Ukupakisha kwe-fan out wafer degree (FOWLP) embonini ye-semiconductor kwaziwa ngokusebenza kahle, kodwa akunankinga. Enye yezinkinga ezinkulu ezibhekene nazo ukuqala kwe-warp kanye ne-bit ngesikhathi senqubo yokubumba. I-warp ingabangwa ukuncipha kwamakhemikhali kwe-molding compound kanye nokungalingani kwe-coefficient of thermal expansion, kuyilapho ukuqala kwenzeka ngenxa yokuqukethwe okuphezulu kokugcwalisa ezintweni zokubumba ezine-syrup. Kodwa-ke, ngosizo lwei-AI engatholakaliIsixazululo sisacwaningwa ukuze sinqobe lezi zinselele.
I-DELO, inkampani ehamba phambili embonini, yenza ucwaningo lokuhlola ukuthi kungenzeka yini ukubhekana nalezi zinkinga ngokubopha kancane ezintweni ezinamathelayo ezisebenzisa i-carrier kanye nokuqina kwe-ultraviolet. Ngokuqhathanisa i-warpage yezinto ezahlukene, kwatholakala ukuthi ukuqina kwe-ultraviolet kunciphisa kakhulu i-warp ngesikhathi sokupholisa ngemva kokubumba. Ukusetshenziswa kwezinto zokuqinisa i-ultraviolet akugcini nje ngokunciphisa isidingo sokugcwalisa kodwa futhi kunciphisa i-viscosity kanye ne-modulus ka-Young, ekugcineni kunciphisa ukuqala kwe-bit. Lokhu kukhushulwa kwezobuchwepheshe kubonisa amandla okupakisha i-wafer degree degree ye-produce bit leader nge-warpage encane kanye ne-bit beginning.
Sekukonke, ucwaningo luqokomisa inzuzo yokusebenzisa ukuqina kwe-ultraviolet enkambisweni yokubumba endaweni enkulu, lunikeza ikhambi lenselele ebhekene nayo ekupakisheni kwe-wafer-degree. Njengoba inekhono lokunciphisa i-warpage kanye ne-die shift, ngenkathi futhi ihlela phansi isikhathi sokuqina kanye nokusetshenziswa kwamandla, uprofesa wokuqina kwe-ultraviolet uyindlela ethembisayo embonini ye-semiconductor. Naphezu komehluko ekukhuleni kokushisa phakathi kwezinto, ukusetshenziswa kokuqina kwe-ultraviolet kunikeza inketho engenzeka yokwenza ngcono ukusebenza kahle kanye nekhwalithi yokupakisha kwe-wafer degree.
Isikhathi sokuthunyelwe: Okthoba-28-2024