Ukadaulo wa laser ukutsogolera kusintha kwa ukadaulo wokonza zinthu za silicon carbide substrate

 

1. Chidule chasilicon carbide substrateukadaulo wokonza zinthu

Apanosilicon carbide substrate Njira zokonzera zinthu zikuphatikizapo: kupukuta bwalo lakunja, kudula, kupukuta, kupukuta, ndi zina zotero. Kudula ndi gawo lofunika kwambiri pakupanga zinthu za semiconductor substrate komanso gawo lofunika kwambiri pakusintha ingot kukhala substrate. Pakadali pano, kudula kwamagawo a silicon carbideKudula waya pogwiritsa ntchito mawaya ambiri ndiyo njira yabwino kwambiri yodulira waya pakadali pano, koma pakadali pano pali mavuto a khalidwe loipa komanso kutayika kwakukulu kwa kudula waya. Kutayika kwa kudula waya kudzawonjezeka ndi kukula kwa substrate, zomwe sizingathandizesilicon carbide substrateopanga kuti achepetse ndalama komanso kuti azitha kugwiritsa ntchito bwino zinthu. Mu ndondomeko yochepetseraKabide ya silicon ya mainchesi 8 magawo, mawonekedwe a pamwamba pa gawo lapansi omwe amapezeka podula waya ndi otsika, ndipo makhalidwe a manambala monga WARP ndi BOW si abwino.

Kuduladula ndi gawo lofunika kwambiri pakupanga zinthu za semiconductor substrate. Makampaniwa akuyesera njira zatsopano zodulira, monga kudula waya wa diamondi ndi kudula laser. Ukadaulo wodula laser wakhala ukufunidwa kwambiri posachedwapa. Kuyambitsidwa kwa ukadaulo uwu kumachepetsa kutayika kwa kudula ndikuwonjezera magwiridwe antchito odulira kuchokera ku mfundo yaukadaulo. Njira yodulira laser ili ndi zofunikira kwambiri pamlingo wa automation ndipo imafuna ukadaulo wochepetsera kuti ugwirizane nawo, zomwe zikugwirizana ndi njira yamtsogolo yopangira silicon carbide substrate. Kuchuluka kwa magawo a kudula waya wa matope achikhalidwe nthawi zambiri kumakhala 1.5-1.6. Kuyambitsidwa kwa ukadaulo wodula laser kumatha kuwonjezera kuchuluka kwa magawo kufika pafupifupi 2.0 (onani zida za DISCO). Mtsogolo, pamene ukadaulo wodula laser ukuwonjezeka, kuchuluka kwa magawo kumatha kukwera kwambiri; nthawi yomweyo, kudula laser kumathanso kusintha kwambiri magwiridwe antchito odula. Malinga ndi kafukufuku wamsika, mtsogoleri wamakampani a DISCO amadula chidutswa pafupifupi mphindi 10-15, zomwe zimakhala zogwira mtima kwambiri kuposa kudula waya wa matope komwe kukuchitika pano kwa mphindi 60 pa chidutswa chilichonse.

Njira zodulira waya zachikhalidwe za silicon carbide substrates ndi izi: kudula waya - kupukuta bwino - kupukuta bwino - kupukuta bwino komanso kupukuta bwino. Pambuyo poti njira yochotsera waya ya laser yalowa m'malo mwa kudula waya, njira yochepetsera imagwiritsidwa ntchito m'malo mwa njira yopera, zomwe zimachepetsa kutayika kwa zidutswa ndikuwonjezera magwiridwe antchito. Njira yochotsera, kupukuta ndi kupukuta ya silicon carbide substrates ya laser yagawidwa m'magawo atatu: laser surface scanning - substrate stripping - ingot flattening: laser surface scanning ndi kugwiritsa ntchito ultrafast laser pulses kukonza pamwamba pa ingot kuti apange wosanjikiza wosinthidwa mkati mwa ingot; substrate stripping ndi kulekanitsa substrate pamwamba pa wosanjikiza wosinthidwa ndi ingot pogwiritsa ntchito njira zakuthupi; ingot flattening ndi kuchotsa wosanjikiza wosinthidwa pamwamba pa ingot kuti muwonetsetse kuti pamwamba pa ingot pali bata.
Njira yochotsera silicon carbide laser

 

2. Kupita patsogolo kwapadziko lonse muukadaulo wochotsa laser ndi makampani omwe akutenga nawo mbali mumakampani

Njira yochotsera mawaya a laser idayambitsidwa koyamba ndi makampani akunja: Mu 2016, DISCO yaku Japan idapanga ukadaulo watsopano wodula mawaya a laser KABRA, womwe umapanga gawo lolekanitsa ndikulekanitsa mawaya pamlingo winawake mwa kuwalitsa mawaya a SiC nthawi zonse, omwe angagwiritsidwe ntchito pamitundu yosiyanasiyana ya mawaya a SiC. Mu Novembala 2018, Infineon Technologies idagula Siltectra GmbH, kampani yodulira mawaya a wafer, pamtengo wa ma euro 124 miliyoni. Yomalizayi idapanga njira ya Cold Split, yomwe imagwiritsa ntchito ukadaulo wa laser wovomerezeka kuti ifotokoze kuchuluka kwa mawaya, kuphimba zipangizo zapadera za polima, kupsinjika komwe kumabwera chifukwa cha kuzizira kwa dongosolo lowongolera, kugawa zinthu molondola, ndikupukuta ndikuyeretsa kuti mukwaniritse kudula mawaya a wafer.

M'zaka zaposachedwapa, makampani ena am'nyumba nawonso alowa mumakampani opanga zida zochotsera magetsi pogwiritsa ntchito laser: makampani akuluakulu ndi Han's Laser, Delong Laser, West Lake Instrument, Universal Intelligence, China Electronics Technology Group Corporation ndi Institute of Semiconductors of the Chinese Academy of Sciences. Pakati pawo, makampani omwe atchulidwa Han's Laser ndi Delong Laser akhala akukonzedwa kwa nthawi yayitali, ndipo zinthu zawo zikutsimikiziridwa ndi makasitomala, koma kampaniyo ili ndi mitundu yambiri yazinthu, ndipo zida zochotsera magetsi pogwiritsa ntchito laser ndi imodzi mwamabizinesi awo. Zinthu za akatswiri omwe akutukuka monga West Lake Instrument zafika potumiza zinthu mwalamulo; Universal Intelligence, China Electronics Technology Group Corporation 2, Institute of Semiconductors of the Chinese Academy of Sciences ndi makampani ena nawonso atulutsa kupita patsogolo kwa zida.

 

3. Zinthu zomwe zimapangitsa kuti pakhale chitukuko cha ukadaulo wochotsa laser komanso momwe msika ukuyambira

Kutsika kwa mitengo ya ma substrate a silicon carbide a mainchesi 6 kukuyendetsa chitukuko cha ukadaulo wochotsa laser: Pakadali pano, mtengo wa ma substrate a silicon carbide a mainchesi 6 watsika pansi pa 4,000 yuan/chidutswa, zomwe zikuyandikira mtengo wa opanga ena. Njira yochotsera laser ili ndi chiwongola dzanja chambiri komanso phindu lalikulu, zomwe zimapangitsa kuti chiwongola dzanja cha ukadaulo wochotsa laser chiwonjezeke.

Kuchepa kwa ma substrate a silicon carbide a mainchesi 8 kumayendetsa chitukuko cha ukadaulo wochotsa laser: Kukhuthala kwa ma substrate a silicon carbide a mainchesi 8 pakadali pano ndi 500um, ndipo kukukula kufika pa makulidwe a 350um. Njira yodulira waya sigwira ntchito bwino pokonza ma carbide a silicon a mainchesi 8 (pamwamba pa substrate sipabwino), ndipo ma values ​​a BOW ndi WARP achepa kwambiri. Kuchotsa laser kumaonedwa ngati ukadaulo wofunikira wokonza ma substrate a silicon carbide a 350um, zomwe zimapangitsa kuti ukadaulo wochotsa laser uchuluke.

Zomwe msika ukuyembekezera: Zipangizo zochotsera laser za SiC substrate zimapindula ndi kukulitsa kwa SiC ya mainchesi 8 komanso kuchepetsa mtengo wa SiC ya mainchesi 6. Mfundo yofunika kwambiri pamakampani pano ikuyandikira, ndipo chitukuko cha makampani chidzafulumira kwambiri.