Ikoranabuhanga rya laser riyobora impinduka mu ikoranabuhanga ryo gutunganya substrate ya silicon carbide

 

1. Incamake yasubstrate ya karubide ya silikoniikoranabuhanga ryo gutunganya

Ingufu z'amashanyarazisubstrate ya karubide ya silikoni Intambwe zo gutunganya zirimo: gusya uruziga rw'inyuma, gukata, gukata, gusya, gusiga irangi, gusukura, nibindi. Gukata ni intambwe y'ingenzi mu gutunganya substrate ya semiconductor kandi ni intambwe y'ingenzi mu guhindura ingot muri substrate. Kuri ubu, gukatasubstrates za silicon carbideahanini ni ugukata insinga. Gukata insinga nyinshi ni bwo buryo bwiza bwo gukata insinga muri iki gihe, ariko haracyari ibibazo by’ubwiza bubi bwo gukata no gutakaza cyane. Gutakaza insinga biziyongera uko ingano y’ubutaka yiyongera, ibyo bikaba bitagirira akamarosubstrate ya karubide ya silikoniinganda kugira ngo zigabanye ikiguzi kandi zinoze imikorere. Mu gihe cyo kugabanyaKarubide ya silikoni ya santimetero 8 ibibanza, imiterere y'ubuso bw'icyuma cyakozwe hakoreshejwe insinga ni mibi, kandi imiterere y'imibare nka WARP na BOW ntabwo ari myiza.

Gukata ni intambwe y'ingenzi mu gukora substrate za semiconductor. Inganda zihora zigerageza uburyo bushya bwo gukata, nko gukata insinga za diyama no gukata laser. Ikoranabuhanga ryo gukata laser ryashakishijwe cyane vuba aha. Ishyirwaho ry'iri koranabuhanga rigabanya igihombo cyo gukata kandi rinoza imikorere myiza yo gukata uhereye ku ihame rya tekiniki. Igisubizo cyo gukata laser gifite ibisabwa byinshi ku rwego rwo kwikora kandi gisaba ikoranabuhanga ryo kugabanya kugira ngo gifatanye nacyo, ibi bikaba bihuye n'icyerekezo cy'iterambere ry'ejo hazaza ryo gutunganya substrate ya silicon carbide. Umusaruro w'uduce tw'insinga za mortical usanzwe muri rusange ni 1.5-1.6. Ishyirwaho ry'ikoranabuhanga ryo gukata laser rishobora kongera umusaruro w'uduce ukagera kuri 2.0 (reba ibikoresho bya DISCO). Mu gihe kizaza, uko ikoranabuhanga ryo gukata laser rigenda ryiyongera, umusaruro w'uduce ushobora kunozwa kurushaho; muri icyo gihe, gukata laser nabyo bishobora kunoza cyane imikorere yo gukata. Dukurikije ubushakashatsi ku isoko, umuyobozi w'inganda DISCO agabanya agace mu minota 10-15, bikaba bikora neza cyane kuruta gukata insinga za mortical mu minota 60 kuri buri gace.

Intambwe zo guca insinga gakondo za silicon carbide substrates ni izi: guca insinga-gusya neza-gusya neza-gusukura neza no gusya neza. Nyuma y'uko uburyo bwo guca insinga bwa laser busimbura gukata insinga, uburyo bwo gukata bukoreshwa mu gusimbuza uburyo bwo gusya, bigabanya gutakaza ibice kandi bikanoza imikorere myiza. Uburyo bwo guca insinga bwa laser bwo guca, gusya no gusukura substrates za silicon carbide bugabanyijemo intambwe eshatu: gucana ubuso bwa laser-gusuka substrate-gusuka ingot: gucana ubuso bwa laser ni ugukoresha pulses za laser zihuta cyane kugira ngo hakorwe urwego rwahinduwe imbere muri ingot; gucana substrate ni ugutandukanya substrate hejuru y'urwego rwahinduwe n'ingot hakoreshejwe uburyo bwa physique; gucana ingot ni ugukuraho urwego rwahinduwe ku buso bwa ingot kugira ngo hamenyekane ko ubuso bwa ingot bugororotse.
Uburyo bwo gukuraho karuboni ya silikoni hakoreshejwe laser

 

2. Iterambere mpuzamahanga mu ikoranabuhanga ryo gukuraho imirasire ya laser n'ibigo byitabira inganda

Uburyo bwo gukuraho imirasire ya laser bwatangiye gukoreshwa n'amasosiyete yo mu mahanga: Mu 2016, DISCO yo mu Buyapani yateguye ikoranabuhanga rishya ryo gukata imirasire ya laser KABRA, rikora urwego rwo gutandukanya imirasire ya laser no gutandukanya imirasire ku bujyakuzimu bwihariye binyuze mu gukaraba imirasire ya laser, ishobora gukoreshwa ku bwoko butandukanye bwa imirasire ya SiC. Mu Gushyingo 2018, Infineon Technologies yaguze Siltectra GmbH, ikigo gishya cyo gukata imirasire ya wafer, ku mafaranga miliyoni 124 z'amayero. Iyi ya nyuma yateguye uburyo bwa Cold Split, bukoresha ikoranabuhanga rya laser ryemewe kugira ngo bumenye urwego rwo gukata imirasire, bugapfuka ibikoresho byihariye bya polymer, bugatuma habaho gukonjesha, bugacamo ibice neza ibikoresho, kandi bugasya bugasukura kugira ngo bugere ku gukata imirasire ya wafer.

Mu myaka ya vuba aha, amwe mu masosiyete yo mu gihugu yinjiye mu nganda z’ibikoresho byo gukuraho imashini hakoreshejwe laser: amasosiyete akomeye ni Han's Laser, Delong Laser, West Lake Instrument, Universal Intelligence, China Electronics Technology Group Corporation na Institute of Semiconductors of the Chinese Academy of Sciences. Muri yo, amasosiyete yavuzwe Han's Laser na Delong Laser amaze igihe kinini akorera mu nyubako, kandi ibicuruzwa byayo biri gusuzumwa n’abakiriya, ariko isosiyete ifite imirongo myinshi y’ibicuruzwa, kandi ibikoresho byo gukuraho imashini hakoreshejwe laser ni kimwe mu bikorwa byabo gusa. Ibicuruzwa by’ibyamamare bizamuka nka West Lake Instrument byageze ku rwego rwo kohereza ibikoresho ku mugaragaro; Universal Intelligence, China Electronics Technology Group Corporation 2, Ikigo cy’Abakozi ba Semiconductors bo mu Ishuri Rikuru ry’Ubumenyi ry’Abashinwa n’andi masosiyete na byo byashyize ahagaragara iterambere ry’ibikoresho.

 

3. Ibintu bikurura iterambere ry'ikoranabuhanga ryo gukuraho imirasire ya laser n'uburyo isoko ritangizwa

Kugabanuka kw'ibiciro bya substrates za silikoni za santimetero 6 bituma habaho iterambere ry'ikoranabuhanga ryo gukuraho imashini hakoreshejwe laser: Kuri ubu, igiciro cya substrates za silikoni za santimetero 6 cyagabanutse kiri munsi ya yuan 4,000 ku gice, kiregera ku giciro cy'inganda zimwe na zimwe. Uburyo bwo gukuraho imashini hakoreshejwe laser bufite umusaruro mwinshi kandi bugira inyungu nyinshi, ibyo bigatuma igipimo cyo kwinjira mu ikoranabuhanga ryo gukuraho imashini hakoreshejwe laser cyiyongera.

Gucukura kwa substrate za silikoni za santimetero 8 bituma habaho iterambere ry’ikoranabuhanga ryo gukuraho imirasire ya laser: Ubunini bwa substrate za silikoni za santimetero 8 ubu ni 500um, kandi burimo gutera imbere bugana ku bunini bwa 350um. Uburyo bwo gukata insinga ntabwo bugira ingaruka nziza mu gutunganya carbide ya silikoni ya santimetero 8 (ubuso bw’substrate si bwiza), kandi agaciro ka BOW na WARP karagabanutse cyane. Gukuraho laser bifatwa nk'ikoranabuhanga rikenewe mu gutunganya substrate ya silikoni ya santimetero 350um, ibyo bigatuma igipimo cyo kwinjira mu ikoranabuhanga ryo gukuraho laser cyiyongera.

Ibitegerejwe ku isoko: Ibikoresho byo gukuraho imirasire ya SiC substrate bifite inyungu mu kwagura SiC ya santimetero 8 no kugabanya ikiguzi cya SiC ya santimetero 6. Ingingo y'ingenzi iriho ubu iri hafi, kandi iterambere ry'inganda rizihuta cyane.