Kupaka ma wafer degree (FOWLP) mumakampani opanga ma semiconductor kumadziwika kuti ndi kotsika mtengo, koma sikuti sikuli kopanda vuto. Vuto lalikulu lomwe likukumana nalo ndi kuyamba kwa warp ndi bit panthawi yopangira umba. warp ikhoza kuonedwa ngati kuchepa kwa mankhwala a umba ndi kusalingana kwa coefficient of thermal expansion, pomwe kuyamba kumachitika chifukwa cha kuchuluka kwa filler mu zinthu zopangira manyuchi. Komabe, mothandizidwa ndiAI yosaoneka, njira yothetsera mavutowa ikufufuzidwa kuti ithetse mavutowa.
DELO, kampani yotsogola mumakampani, imachita kafukufuku wofunikira kuti ithetse vutoli polumikiza pang'ono pa chonyamulira chogwiritsa ntchito zinthu zomatira zotsika kwambiri komanso kuuma kwa ultraviolet. Poyerekeza kuuma kwa zinthu zosiyanasiyana, zidapezeka kuti kuuma kwa ultraviolet kumachepetsa kwambiri kuuma panthawi yozizira pambuyo poumba. Kugwiritsa ntchito zinthu zomatira za ultraviolet sikungochepetsa kufunikira kwa filler komanso kuchepetsa kuuma kwa Young, zomwe pamapeto pake zimachepetsa kuuma kwa bit. Kukwezedwa kumeneku muukadaulo kukuwonetsa kuthekera kwa kupanga ma CD a wafer degree ndi ma warpage ochepa komanso bit beginning.
Ponseponse, kafukufukuyu akuwonetsa ubwino wogwiritsa ntchito kuuma kwa ultraviolet mu njira yayikulu yopangira zinthu, kupereka yankho ku mavuto omwe amakumana nawo mu ma CD a wafer-out. Pokhala ndi kuthekera kochepetsa kuuma ndi kusintha kwa kutentha, komanso kusintha filimu pa nthawi youma ndi kugwiritsa ntchito mphamvu, pulofesa wa ultraviolet hardiness ndi njira yabwino kwambiri mumakampani opanga ma semiconductor. Ngakhale kusiyana kwa kutentha pakati pa zinthu, kugwiritsa ntchito ultraviolet hardiness kumapereka njira yabwino yowonjezerera magwiridwe antchito ndi ubwino wa ma CD a wafer.
Nthawi yotumizira: Okutobala-28-2024