Emva kwei-wafersele idlule kwinkqubo yangaphambili, ukulungiswa kweetships kugqityiwe, kwaye kufuneka zisikwe ukuze kwahlulwe iitships kwi-wafer, kwaye ekugqibeleni zipakishwe.i-waferInkqubo yokusika ekhethiweyo kwiiwafers ezinobukhulu obahlukeneyo nayo yahlukile:
▪Iiwafersezinobukhulu obungaphezulu kwe-100um zihlala zisikwa ngeeblade;
▪Iiwafersezinobukhulu obungaphantsi kwe-100um zihlala zisikwa nge-laser. Ukusika nge-laser kunokunciphisa iingxaki zokuxobuka nokuqhekeka, kodwa xa kungaphezulu kwe-100um, ukusebenza kakuhle kwemveliso kuya kuncipha kakhulu;
▪Iiwafersxa ubukhulu bayo bungaphantsi kwe-30um, i-plasma iyasikwa ngokukhawuleza kwaye ayizukuyonakalisa umphezulu we-wafer, ngaloo ndlela iphucula isivuno, kodwa inkqubo yayo inzima ngakumbi;
Ngexesha lenkqubo yokusika i-wafer, ifilimu iya kufakwa kwi-wafer kwangaphambili ukuqinisekisa ukuba ikhuselekile "ukusika enye". Imisebenzi yayo ephambili yile ilandelayo.
Lungisa kwaye ukhusele i-wafer
Ngexesha lokusebenza ngokusika, i-wafer kufuneka isikwe ngokuchanekileyo.Iiwaferszihlala zibhityile kwaye ziqhekeka. Iteyiphu ye-UV inokuncamathisela ngokuqinileyo i-wafer kwisakhelo okanye kwisigaba se-wafer ukuthintela i-wafer ukuba ingashukumi kwaye ingashukumi ngexesha lenkqubo yokusika, ukuqinisekisa ukuchaneka nokuchaneka kokusika.
Ingakhusela kakuhle umzimba kwi-wafer, ithintele ukonakalai-waferokubangelwa yimpembelelo yamandla angaphandle kunye nokungqubana okunokwenzeka ngexesha lenkqubo yokusika, okufana nokuqhekeka, ukudilika komphetho kunye nezinye iziphene, kunye nokukhusela isakhiwo se-chip kunye nesekethe kumphezulu we-wafer.
Ukusebenza okulula kokusika
Iteyiphu ye-UV inokuguquguquka okufanelekileyo kunye nokuguquguquka, kwaye inokonakala kancinci xa incakuba yokusika ingena, okwenza inkqubo yokusika ibe lula, inciphise iziphumo ezimbi zokuxhathisa ukusika kwincakuba nakwi-wafer, kwaye inceda ukuphucula umgangatho wokusika kunye nobomi benkonzo yencakuba. Iimpawu zayo zomphezulu zivumela inkunkuma eveliswa kukusika ukuba inamathele kwi-teyiphu ngcono ngaphandle kokutshiza, nto leyo elula ukucocwa kwendawo yokusika kamva, ukugcina indawo yokusebenza icocekile, kunye nokuthintela inkunkuma ukuba ingangcolisi okanye iphazamise i-wafer kunye nezinye izixhobo.
Kulula ukuyiphatha kamva
Emva kokuba i-wafer isikiwe, iteyiphu ye-UV ingancitshiswa ngokukhawuleza kwi-viscosity okanye ilahleke ngokupheleleyo ngokuyikhanyisa ngokukhanya kwe-ultraviolet okune-wavelength ethile kunye nobukhali, ukuze i-chip esikiweyo yahlulwe ngokulula kwiteyiphu, nto leyo elungele ukupakishwa kwe-chip elandelayo, uvavanyo kunye neminye imisebenzi yenkqubo, kwaye le nkqubo yokwahlula inomngcipheko omncinci wokonakalisa i-chip.
Ixesha leposi: Disemba-16-2024