Tekinoroji yeLaser inotungamira kushandurwa kwetekinoroji yekugadzirisa silicon carbide substrate

 

1. Pfupiso yesilicon carbide substratetekinoroji yekugadzirisa

Iyo yazvinosilicon carbide substrate Matanho ekugadzirisa anosanganisira: kukuya denderedzwa rekunze, kucheka, kupwanya, kupukuta, kuchenesa, nezvimwewo. Kucheka idanho rakakosha mukugadzirisa substrate ye semiconductor uye danho guru mukushandura ingot kuita substrate. Parizvino, kucheka kwesilicon carbide substratesKucheka waya zvakanyanya. Kucheka waya uchishandisa waya dzakawanda ndiyo nzira yakanakisisa yekucheka waya parizvino, asi kuchine matambudziko emhando isina kunaka yekucheka uye kurasikirwa kukuru kwekucheka. Kurasikirwa kwekucheka waya kuchawedzera nekuwedzera kwehukuru hwe substrate, izvo zvisingabatsiresilicon carbide substratevagadziri kuti vaderedze mitengo uye vawedzere kushanda zvakanaka. Munguva yekucheka8-inch silicon carbide zvigadziko, chimiro chepamusoro che substrate chinowanikwa nekucheka waya hachina kunaka, uye hunhu hwenhamba dzakadai seWARP neBOW hahuna kunaka.

Kucheka inhanho huru mukugadzira ma substrate e semiconductor. Indasitiri iyi iri kuramba ichiedza nzira itsva dzekucheka, dzakadai sekucheka waya yedhaimani uye kubvisa ne laser. Tekinoroji yekubvisa ne laser yave ichitsvakwa zvikuru munguva pfupi yapfuura. Kuunzwa kwetekinoroji iyi kunoderedza kurasikirwa kwekucheka uye kunovandudza kushanda zvakanaka kwekucheka kubva pamusimboti wehunyanzvi. Mhinduro yekubvisa ne laser ine zvinodiwa zvakanyanya zvemazinga e automation uye inoda tekinoroji yekutetepa kuti ishande pamwe nayo, izvo zvinoenderana negwara rekuvandudza remangwana rekugadzirisa silicon carbide substrate. Kugohoka kwezvidimbu zvekucheka netambo yemortar yechinyakare kunowanzova 1.5-1.6. Kuunzwa kwetekinoroji yekubvisa ne laser kunogona kuwedzera goho rezvidimbu kusvika pa2.0 (tarisa michina yeDISCO). Mune ramangwana, sezvo kukura kwetekinoroji yekubvisa ne laser kuchiwedzera, goho rezvidimbu rinogona kuvandudzwa zvakanyanya; panguva imwe chete, kubvisa ne laser kunogonawo kuvandudza kushanda zvakanaka kwekucheka. Sekureva kwekutsvaga kwemusika, mutungamiri weindasitiri yeDISCO anocheka zvidimbu mumaminitsi angangoita 10-15, izvo zvinoshanda zvakanyanya kupfuura kuchekwa kwetambo yemortar yemaminitsi makumi matanhatu pachidimbu chimwe nechimwe.

Matanho ekugadzirisa waya dzechinyakare dzesilicon carbide substrates ndeaya: kucheka waya - kukuya zvisina kurongeka - kupukuta zvakanaka - kupukuta zvisina kurongeka uye kupukuta zvakanaka. Mushure mekunge laser stripping yatsiva waya, nzira yekutetepa inoshandiswa kutsiva grinding, izvo zvinoderedza kurasikirwa kwezvidimbu uye zvinovandudza mashandiro ekugadzirisa. Maitiro ekucheka, kupukuta uye kupukuta silicon carbide substrates nelaser akakamurwa kuita matanho matatu: laser surface scanning - substrate stripping - ingot flattening: laser surface scanning ndeyekushandisa ultrafast laser pulses kugadzirisa pamusoro pe ingot kuti igadzire modified layer mukati me ingot; substrate stripping ndeyekuparadzanisa substrate pamusoro pe modified layer kubva ku ingot nenzira dzepanyama; ingot flattening ndeyekubvisa modified layer pamusoro pe ingot kuti ive nechokwadi chekuti ingot surface iri flattened.
Maitiro ekubvisa silicon carbide laser

 

2. Kufambira mberi kwenyika dzakawanda muhunyanzvi hwekubvisa laser uye makambani ari kutora chikamu muindasitiri

Maitiro ekubvisa mawafer nelaser akatanga kushandiswa nemakambani ekune dzimwe nyika: Muna 2016, DISCO yekuJapan yakagadzira tekinoroji itsva yekucheka nelaser KABRA, iyo inoumba chikamu chekuparadzanisa uye inoparadzanisa mawafer pakadzika yakatarwa nekugara ichipisa ingot nelaser, iyo inogona kushandiswa kune mhando dzakasiyana dzeSiC ingots. Muna Mbudzi 2018, Infineon Technologies yakatenga Siltectra GmbH, kambani yekucheka wafer, nemamiriyoni zana nemakumi maviri nemana emaeuro. Iyo yekupedzisira yakagadzira maitiro eCold Split, ayo anoshandisa tekinoroji yelaser yakabvumidzwa kutsanangura huwandu hwekupatsanura, kuputira zvinhu zvepolymer zvakakosha, kudzora kutonhora kunokonzerwa nekushushikana, kupatsanura zvinhu nemazvo, uye kukuya nekuchenesa kuti zviite kuchekwa kwewafer.

Mumakore achangopfuura, mamwe makambani emuno akapindawo muindasitiri yemidziyo yekubvisa michina nelaser: makambani makuru iHan's Laser, Delong Laser, West Lake Instrument, Universal Intelligence, China Electronics Technology Group Corporation uye Institute of Semiconductors yeChinese Academy of Sciences. Pakati pavo, makambani akanyorwa Han's Laser neDelong Laser ave ari muchimiro kwenguva yakareba, uye zvigadzirwa zvavo zviri kusimbiswa nevatengi, asi kambani ine mhando dzakawanda dzezvigadzirwa, uye michina yekubvisa michina nelaser ndeimwe yebhizinesi ravo. Zvigadzirwa zvenyeredzi dziri kusimuka dzakadai seWest Lake Instrument zvakawana kutumirwa kwepamutemo; Universal Intelligence, China Electronics Technology Group Corporation 2, Institute of Semiconductors yeChinese Academy of Sciences nedzimwe makambani dzakaburitsawo kufambira mberi kwemidziyo.

 

3. Zvinhu zvinotungamira kukura kwetekinoroji yekubvisa laser uye kurongeka kwekuuya kwemusika

Kuderedzwa kwemitengo yezvikamu zvesilicon carbide zvemainji matanhatu (6-inch) kunoita kuti tekinoroji yekubvisa zvinhu nelaser ibudirire: Parizvino, mutengo wezvikamu zvesilicon carbide zvemainji matanhatu (6-inch) waderera pasi pe4,000 yuan/chidimbu, zvichisvika pamutengo wevamwe vagadziri. Maitiro ekubvisa zvinhu nelaser ane mwero wepamusoro wegoho uye purofiti yakasimba, izvo zvinoita kuti mwero wekupinda kwehunyanzvi hwekubvisa zvinhu nelaser uwedzere.

Kutetepa kwe 8-inch silicon carbide substrates kunotungamira kukura kwetekinoroji ye laser stripping: Ukobvu hwe 8-inch silicon carbide substrates parizvino huri 500um, uye huri kukura kusvika paukobvu hwe 350um. Maitiro ekucheka waya haashande mu 8-inch silicon carbide processing (pamusoro pe substrate hapasi pakanaka), uye BOW neWARP values ​​zvadzikira zvakanyanya. Laser stripping inoonekwa se tekinoroji inodiwa yekugadzirisa 350um silicon carbide substrate processing, izvo zvinoita kuti mwero wekupinda kwe laser stripping uwedzere.

Zvinotarisirwa pamusika: Midziyo yekubvisa laser yeSiC substrate inobatsirwa nekuwedzera kwe8-inch SiC uye kudzikiswa kwemitengo ye6-inch SiC. Chinhu chakakosha pari zvino chiri kuswedera pedyo, uye kukura kweindasitiri kuchakurumidziswa zvikuru.