kua qaub-base ntxuav los ntxuav cov wafer.
Tam sim no, cov tshuaj ntxuav uas siv ntau tshaj plaws hauv cov txheej txheem tsim khoom semiconductor yog cov tshuaj sib xyaw ntawm hydrogen peroxide thiab sulfuric acid.
Cov roj pov tseg uas tsim tawm hauv cov txheej txheem no suav nrog cov roj acidic xws li sulfuric acid, hydrofluoric acid, hydrochloric acid, nitric acid thiab phosphoric acid, thiab cov roj alkaline feem ntau yog ammonia.
2. Cov pa roj pov tseg organic:
Cov pa roj pov tseg organic feem ntau yog los ntawm cov txheej txheem xws li photolithography, kev txhim kho, etching thiab diffusion. Hauv cov txheej txheem no, cov kua organic (xws li isopropyl cawv) yog siv los ntxuav qhov chaw ntawm wafer, thiab cov pa roj pov tseg tsim los ntawm volatilization yog ib qho ntawm cov khoom siv ntawm cov pa roj pov tseg organic;
Tib lub sijhawm, tus photoresist (photoresist) siv rau hauv cov txheej txheem ntawm photolithography thiab etching muaj cov kuab tshuaj organic volatile, xws li butyl acetate, uas volatilizes rau hauv huab cua thaum lub sijhawm ua wafer, uas yog lwm qhov chaw ntawm cov roj pov tseg organic.
3. Cov pa roj lom:
Cov pa roj lom feem ntau yog los ntawm cov txheej txheem xws li crystal epitaxy, dry etching thiab CVD. Hauv cov txheej txheem no, ntau yam roj tshwj xeeb uas muaj cov khoom siv siab purity yog siv los ua cov wafer, xws li silicon (SiHj), phosphorus (PH3), carbon tetrachloride (CFJ), borane, boron trioxide, thiab lwm yam. Qee cov roj tshwj xeeb yog cov tshuaj lom, ua rau asphyxiating thiab corrosive.
Tib lub sijhawm, nyob rau hauv cov txheej txheem etching qhuav thiab ntxuav tom qab cov tshuaj vapor deposition hauv semiconductor manufacturing, yuav tsum muaj ntau cov roj oxide tag nrho (PFCS), xws li NFS, C2F & CR, C3FS, CHF3, SF6, thiab lwm yam. Cov tshuaj perfluorinated no muaj kev nqus tau zoo hauv thaj chaw teeb infrared thiab nyob hauv huab cua ntev. Lawv feem ntau suav hais tias yog qhov tseem ceeb ntawm cov nyhuv tsev cog khoom thoob ntiaj teb.
4. Cov txheej txheem ntim khoom pov tseg roj:
Piv nrog rau cov txheej txheem tsim khoom semiconductor, cov roj pov tseg uas tsim los ntawm cov txheej txheem ntim khoom semiconductor yog qhov yooj yim, feem ntau yog cov roj acidic, epoxy resin thiab hmoov av.
Cov pa roj acidic pov tseg feem ntau yog tsim los ntawm cov txheej txheem xws li electroplating;
Cov roj khib nyiab ci yog tsim tawm hauv cov txheej txheem ntawm kev ci tom qab cov khoom muab tshuaj thiab kaw;
Lub tshuab dicing tsim cov roj pov tseg uas muaj cov hmoov silicon me me thaum lub sijhawm txiav wafer.
Teeb meem kev ua qias tuaj ib puag ncig
Rau cov teeb meem kev ua qias tuaj ib puag ncig hauv kev lag luam semiconductor, cov teeb meem tseem ceeb uas yuav tsum tau daws yog:
· Kev tso tawm ntau ntawm cov pa phem thiab cov organic sib xyaw (VOCs) hauv cov txheej txheem photolithography;
· Kev tso tawm ntawm cov tshuaj perfluorinated (PFCS) hauv cov txheej txheem plasma etching thiab cov txheej txheem tso pa tshuaj lom neeg;
· Kev siv zog thiab dej ntau hauv kev tsim khoom thiab kev tiv thaiv kev nyab xeeb ntawm cov neeg ua haujlwm;
· Kev siv dua tshiab thiab kev soj ntsuam kev ua qias tuaj ntawm cov khoom seem;
Teeb meem ntawm kev siv cov tshuaj lom neeg hauv cov txheej txheem ntim khoom.
Kev tsim khoom huv si
Cov thev naus laus zis tsim khoom siv semiconductor huv si tuaj yeem txhim kho los ntawm cov khoom siv raw, cov txheej txheem thiab kev tswj cov txheej txheem.
Kev txhim kho cov khoom siv raw thiab lub zog
Ua ntej, qhov huv ntawm cov ntaub ntawv yuav tsum tau tswj hwm nruj me ntsis kom txo qhov kev qhia txog cov khoom tsis huv thiab cov khoom me me.
Qhov thib ob, ntau yam kub, nrhiav kom pom qhov xau, kev co, hluav taws xob siab thiab lwm yam kev sim yuav tsum tau ua rau ntawm cov khoom nkag lossis cov khoom tiav ib nrab ua ntej lawv muab tso rau hauv kev tsim khoom.
Tsis tas li ntawd xwb, yuav tsum tswj kom qhov huv ntawm cov khoom siv pabcuam. Muaj ntau yam thev naus laus zis uas siv tau rau kev tsim hluav taws xob huv.
Txhim kho cov txheej txheem tsim khoom
Kev lag luam semiconductor nws tus kheej siv zog los txo nws qhov cuam tshuam rau ib puag ncig los ntawm kev txhim kho cov txheej txheem thev naus laus zis.
Piv txwv li, xyoo 1970, cov organic solvents feem ntau yog siv los ntxuav cov wafers hauv cov txheej txheem ntxuav hluav taws xob sib xyaw. Xyoo 1980, cov kua qaub thiab alkali xws li sulfuric acid tau siv los ntxuav cov wafers. Txog rau xyoo 1990, cov txheej txheem ntxuav plasma oxygen tau tsim.
Hais txog kev ntim khoom, feem ntau cov tuam txhab tam sim no siv cov thev naus laus zis electroplating, uas yuav ua rau muaj kuab paug hnyav rau ib puag ncig.
Txawm li cas los xij, cov chaw ntim khoom hauv Shanghai tsis siv cov thev naus laus zis electroplating lawm, yog li tsis muaj kev cuam tshuam ntawm cov hlau hnyav rau ib puag ncig. Nws tuaj yeem pom tias kev lag luam semiconductor maj mam txo nws qhov cuam tshuam rau ib puag ncig los ntawm kev txhim kho cov txheej txheem thiab kev hloov pauv tshuaj hauv nws tus kheej txoj kev loj hlob, uas kuj ua raws li qhov kev loj hlob thoob ntiaj teb tam sim no ntawm kev tawm tswv yim cov txheej txheem thiab cov khoom tsim raws li ib puag ncig.
Tam sim no, kev txhim kho cov txheej txheem hauv zos ntau dua tab tom ua tiav, suav nrog:
· Hloov thiab txo cov pa roj PFCS uas yog ammonium, xws li siv cov pa roj PFC uas muaj cov teebmeem ua rau lub tsev ntsuab tsawg los hloov cov pa roj uas muaj cov teebmeem ua rau lub tsev ntsuab ntau, xws li txhim kho cov txheej txheem thiab txo cov pa roj PFCS siv rau hauv cov txheej txheem;
· Txhim kho kev ntxuav ntau daim ntaub mus rau kev ntxuav ib daim ntaub kom txo cov tshuaj ntxuav uas siv rau hauv cov txheej txheem ntxuav.
Kev tswj hwm cov txheej txheem nruj:
a. Paub txog kev ua haujlwm tsis siv neeg ntawm cov txheej txheem tsim khoom, uas tuaj yeem ua tiav cov txheej txheem ua tiav thiab kev tsim khoom ntau ntau, thiab txo qhov yuam kev siab ntawm kev ua haujlwm tes;
b. Cov yam ntxwv ib puag ncig ntawm cov txheej txheem huv heev, kwv yees li 5% lossis tsawg dua ntawm qhov poob ntawm cov khoom yog tshwm sim los ntawm tib neeg thiab ib puag ncig. Cov yam ntxwv ib puag ncig ntawm cov txheej txheem huv heev feem ntau suav nrog huab cua huv, dej huv siab, cua compressed, CO2, N2, kub, av noo, thiab lwm yam. Qib kev huv ntawm lub chaw ua haujlwm huv feem ntau yog ntsuas los ntawm tus lej siab tshaj plaws ntawm cov khoom me me uas tso cai rau ib chav ntim ntawm huab cua, uas yog, qhov concentration ntawm cov khoom me me;
c. Txhawb kom muaj zog nrhiav tau, thiab xaiv cov ntsiab lus tseem ceeb rau kev nrhiav tau ntawm cov chaw ua haujlwm uas muaj ntau cov khib nyiab thaum lub sijhawm tsim khoom.
Txais tos cov neeg siv khoom los ntawm thoob plaws lub ntiaj teb tuaj xyuas peb rau kev sib tham ntxiv!
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Lub sijhawm tshaj tawm: Lub Yim Hli-13-2024