Kungani sisebenzisa i-UV tape ukuze sihlukanise ama-wafer? | VET Energy

Ngemva kwe-i-waferuma isidlule enqubweni yangaphambilini, ukulungiswa kwama-chip sekuqediwe, futhi kudingeka kusikwe ukuze kuhlukaniswe ama-chip ku-wafer, bese ekugcineni kupakishwa.i-waferInqubo yokusika ekhethiwe yama-wafer anobukhulu obuhlukene nayo ihlukile:

▪Ama-Waferngobukhulu obungaphezu kuka-100um ngokuvamile zisikwa ngama-blades;

▪Ama-WaferEzinobukhulu obungaphansi kuka-100um ngokuvamile zisikwa ngama-laser. Ukusika nge-laser kunganciphisa izinkinga zokuqhekeka nokuqhekeka, kodwa uma sekungaphezu kuka-100um, ukusebenza kahle kokukhiqiza kuzoncishiswa kakhulu;

▪Ama-Waferuma ubukhulu bayo bungaphansi kwama-30um, i-plasma iyasikwa ngokushesha futhi ngeke ilimaze ubuso be-wafer, ngaleyo ndlela ithuthukise isivuno, kodwa inqubo yayo iyinkimbinkimbi kakhulu;

Ngesikhathi senqubo yokusika i-wafer, ifilimu izofakwa ku-wafer kusengaphambili ukuqinisekisa ukuthi iphephile "ukuyihlukanisa". Imisebenzi yayo eyinhloko yile elandelayo.

Lungisa futhi uvikele i-wafer

Ngesikhathi sokusika, i-wafer idinga ukunqunywa kahle.Ama-Waferngokuvamile zincane futhi ziyaphuka. Itheyiphu ye-UV inganamathela ngokuqinile i-wafer ohlakeni noma esigabeni se-wafer ukuvimbela i-wafer ukuthi ingashintshi futhi inyakaze ngesikhathi senqubo yokusika, okuqinisekisa ukunemba nokunemba kokusika.
Kunganikeza isivikelo esihle ngokomzimba se-wafer, kugweme ukulimala kwe-waferi-waferokubangelwa umthelela wamandla angaphandle kanye nokungqubuzana okungenzeka ngesikhathi senqubo yokusika, njengokuqhekeka, ukuwohloka komphetho kanye nezinye izinkinga, futhi kuvikela isakhiwo se-chip kanye nesekethe ebusweni be-wafer.

Ukusebenza okulula kokusika

Itheyiphu ye-UV inokuguquguquka okufanele kanye nokuguquguquka, futhi ingaguquguquka ngokulinganisela lapho insingo yokusika ingena, okwenza inqubo yokusika ibe lula, inciphise imiphumela emibi yokumelana nokusika ensingo kanye ne-wafer, futhi isize ekuthuthukiseni ikhwalithi yokusika kanye nokuphila kwensingo. Izici zayo zobuso zenza imfucumfucu ekhiqizwa ukusika inamathele kangcono entendeni ngaphandle kokuchaphaza nxazonke, okuyinto elula ukuhlanzwa okulandelayo kwendawo yokusika, ukugcina indawo yokusebenza ihlanzekile, nokugwema imfucumfucu ekungcoliseni noma ekuphazamiseni i-wafer neminye imishini.

Kulula ukuyiphatha kamuva

Ngemva kokuba i-wafer isisikiwe, itheyiphu ye-UV ingancishiswa ngokushesha ekukhanyeni noma ilahleke ngokuphelele ngokuyikhanyisa ngokukhanya kwe-ultraviolet okune-wavelength ethile kanye namandla, ukuze i-chip esikiwe ihlukaniswe kalula netheyiphu, okulula ukupakishwa kwe-chip okulandelayo, ukuhlolwa kanye nokunye ukugeleza kwenqubo, futhi le nqubo yokuhlukanisa inengozi ephansi kakhulu yokulimaza i-chip.