Ukupakisha i-wafer degree degree (FOWLP) kwishishini le-semiconductor yaziwa ngokuba nexabiso eliphantsi, kodwa ayisiyongxaki. Enye yeengxaki eziphambili ezijongene nazo kukuqala kwe-warp kunye ne-bit ngexesha lenkqubo yokubumba. I-warp inokubangelwa kukuncipha kweekhemikhali ze-molding compound kunye nokungafani kwi-coefficient yokwanda kobushushu, ngelixa ukuqala kwenzeka ngenxa yomxholo ophezulu wokuzalisa kwi-syruppy molding material. Nangona kunjalo, ngoncedo lwei-AI engabonakaliyoIsisombululo sisaqhutywa ukuze kuphuculwe le mingeni.
I-DELO, inkampani ephambili kushishino, yenza uphando lokwenzeka kwezinto ukuze ijongane nale ngxaki ngokudibanisa kancinci kwi-carrier exploition low viscosity adhesive material kunye ne-ultraviolet hardening. Ngokuthelekisa i-warpage yezinto ezahlukeneyo, kufunyenwe ukuba ukuqina kwe-ultraviolet kunciphisa kakhulu i-warp ngexesha lokuphola emva kokubumba. Ukusetyenziswa kwezinto zokuqinisa i-ultraviolet akunciphisi nje kuphela imfuneko yokuzalisa kodwa kukwanciphisa i-viscosity kunye ne-Young's modulus, ekugqibeleni ukunciphisa i-bit beginning. Olu khuthazo kwitekhnoloji lubonisa amandla okupakisha i-wafer degree degree kunye ne-warpage encinci kunye ne-bit beginning.
Ngokubanzi, uphando lubonisa inzuzo yokusebenzisa ukuqina kwe-ultraviolet kwinkqubo yokubumba kwindawo enkulu, kunika isisombululo kwimingeni ejongene nayo ekupakisheni kwe-wafer-degree ye-fan. Ngokukwazi ukunciphisa i-warpage kunye ne-die shift, ngelixa kuhlengahlengiswa ixesha lokuqina kunye nokusetyenziswa kwamandla, uprofesa wokuqina kwe-ultraviolet uyindlela ethembisayo kwishishini le-semiconductor. Nangona kukho umahluko kwi-thermal expansion coefficient phakathi kwezinto, ukusetyenziswa kokuqina kwe-ultraviolet kunika ukhetho olunokwenzeka lokuphucula ukusebenza kunye nomgangatho wokupakisha kwe-wafer degree.
Ixesha leposi: Okthobha-28-2024