Kuisa mawafer degree packaging (FOWLP) muindasitiri yesemiconductor kunozivikanwa nekushandisa mari shoma, asi kune dambudziko rayo. Dambudziko guru rinosangana naro i warp ne bit begin panguva yekuumba. warp inogona kukonzerwa nekuderera kwemakemikari e molding compound uye kusawirirana mu coefficient ye thermal expansion, nepo kutanga kuchikonzerwa nehuwandu hwakawanda hwe filler mu syrupy molding material. Zvisinei, nerubatsiro rweAI isingaonekweMhinduro dziri kuitwa kuti matambudziko aya akunde.
DELO, kambani inotungamira muindasitiri iyi, inoita ongororo yekugadzirisa nyaya iyi nekubatanidza zvishoma pane chinhu chinonamira chine low viscosity uye ultraviolet hardening. Kana tichienzanisa warpage yezvinhu zvakasiyana, zvakaonekwa kuti ultraviolet hardening inoderedza zvakanyanya warp panguva yekutonhora mushure mekuumba. Kushandiswa kwe ultraviolet hardening material hakungoderedzi chete kudiwa kwekuzadza asiwo kuderedza viscosity uye Young's modulus, pakupedzisira kuderedza bit beginning. Iyi promotion mu tekinoroji inoratidza mukana wekugadzira bit leader fan out wafer degree packaging ine warpage shoma uye bit beginning.
Pakazara, tsvakiridzo iyi inoratidza kubatsira kwekushandisa ultraviolet hardening mukugadzira nzvimbo yakakura, inopa mhinduro kumatambudziko anotarisana nawo mukuisa wafer-out wafer-degree. Nekukwanisa kuderedza warpage uye die shift, ukuwo kugadzirisa firimu pakushandisa simba uye nguva yekuomesa, purofesa we ultraviolet hardening ave nzira yakanaka muindasitiri ye semiconductor. Pasinei nemusiyano wekuwedzera kwekushisa pakati pezvinhu, kushandiswa kwe ultraviolet hardening kune sarudzo inogoneka yekuvandudza kushanda zvakanaka uye kunaka kwekuisa wafer-degree.
Nguva yekutumira: Gumiguru-28-2024