Ezinye izinto eziphilayo nezingaphiliyo ziyafuneka ukuze zithathe inxaxheba kwimveliso ye-semiconductor. Ukongeza, ekubeni le nkqubo isoloko isenziwa kwigumbi elicocekileyo elinabantu ababandakanyekayo, i-semiconductoriiwaferszingcoliswe ngokungenakuphepheka ziintlobo ngeentlobo zokungcola.
Ngokwemvelaphi kunye nohlobo lwezi zinto zingcolisayo, zinokwahlulwahlulwa zibe ziindidi ezine: amasuntswana, izinto eziphilayo, ii-ion zesinyithi kunye nee-oxide.
1. Amasuntswana:
Iinxalenye zeplastiki ikakhulu ziipolymers, ii-photoresists kunye neengcoliseko zokugrumba.
Ezi zinto zingcolisayo zihlala zixhomekeke kumandla aphakathi kweemolekyuli ukuze zifunxe phezu komphezulu we-wafer, nto leyo echaphazela ukwakheka kwemifanekiso yejometri kunye neeparamitha zombane zenkqubo ye-photolithography yesixhobo.
Ezi zinto zingcolisayo zisuswa kakhulu ngokunciphisa kancinci kancinci indawo yazo yokudibana nomphezulu womphezului-waferngeendlela zomzimba okanye zeekhemikhali.
2. Izinto eziphilayo:
Imithombo yokungcola kwezinto eziphilayo ibanzi kakhulu, njengeoyile yolusu lomntu, iintsholongwane, ioyile yomatshini, igrisi ye-vacuum, i-photoresist, izinyibilikisi zokucoca, njl.
Ezi zinto zingcolisayo zihlala zenza ifilimu yendalo kumphezulu we-wafer ukuthintela ulwelo lokucoca ukuba lungafikeleli kumphezulu we-wafer, nto leyo ebangela ukuba umphezulu we-wafer ungacocwa ngokupheleleyo.
Ukususwa kwezo zinto zingcolisayo kudla ngokwenziwa kwinqanaba lokuqala lenkqubo yokucoca, kusetyenziswa ikakhulu iindlela zeekhemikhali ezifana ne-sulfuric acid kunye ne-hydrogen peroxide.
3. Ii-ion zesinyithi:
Ukungcola okuqhelekileyo kwesinyithi kubandakanya isinyithi, ubhedu, i-aluminium, i-chromium, isinyithi esityhidiweyo, i-titanium, i-sodium, i-potassium, i-lithium, njl. Imithombo ephambili zizixhobo ezahlukeneyo, imibhobho, ii-reagents zeekhemikhali, kunye nongcoliseko lwesinyithi oluvela xa kudityaniswa isinyithi ngexesha lokucubungula.
Olu hlobo lokungcola ludla ngokususwa ngeendlela zeekhemikhali ngokwenziwa kwee-metal ion complexes.
4. I-Oxide:
Xa i-semiconductoriiwafersxa zichatshazelwe kwindawo equlethe ioksijini namanzi, kuya kubakho umaleko we-oxide yendalo phezu komphezulu. Le filime ye-oxide iya kuthintela iinkqubo ezininzi ekwenziweni kwee-semiconductor kwaye ikwaqulathe ukungcola okuthile kwesinyithi. Phantsi kweemeko ezithile, ziya kwenza iziphene zombane.
Ukususwa kwale filime ye-oxide kudla ngokugqitywa ngokucwilisa kwi-dilute hydrofluoric acid.
Ulandelelwano lokucoca ngokubanzi
Ukungcola okufunxwe phezu komphezulu we-semiconductoriiwafersinokwahlulwa ibe ziintlobo ezintathu: iimolekyuli, i-ionic kunye ne-athomu.
Phakathi kwazo, amandla okufunxa phakathi kokungcola kweemolekyuli kunye nomphezulu we-wafer abuthathaka, kwaye olu hlobo lwee-particles zokungcola kulula ukuzisusa. Uninzi lwazo zizinto ezingcolisayo ezinamafutha ezineempawu ze-hydrophobic, ezinokubonelela nge-masking ye-ionic kunye ne-atomic vulnerability engcolisa umphezulu wee-wafers ze-semiconductor, nto leyo engafanelekanga ekususweni kwezi ntlobo zimbini zokungcola. Ke ngoko, xa kucoca ii-wafers ze-semiconductor ngeekhemikhali, ukungcola kweemolekyuli kufuneka kususwe kuqala.
Ke ngoko, inkqubo ngokubanzi ye-semiconductori-waferInkqubo yokucoca yile:
Ukususa i-molecularization-deionization-de-atomization-deionized water cleansing.
Ukongeza, ukuze kususwe umaleko we-oxide yendalo phezu komphezulu we-wafer, kufuneka kongezwe inyathelo lokuntywila i-amino acid enyibilikisiweyo. Ke ngoko, ingcamango yokucoca kukususa kuqala ungcoliseko lwezinto eziphilayo kumphezulu; emva koko kunyibilikise umaleko we-oxide; ekugqibeleni kususwe amasuntswana kunye nongcoliseko lwesinyithi, kwaye kususwe umphezulu ngaxeshanye.
Iindlela zokucoca eziqhelekileyo
Iindlela zeekhemikhali zihlala zisetyenziswa ekucoceni ii-semiconductor wafers.
Ukucoca ngamakhemikhali kubhekisa kwinkqubo yokusebenzisa ii-reagents ezahlukeneyo zeekhemikhali kunye nezinyibilikisi ze-organic ukusabela okanye ukunyibilikisa ukungcola kunye namabala eoyile kumphezulu we-wafer ukususa ukungcola, uze emva koko uhlambe ngamanzi amaninzi acocekileyo ashushu nabandayo acocekileyo ukuze ufumane umphezulu ococekileyo.
Ukucoca ngamakhemikhali kunokwahlulwahlulwa kube kukucoca ngamakhemikhali amanzi kunye nokucoca ngamakhemikhali awomileyo, apho ukucoca ngamakhemikhali amanzi kuseyona nto iphambili.
Ukucoca iikhemikhali ezimanzi
1. Ukucoca ngamakhemikhali ngamanzi:
Ukucoca iikhemikhali ezimanzi kubandakanya ikakhulu ukuntywiliselwa kwisisombululo, ukukrwela ngoomatshini, ukucoca nge-ultrasound, ukucoca nge-megasonic, ukutshiza nge-rotary, njl.
2. Ukuntywiliselwa kwisisombululo:
Ukuntywiliselwa kwisisombululo yindlela yokususa ungcoliseko lomphezulu ngokuntywilisela i-wafer kwisisombululo seekhemikhali. Yeyona ndlela isetyenziswa kakhulu ekucoceni iikhemikhali ezimanzi. Izisombululo ezahlukeneyo zingasetyenziselwa ukususa iintlobo ezahlukeneyo zongcoliseko kumphezulu we-wafer.
Ngokwesiqhelo, le ndlela ayinakususa ngokupheleleyo ukungcola okuphezu kwe-wafer, ngoko ke amanyathelo anjengokufudumeza, i-ultrasound, kunye nokuxukuxa adla ngokusetyenziswa xa kucwiliswa.
3. Ukukhuhla ngoomatshini:
Ukukrwela ngoomatshini kudla ngokusetyenziswa ukususa amasuntswana okanye iintsalela zezinto eziphilayo kumphezulu we-wafer. Ngokubanzi kunokwahlulwahlulwa ngeendlela ezimbini:ukukhuhla ngesandla kunye nokukhuhla ngesixhobo sokususa inkunkuma.
Ukukhuhla ngesandlayeyona ndlela ilula yokukrwela. Ibrashi yentsimbi engatyiwayo isetyenziselwa ukubamba ibhola efakwe kwi-ethanol engamanzi okanye ezinye izinyibilikisi zendalo kwaye ihlikihle kancinci umphezulu we-wafer kwicala elinye ukususa ifilimu ye-wax, uthuli, iglu eseleyo okanye ezinye iinxalenye eziqinileyo. Le ndlela kulula ukuyibangela imikrwelo kunye nongcoliseko olukhulu.
I-wiper isebenzisa ukujikeleza ngomatshini ukuhlikihla umphezulu we-wafer ngebrashi ethambileyo yoboya okanye ibrashi exutyiweyo. Le ndlela inciphisa kakhulu imikrwelo kwi-wafer. I-wiper enoxinzelelo oluphezulu ayizukukrwela i-wafer ngenxa yokungabikho kokukrwela ngoomatshini, kwaye inokususa ungcoliseko olukwi-groove.
4. Ukucoca nge-ultrasonic:
Ukucoca nge-ultrasonic yindlela yokucoca esetyenziswa kakhulu kwishishini le-semiconductor. Iingenelo zayo kukuba isiphumo esihle sokucoca, ukusebenza okulula, kwaye inokucoca izixhobo ezintsonkothileyo kunye nezikhongozeli.
Le ndlela yokucoca iphantsi kwesenzo samaza anamandla e-ultrasonic (i-frequency ye-ultrasonic esetyenziswa rhoqo yi-20s40kHz), kwaye iindawo ezincinci nezixineneyo ziya kuveliswa ngaphakathi kwendawo yolwelo. Inxalenye encinci iya kuvelisa i-bubble cavity ephantse ibe yi-vacuum. Xa i-bubble cavity inyamalala, uxinzelelo olunamandla lwendawo luya kuveliswa kufutshane nayo, luphule iibhondi zeekhemikhali kwiimolekyuli ukuze kunyibilikiswe ukungcola kumphezulu we-wafer. Ukucoca nge-ultrasonic yeyona ndlela isebenzayo ekususeni iintsalela ze-flux ezinganyibilikiyo okanye ezinganyibilikiyo.
5. Ukucoca iMegasonic:
Ukucoca i-Megasonic akupheleli nje ekubeni neengenelo zokucoca nge-ultrasound, kodwa kuyawoyisa nokusilela kwayo.
Ukucoca iMegasonic yindlela yokucoca ii-wafers ngokudibanisa isiphumo sokungcangcazela kwe-frequency yamandla aphezulu (850kHz) kunye ne-chemical reaction yee-chemical cleaner agents. Ngexesha lokucoca, ii-molecules zesisombululo zikhawuleziswa yi-megasonic wave (isantya esiphezulu esikhawulezileyo sinokufikelela kwi-30cmVs), kwaye i-high-speed fluid wave ichaphazela rhoqo umphezulu we-wafer, ukuze ukungcola kunye namaqhekeza amancinci anamathele kumphezulu we-wafer asuswe ngenkani aze angene kwisisombululo sokucoca. Ukongeza ii-acidic surfactants kwisisombululo sokucoca, kwelinye icala, kunokufezekisa injongo yokususa amaqhekeza kunye nezinto eziphilayo kumphezulu wokupholisha ngokufunxa ii-surfactants; kwelinye icala, ngokudibanisa ii-surfactants kunye ne-acidic okusingqongileyo, kunokufezekisa injongo yokususa ungcoliseko lwesinyithi kumphezulu wephepha lokupholisha. Le ndlela inokudlala indima yokusula ngoomatshini kunye nokucoca ngamakhemikhali ngaxeshanye.
Okwangoku, indlela yokucoca i-megasonic iye yaba yindlela esebenzayo yokucoca amaphepha okupolisha.
6. Indlela yokutshiza ejikelezayo:
Indlela yokutshiza ejikelezayo yindlela esebenzisa iindlela zoomatshini ukujikelezisa i-wafer ngesantya esiphezulu, kwaye iqhubekeka itshiza ulwelo (amanzi acocekileyo kakhulu okanye olunye ulwelo lokucoca) kumphezulu we-wafer ngexesha lenkqubo yokujikelezisa ukususa ukungcola kumphezulu we-wafer.
Le ndlela isebenzisa ungcoliseko oluphezu kwe-wafer ukuze lunyibilike kulwelo olutshiziweyo (okanye luphendula ngekhemikhali ukuze lunyibilike), kwaye isebenzisa isiphumo se-centrifugal sokujikeleza ngesantya esiphezulu ukwenza ulwelo oluqulethe ungcoliseko lwahluke kumphezulu we-wafer ngexesha elifanelekileyo.
Indlela yokutshiza ejikelezayo ineengenelo zokucoca ngamakhemikhali, ukucoca ngoomatshini bolwelo, kunye nokukhuhla ngoxinzelelo oluphezulu. Kwangaxeshanye, le ndlela ingadityaniswa nenkqubo yokomisa. Emva kwexesha lokucoca ngokutshiza ngamanzi acocekileyo, ukutshiza ngamanzi kuyayekiswa kwaye kusetyenziswa igesi yokutshiza. Kwangaxeshanye, isantya sokujikeleza sinokunyuswa ukuze kwandiswe amandla e-centrifugal ukuze kususwe amanzi ngokukhawuleza kumphezulu we-wafer.
7.Ukucoca ngamakhemikhali okomileyo
Ukucoca ngeoyile kubhekisa kwiteknoloji yokucoca engasebenzisi zisombululo.
Iiteknoloji zokucoca ezomileyo ezisetyenziswayo ngoku ziquka: iteknoloji yokucoca i-plasma, iteknoloji yokucoca igesi, iteknoloji yokucoca imisebe, njl.
Iingenelo zokucoca nge-dry cleaner zilula kwaye azingcolisi okusingqongileyo, kodwa ixabiso liphezulu kwaye umda wokusetyenziswa awukho mkhulu okwangoku.
1. Itekhnoloji yokucoca iPlasma:
Ukucocwa kweplasma kudla ngokusetyenziswa kwinkqubo yokususa i-photoresist. Inani elincinci leoksijini lifakwa kwinkqubo yokusabela kweplasma. Phantsi kwesenzo sombane onamandla, ioksijini ivelisa iplasma, ethi ngokukhawuleza i-photoresist inyibilike ibe yigesi eguquguqukayo ize ikhutshwe.
Le teknoloji yokucoca ineengenelo zokuba kulula ukuyisebenzisa, ukusebenza kakuhle, umphezulu ococekileyo, akukho mikrwelo, kwaye iluncedo ekuqinisekiseni umgangatho wemveliso kwinkqubo yokukhupha igum. Ngaphezu koko, ayisebenzisi ii-asidi, ii-alkali kunye nezinyibilikisi ze-organic, kwaye akukho ngxaki ezifana nokulahlwa kwenkunkuma kunye nongcoliseko lokusingqongileyo. Ke ngoko, ixatyiswa ngakumbi ngabantu. Nangona kunjalo, ayinakususa ikhabhoni kunye nezinye izinto ezingcolileyo zesinyithi okanye i-oxide yesinyithi.
2. Itekhnoloji yokucoca isigaba segesi:
Ukucocwa kwesigaba segesi kubhekisa kwindlela yokucoca esebenzisa i-gas phase elingana ne-gas phase yento ehambelanayo kwinkqubo yolwelo ukuze inxibelelane ne-contact engcolileyo kumphezulu we-wafer ukufezekisa injongo yokususa ukungcola.
Umzekelo, kwinkqubo ye-CMOS, ukucoca i-wafer kusebenzisa ukusebenzisana phakathi kwe-HF yesigaba segesi kunye nomphunga wamanzi ukususa ii-oxides. Ngokwesiqhelo, inkqubo ye-HF equlathe amanzi kufuneka ihambisane nenkqubo yokususa amasuntswana, ngelixa ukusetyenziswa kwetekhnoloji yokucoca i-HF yesigaba segesi kungadingi nkqubo yokususa amasuntswana elandelayo.
Eyona nzuzo ibalulekileyo xa ithelekiswa nenkqubo ye-HF enamanzi kukusetyenziswa kweekhemikhali ze-HF ezincinci kakhulu kunye nokusebenza kakuhle kokucoca.
Wamkelekile nabathengi abavela kwihlabathi liphela ukuba basityelele ukuze sixoxe ngakumbi!
https://www.vet-china.com/
https://www.facebook.com/people/Ningbo-Miami-Advanced-Material-Technology-Co-Ltd/100085673110923/
https://www.linkedin.com/company/100890232/admin/page-posts/published/
https://www.youtube.com/@user-oo9nl2qp6j
Ixesha lokuthumela: Agasti-13-2024