haɓakawa a cikin fakitin digiri na wafer na fan-Out Ta hanyar taurarewar ultraviolet

An san fankewar wafer degree fanke (FOWLP) a masana'antar semiconductor da cewa tana da araha, amma ba tare da ƙalubalen ta ba. Ɗaya daga cikin manyan matsalolin da ake fuskanta shine warp da bit farawa yayin aikin ƙera. warp na iya zama sakamakon raguwar sinadarai na mahaɗin ƙera da rashin daidaito a cikin yawan faɗaɗa zafi, yayin da farawa ke faruwa saboda yawan abubuwan cikawa a cikin kayan ƙera syrup. Duk da haka, tare da taimakonAI da ba a iya ganowa ba, ana gudanar da bincike don shawo kan waɗannan ƙalubalen.

DELO, wani kamfani mai jagoranci a masana'antar, yana gudanar da binciken yuwuwar magance wannan matsala ta hanyar haɗa ɗan ƙaramin abu da ke amfani da kayan manne mai ƙarancin ɗanko da kuma taurarewar ultraviolet. Idan aka kwatanta da warpage na kayan daban-daban, an gano cewa taurarewar ultraviolet yana rage warp sosai a lokacin sanyaya bayan ƙera. Amfani da kayan taurarewar ultraviolet ba wai kawai yana rage buƙatar cikawa ba, har ma yana rage danko da kuma ƙarfin Young's modulus, wanda a ƙarshe yana rage bit ɗin farawa. Wannan haɓakawa a fasaha yana nuna yuwuwar fakitin matakin wafer na shugaban samfurin tare da ƙaramin warpage da farkon bit.

Gabaɗaya, binciken ya nuna fa'idar amfani da tauri na ultraviolet a cikin tsarin ƙera manyan wurare, yana ba da mafita ga ƙalubalen da ake fuskanta a cikin marufi na digiri na wafer-out. Tare da ikon rage warpage da canjin mutu, yayin da kuma gyara fim akan lokacin tauri da amfani da kuzari, farfesa na tauri na ultraviolet ya zama dabarar alkawari a masana'antar semiconductor. Duk da bambancin da ke tsakanin ma'aunin faɗaɗa zafi tsakanin kayan aiki, amfani da tauri na ultraviolet yana ba da zaɓi mai yiwuwa don inganta inganci da ingancin marufi na digiri na wafer.