Ukuveliswa kwezixhobo ze-semiconductor kubandakanya ikakhulu izixhobo ezahlukeneyo, iisekethe ezidibeneyo kunye neenkqubo zazo zokupakisha.
Imveliso ye-semiconductor inokwahlulwa ibe ngamanqanaba amathathu: imveliso yomzimba wemveliso, imvelisoi-waferukwenziwa kunye nokuhlanganiswa kwezixhobo. Phakathi kwazo, eyona nto ingcolisayo inzima linqanaba lokwenziwa kwe-wafer yemveliso.
Izinto ezingcolisayo zahlulwe ngokubanzi zibe ngamanzi amdaka, igesi emdaka kunye nenkunkuma eqinileyo.
Inkqubo yokuvelisa iitships:
Isonka se-silicon esisicabaemva kokusila kwangaphandle - ukucoca - i-oxidation - ukumelana okufanayo - i-photolithography - uphuhliso - ukukrola - ukusasazwa, ukufakelwa kwee-ion - ukufakwa komphunga weekhemikhali - ukupholishwa koomatshini beekhemikhali - ukwenziwa kwesinyithi, njl.
Amanzi amdaka
Inani elikhulu lamanzi amdaka lenziwa kwinqanaba ngalinye lenkqubo yokwenziwa kunye novavanyo lokupakisha lwe-semiconductor, ikakhulu amanzi amdaka asekelwe kwi-acid, amanzi amdaka aqulethe i-ammonia kunye namanzi amdaka e-organic.
1. Amanzi amdaka ane-fluorine:
I-Hydrofluoric acid iba sisinyibilikisi esiphambili esisetyenziswa kwiinkqubo ze-oxidation kunye ne-etching ngenxa yeempawu zayo ze-oxidizing kunye ne-corrosive. Amanzi amdaka aqulethe i-fluorine kule nkqubo ikakhulu avela kwinkqubo yokusasazwa kunye nenkqubo yokupholisha ngoomatshini beekhemikhali kwinkqubo yokwenza iitship. Kwinkqubo yokucoca ii-silicon wafers kunye nezixhobo ezinxulumene nayo, i-hydrochloric acid ikwasetyenziswa amaxesha amaninzi. Zonke ezi nkqubo zigqitywa kwiitanki ezinikezelweyo ze-etching okanye izixhobo zokucoca, ngoko ke amanzi amdaka aqulethe i-fluorine anokukhutshwa ngokuzimeleyo. Ngokwe-concentration, inokwahlulwa ibe ngamanzi amdaka aqulethe i-fluorine ene-concentration ephezulu kunye namanzi amdaka aqulethe i-ammonia ene-concentration ephantsi. Ngokubanzi, i-concentration yamanzi amdaka aqulethe i-ammonia ene-concentration ephezulu inokufikelela kwi-100-1200 mg/L. Uninzi lweenkampani ziphinda zisebenzise le nxalenye yamanzi amdaka kwiinkqubo ezingadingi mgangatho wamanzi ophezulu.
2. Amanzi amdaka asekelwe kwi-asidi:
Phantse yonke inkqubo kwinkqubo yokwenziwa kweesekethe ezidityanisiweyo ifuna ukuba itshiphu icocwe. Okwangoku, i-sulfuric acid kunye ne-hydrogen peroxide zezona zinto zisetyenziswa kakhulu ekucoceni kwiisekhethe ezidityanisiweyo. Kwangaxeshanye, kusetyenziswa izinto ezisetyenziswa kwi-acid-base ezifana ne-nitric acid, i-hydrochloric acid kunye namanzi e-ammonia.
Amanzi amdaka ase-asidi kwinkqubo yokuvelisa aphuma kakhulu kwinkqubo yokucoca kwinkqubo yokuvelisa iitshiphusi. Kwinkqubo yokupakisha, itshiphusi iphathwa ngesisombululo se-asidi-base ngexesha lokufakelwa kwe-electroplating kunye nohlalutyo lweekhemikhali. Emva konyango, kufuneka ihlanjwe ngamanzi acocekileyo ukuvelisa amanzi amdaka okuhlamba asekelwe kwi-asidi-base. Ukongeza, ii-reagents ze-asidi-base ezifana ne-sodium hydroxide kunye ne-hydrochloric acid nazo zisetyenziswa kwisitishi samanzi acocekileyo ukuvuselela i-anion kunye ne-cation resins ukuvelisa amanzi amdaka okuvuselela i-asidi-base. Amanzi angasemva okuhlamba nawo aveliswa ngexesha lenkqubo yokuhlamba igesi yenkunkuma ese-asidi-base. Kwiinkampani zokuvelisa iisekethe ezidibeneyo, ubungakanani bamanzi amdaka ase-asidi-base bukhulu kakhulu.
3. Amanzi amdaka endalo:
Ngenxa yeenkqubo ezahlukeneyo zemveliso, ubungakanani bezinto eziphilayo ezisetyenziswa kwishishini le-semiconductor bahlukile kakhulu. Nangona kunjalo, njengezinto zokucoca, izinto eziphilayo zisasetyenziswa kakhulu kwiikhonkco ezahlukeneyo zokupakisha imveliso. Ezinye izinto eziphilayo zikhupha amanzi amdaka.
4. Amanye amanzi amdaka:
Inkqubo yokugrumba yenkqubo yokuvelisa i-semiconductor iya kusebenzisa isixa esikhulu se-ammonia, i-fluorine kunye namanzi acocekileyo kakhulu ukucoca ukungcola, ngaloo ndlela ivelisa ukukhutshwa kwamanzi amdaka ane-ammonia enoxinzelelo oluphezulu.
Inkqubo yokufakelwa i-electroplating iyadingeka kwinkqubo yokupakisha ye-semiconductor. Itship kufuneka icocwe emva kokufakelwa i-electroplating, kwaye amanzi amdaka okucoca i-electroplating aya kuveliswa kule nkqubo. Ekubeni ezinye iintsimbi zisetyenziswa kwi-electroplating, kuya kubakho ukukhutshwa kwee-ion zesinyithi kumanzi amdaka okucoca i-electroplating, njenge-lead, i-tin, i-disc, i-zinc, i-aluminium, njl.njl.
Igesi yenkunkuma
Ekubeni inkqubo ye-semiconductor ineemfuno eziphezulu kakhulu zokucoceka kwegumbi lokusebenza, iifeni zihlala zisetyenziselwa ukukhupha iintlobo ezahlukeneyo zeegesi zenkunkuma eziguquguqukayo ngexesha lenkqubo. Ke ngoko, ukukhutshwa kwegesi yenkunkuma kwishishini le-semiconductor kubonakala ngomthamo omkhulu wokukhupha umoya kunye noxinzelelo oluphantsi lokukhupha umoya. Ukukhutshwa kwegesi yenkunkuma nako kuguquguqukayo ikakhulu.
Ezi gesi zikhutshwayo zingahlulwahlulwa zibe ziindidi ezine: igesi ene-asidi, igesi ye-alkaline, igesi yenkunkuma yendalo kunye negesi enobuthi.
1. Igesi yenkunkuma esekwe kwi-asidi:
Igesi yenkunkuma esekwe kwi-asidi isuka kakhulu ekusasazweni,I-CVD, CMP kunye neenkqubo zokugrumba, ezisebenzisa isisombululo sokucoca esisekelwe kwi-asidi ukucoca i-wafer.
Okwangoku, isinyibilikisi sokucoca esisetyenziswa kakhulu kwinkqubo yokuvelisa i-semiconductor ngumxube we-hydrogen peroxide kunye ne-sulfuric acid.
Igesi engcolileyo eveliswa kwezi nkqubo iquka iigesi ezine-asidi ezifana ne-sulfuric acid, i-hydrofluoric acid, i-hydrochloric acid, i-nitric acid kunye ne-phosphoric acid, kwaye i-alkaline gas ikakhulu yi-ammonia.
2. Igesi yenkunkuma yendalo:
Igesi yenkunkuma yendalo ikakhulu ivela kwiinkqubo ezifana ne-photolithography, uphuhliso, ukukrola kunye nokusasazwa. Kwezi nkqubo, isisombululo se-organic (esifana ne-isopropyl alcohol) sisetyenziselwa ukucoca umphezulu we-wafer, kwaye igesi yenkunkuma eveliswa kukuguquguquka kwemozulu yenye yemithombo yegesi yenkunkuma yendalo;
Kwangaxeshanye, i-photoresist (i-photoresist) esetyenziswa kwinkqubo ye-photolithography kunye ne-etching inezinyibilikisi ze-organic eziguquguqukayo, ezifana ne-butyl acetate, ezitshintshatshintshayo ziye emoyeni ngexesha lenkqubo yokucubungula i-wafer, enye yemithombo yegesi yenkunkuma yendalo.
3. Igesi yenkunkuma enobungozi:
Igesi yenkunkuma enobuthi ikakhulu ivela kwiinkqubo ezifana ne-crystal epitaxy, i-dry etching kunye ne-CVD. Kwezi nkqubo, kusetyenziswa iintlobo ngeentlobo zeegesi ezikhethekileyo ezicocekileyo kakhulu ukucubungula i-wafer, ezifana ne-silicon (SiHj), i-phosphorus (PH3), i-carbon tetrachloride (CFJ), i-borane, i-boron trioxide, njl. Ezinye iigesi ezikhethekileyo zinobuthi, ziyafutha kwaye ziyabola.
Kwangaxeshanye, kwinkqubo yokugrumba nokucoca emva kokufakwa komphunga weekhemikhali kwimveliso ye-semiconductor, kufuneka isixa esikhulu segesi epheleleyo ye-oxide (PFCS), efana ne-NFS, i-C2F&CR, i-C3FS, i-CHF3, i-SF6, njl. Ezi compounds ezifakwe i-perfluorinated zifunxa ngamandla kwindawo yokukhanya kwe-infrared kwaye zihlala emoyeni ixesha elide. Ngokuqhelekileyo zithathwa njengomthombo ophambili wempembelelo ye-greenhouse yehlabathi.
4. Inkqubo yokupakisha igesi emdaka:
Xa kuthelekiswa nenkqubo yokwenziwa kwee-semiconductor, igesi elahliweyo eveliswa yinkqubo yokupakisha ii-semiconductor ilula kakhulu, ikakhulu igesi ene-asidi, i-epoxy resin kunye nothuli.
Igesi yenkunkuma eneasidi iveliswa ikakhulu kwiinkqubo ezifana nokufakelwa kwe-electroplating;
Igesi yenkunkuma yokubhaka iveliswa kwinkqubo yokubhaka emva kokuncamathisela nokuvala imveliso;
Umatshini wokusika uvelisa igesi emdaka equlethe uthuli lwe-silicon encinci ngexesha lenkqubo yokusika i-wafer.
Iingxaki zongcoliseko lokusingqongileyo
Kwiingxaki zongcoliseko lokusingqongileyo kwishishini le-semiconductor, iingxaki eziphambili ekufuneka zisonjululwe zezi:
· Ukukhutshwa okukhulu komoya ongcolileyo kunye neekhompawundi zendalo eziguquguqukayo (ii-VOC) kwinkqubo ye-photolithography;
· Ukukhutshwa kweekhompawundi ezifakwe i-perfluorinated (PFCS) kwiinkqubo zokugrumba i-plasma kunye neenkqubo zokufaka umphunga weekhemikhali;
· Ukusetyenziswa kwamandla namanzi ngobuninzi ekuveliseni nasekukhuseleni abasebenzi;
· Ukujonga ukuphinda kusetyenziswe izinto ezisetyenzisiweyo kunye nongcoliseko lwazo;
· Iingxaki zokusebenzisa iikhemikhali eziyingozi kwiinkqubo zokupakisha.
Imveliso ecocekileyo
Itekhnoloji yokuvelisa izixhobo ze-semiconductor ezicocekileyo ingaphuculwa ngokwezinto ezisetyenziswayo, iinkqubo kunye nolawulo lweenkqubo.
Ukuphucula izinto ezikrwada kunye namandla
Okokuqala, ubunyulu bezinto kufuneka bulawulwe ngokungqongqo ukuze kuncitshiswe ukungena kokungcola kunye namasuntswana.
Okwesibini, kufuneka kwenziwe uvavanyo lobushushu obahlukeneyo, ukufunyanwa kokuvuza, ukungcangcazela, ukutyholwa kombane ombane ophezulu kunye nezinye iimvavanyo kwiinxalenye ezingenayo okanye kwiimveliso ezigqityiweyo ngaphambi kokuba zifakwe kwimveliso.
Ukongeza, ubunyulu bezinto ezincedisayo kufuneka bulawulwe ngokungqongqo. Kukho ubuchwepheshe obuninzi obunokusetyenziswa ukuvelisa amandla ngendlela ecocekileyo.
Lungiselela inkqubo yemveliso
Ishishini le-semiconductor ngokwalo lizama ukunciphisa impembelelo yalo kwindalo esingqongileyo ngokuphucula iteknoloji yenkqubo.
Umzekelo, ngeminyaka yoo-1970, izinyibilikisi zendalo zazisetyenziswa kakhulu ukucoca ii-wafers kwitekhnoloji yokucoca iisekethe ezidibeneyo. Ngeminyaka yoo-1980, izisombululo ze-asidi kunye ne-alkali ezifana ne-sulfuric acid zazisetyenziswa ukucoca ii-wafers. Kude kube ngeminyaka yoo-1990, itekhnoloji yokucoca i-oxygen ye-plasma yaphuhliswa.
Ngokuphathelele ukupakisha, uninzi lweenkampani ngoku zisebenzisa iteknoloji ye-electroplating, eya kubangela ungcoliseko lwesinyithi esinzima kwindalo esingqongileyo.
Nangona kunjalo, iifektri zokupakisha eShanghai azisasebenzisi itekhnoloji ye-electroplating, ngoko ke akukho mpembelelo yesinyithi esinzima kwindalo esingqongileyo. Kunokufunyaniswa ukuba ishishini le-semiconductor linciphisa kancinci impembelelo yalo kwindalo esingqongileyo ngokuphucula inkqubo kunye nokutshintshwa kweekhemikhali kwinkqubo yalo yophuhliso, ekwalandela umkhwa wangoku wophuhliso lwehlabathi jikelele wokukhuthaza inkqubo kunye noyilo lwemveliso olusekelwe kwindalo esingqongileyo.
Okwangoku, kusenziwa uphuculo olungakumbi lwenkqubo yasekuhlaleni, kuquka:
·Ukutshintshwa kunye nokunciphisa igesi ye-all-ammonium PFCS, njengokusebenzisa igesi ye-PFCs enefuthe eliphantsi le-greenhouse ukutshintsha igesi enefuthe eliphezulu le-greenhouse, njengokuphucula ukuhamba kwenkqubo kunye nokunciphisa ubungakanani begesi ye-PFCS esetyenziswayo kwinkqubo;
·Ukuphucula ukucocwa kweewafer ezininzi ukuya ekucocweni kweewafer enye ukuze kuncitshiswe inani leekhemikhali zokucoca ezisetyenziswa kwinkqubo yokucoca.
·Ulawulo olungqongqo lwenkqubo:
a. Ukuqonda ukuzenzekelayo kwenkqubo yokuvelisa, okunokufezekisa ukucutshungulwa ngokuchanekileyo kunye nemveliso yebhetshi, kunye nokunciphisa izinga eliphezulu leempazamo zokusebenza ngesandla;
b. Izinto ezingcolisa kakhulu, malunga ne-5% okanye ngaphantsi kokulahleka kwesivuno kubangelwa ngabantu kunye nokusingqongileyo. Izinto ezingcolisa kakhulu ziquka ukucoceka komoya, amanzi acocekileyo kakhulu, umoya ocinezelweyo, i-CO2, i-N2, ubushushu, ukufuma, njl.njl. Inqanaba lokucoceka kwindawo yokusebenzela ecocekileyo lidla ngokulinganiswa linani eliphezulu lamasuntswana avumelekileyo ngeyunithi nganye yomthamo womoya, oko kukuthi, uxinaniso lobuninzi bamasuntswana;
c. Qinisa ukubhaqwa, kwaye ukhethe amanqaku abalulekileyo okubhaqwa kwiindawo zokusebenza ezinenkunkuma eninzi ngexesha lenkqubo yokuvelisa.
Wamkelekile nabathengi abavela kwihlabathi liphela ukuba basityelele ukuze sixoxe ngakumbi!
https://www.vet-china.com/
https://www.facebook.com/people/Ningbo-Miami-Advanced-Material-Technology-Co-Ltd/100085673110923/
https://www.linkedin.com/company/100890232/admin/page-posts/published/
https://www.youtube.com/@user-oo9nl2qp6j
Ixesha lokuthumela: Agasti-13-2024