Ezinye izinto eziphilayo nezingaphili ziyadingeka ukuze zihlanganyele ekukhiqizweni kwe-semiconductor. Ngaphezu kwalokho, njengoba inqubo iqhutshwa njalo egumbini elihlanzekile elinabantu abahlanganyelayo, i-semiconductorama-waferzingcoliswe ngokungenakugwenywa ukungcola okuhlukahlukene.
Ngokusho komthombo kanye nohlobo lwalezi zinto ezingcolisayo, zingahlukaniswa ngezigaba ezine: izinhlayiya, izinto eziphilayo, ama-ion ensimbi kanye nama-oxide.
1. Izinhlayiya:
Izinhlayiya ikakhulukazi ziyi-polymers, i-photoresists kanye nokungcola okuqophayo.
Izinto ezinjalo ezingcolisayo zivame ukuthembela emandleni aphakathi kwama-molecule ukuze zimunce ebusweni be-wafer, okuthinta ukwakheka kwezibalo zejometri kanye nemingcele kagesi yenqubo ye-photolithography yedivayisi.
Izinto ezinjalo ezingcolisayo zisuswa kakhulu ngokunciphisa kancane kancane indawo yazo yokuxhumana nobuso bomphezului-waferngezindlela zomzimba noma zamakhemikhali.
2. Izinto eziphilayo:
Imithombo yokungcola okungokwemvelo ibanzi kakhulu, njengamafutha esikhumba somuntu, amabhaktheriya, uwoyela womshini, i-vacuum grease, i-photoresist, izinyibilikisi zokuhlanza, njll.
Izinto ezinjalo ezingcolisayo zivame ukwakha ifilimu yemvelo ebusweni be-wafer ukuvimbela uketshezi lokuhlanza ukuthi lungafiki ebusweni be-wafer, okuholela ekuhlanzweni okungaphelele kobuso be-wafer.
Ukususwa kwezinto ezinjalo ezingcolisayo kuvame ukwenziwa esinyathelweni sokuqala senqubo yokuhlanza, ikakhulukazi kusetshenziswa izindlela zamakhemikhali ezifana ne-sulfuric acid kanye ne-hydrogen peroxide.
3. Ama-ion ensimbi:
Ukungcola okuvamile kwensimbi kufaka phakathi insimbi, ithusi, i-aluminium, i-chromium, insimbi ecijile, i-titanium, i-sodium, i-potassium, i-lithium, njll. Imithombo eyinhloko yizitsha ezahlukahlukene, amapayipi, ama-reagent amakhemikhali, kanye nokungcola kwensimbi okubangelwa ukuhlanganiswa kwensimbi ngesikhathi sokucubungula.
Lolu hlobo lokungcola luvame ukususwa ngezindlela zamakhemikhali ngokwakhiwa kwama-ion complex ensimbi.
4. I-Oxide:
Uma i-semiconductorama-waferuma zivezwa endaweni equkethe umoya-mpilo namanzi, kuzokwakheka ungqimba lwe-oxide yemvelo phezu komhlaba. Le filimu ye-oxide izophazamisa izinqubo eziningi ekukhiqizweni kwe-semiconductor futhi iqukathe nokungcola okuthile kwensimbi. Ngaphansi kwezimo ezithile, zizokwakha amaphutha kagesi.
Ukususwa kwale filimu ye-oxide kuvame ukuqedwa ngokucwilisa ku-hydrofluoric acid encibilikisiwe.
Uchungechunge lokuhlanza olujwayelekile
Ukungcola okufakwe ebusweni be-semiconductorama-waferingahlukaniswa ngezinhlobo ezintathu: i-molecule, i-ionic kanye ne-athomu.
Phakathi kwazo, amandla okumunca phakathi kokungcola kwama-molecule kanye nobuso be-wafer abuthakathaka, futhi lolu hlobo lwezinhlayiya zokungcola kulula ukuzisusa. Ngokuvamile ziwukungcola okunamafutha okunezici ze-hydrophobic, okungahlinzeka ngokumboza ukungcola kwe-ionic kanye ne-athomu okungcolisa ubuso be-wafers ze-semiconductor, okungavumeli ukususwa kwalezi zinhlobo ezimbili zokungcola. Ngakho-ke, lapho kuhlanza ama-wafers e-semiconductor ngamakhemikhali, ukungcola kwama-molecule kufanele kususwe kuqala.
Ngakho-ke, inqubo ejwayelekile ye-semiconductori-waferinqubo yokuhlanza yile:
Ukuhlanza ngamanzi ahlanzekile.
Ngaphezu kwalokho, ukuze kususwe ungqimba lwe-oxide yemvelo ebusweni be-wafer, kudingeka kufakwe isinyathelo sokucwilisa i-amino acid encibilikisiwe. Ngakho-ke, umqondo wokuhlanza uwukuqala ususe ukungcola okungokwemvelo ebusweni; bese uncibilikisa ungqimba lwe-oxide; ekugcineni ususe izinhlayiya kanye nokungcola kwensimbi, bese ususa ubuso ngesikhathi esifanayo.
Izindlela zokuhlanza ezivamile
Izindlela zamakhemikhali zivame ukusetshenziswa ekuhlanzeni ama-wafer e-semiconductor.
Ukuhlanza ngamakhemikhali kubhekisela enkambisweni yokusebenzisa ama-reagent amakhemikhali ahlukahlukene kanye nezinyibilikisi eziphilayo ukuze kuxazululwe noma kuncibilikiswe ukungcola kanye namabala kawoyela ebusweni be-wafer ukuze kususwe ukungcola, bese kuhlanzwa ngamanzi amaningi ashisayo nabandayo acwengekile ukuze kutholakale indawo ehlanzekile.
Ukuhlanza ngamakhemikhali kungahlukaniswa kube ukuhlanza ngamakhemikhali okumanzi kanye nokuhlanza ngamakhemikhali okomile, phakathi kwawo okusalokhu kuyinhloko ukuhlanza ngamakhemikhali okumanzi.
Ukuhlanza ngamakhemikhali amanzi
1. Ukuhlanza ngamakhemikhali ngamanzi:
Ukuhlanza amakhemikhali ngamanzi kuhlanganisa kakhulu ukucwiliswa kwesisombululo, ukuklwebha ngomshini, ukuhlanza nge-ultrasound, ukuhlanza nge-megasonic, ukufutha ngokujikeleza, njll.
2. Ukucwiliswa kwesisombululo:
Ukucwilisa ngesisombululo kuyindlela yokususa ukungcola kobuso ngokucwilisa i-wafer esixazululweni samakhemikhali. Yindlela evame ukusetshenziswa ekuhlanzeni ngamakhemikhali okumanzi. Izixazululo ezahlukene zingasetshenziswa ukususa izinhlobo ezahlukene zokungcola ebusweni be-wafer.
Ngokuvamile, le ndlela ayikwazi ukususa ngokuphelele ukungcola ebusweni be-wafer, ngakho-ke izinyathelo zomzimba ezifana nokushisa, i-ultrasound, kanye nokuxuba zivame ukusetshenziswa ngesikhathi sokucwilisa.
3. Ukuhlafuna ngomshini:
Ukuhlikihla ngomshini kuvame ukusetshenziselwa ukususa izinhlayiya noma izinsalela zezinto eziphilayo ebusweni be-wafer. Ngokuvamile kungahlukaniswa ngezindlela ezimbili:ukukhuhla nokukhuhla ngesandla nge-wiper.
Ukuklwebha ngesandlaIndlela elula kakhulu yokuklwebha. Ibhulashi lensimbi engagqwali lisetshenziselwa ukubamba ibhola elicwiliswe ku-ethanol engamanzi noma kwezinye izinyibilikisi eziphilayo bese uhlikihla ngobumnene ubuso be-wafer ngendlela efanayo ukuze ususe ifilimu ye-wax, uthuli, iglue esele noma ezinye izinhlayiya eziqinile. Le ndlela kulula ukuyibangela imihuzuko nokungcola okukhulu.
I-wiper isebenzisa ukujikeleza komshini ukuhlikihla ubuso be-wafer ngebhulashi elithambile le-wool noma ibhulashi elixubile. Le ndlela inciphisa kakhulu imihuzuko ku-wafer. I-wiper enomfutho ophezulu ngeke iklwebhe i-wafer ngenxa yokuntuleka kokungqubuzana komshini, futhi ingasusa ukungcola emseleni.
4. Ukuhlanzwa kwe-Ultrasonic:
Ukuhlanza nge-Ultrasonic kuyindlela yokuhlanza esetshenziswa kabanzi embonini ye-semiconductor. Izinzuzo zayo umphumela omuhle wokuhlanza, ukusebenza okulula, futhi ingahlanza namadivayisi neziqukathi eziyinkimbinkimbi.
Le ndlela yokuhlanza ingaphansi kwesenzo samagagasi anamandla e-ultrasonic (imvamisa ye-ultrasonic evame ukusetshenziswa ingu-20s40kHz), futhi izingxenye ezincane neziminyene zizokhiqizwa ngaphakathi kwendawo yoketshezi. Ingxenye encane izokhiqiza ibhamuza elicishe libe yi-vacuum cavity. Lapho ibhamuza elingaphakathi linyamalala, kuzokhiqizwa ingcindezi enamandla yendawo eduze kwalo, iphule izibopho zamakhemikhali kuma-molecule ukuze kuncibilikiswe ukungcola ebusweni be-wafer. Ukuhlanza kwe-Ultrasonic kuphumelela kakhulu ekususeni izinsalela ze-flux ezinganyibiliki noma ezinganyibiliki.
5. Ukuhlanza kwe-Megasonic:
Ukuhlanza kwe-Megasonic akugcini nje ngokuba nezinzuzo zokuhlanza nge-ultrasound, kodwa futhi kunqoba nokushiyeka kwayo.
Ukuhlanza i-Megasonic kuyindlela yokuhlanza ama-wafer ngokuhlanganisa umphumela wokudlidliza kwemvamisa yamandla aphezulu (850kHz) nokusabela kwamakhemikhali kwezinto zokuhlanza amakhemikhali. Ngesikhathi sokuhlanza, ama-molecule esisombululo asheshiswa yi-megasonic wave (isivinini esiphezulu esisheshayo singafinyelela ku-30cmVs), futhi igagasi loketshezi olusheshayo lihlala lithinta ubuso be-wafer, ukuze ukungcola nezinhlayiya ezincane ezinamathele ebusweni be-wafer zisuswe ngenkani bese zingena esixazululo sokuhlanza. Ukwengeza ama-surfactants ane-acidic esixazululweni sokuhlanza, ngakolunye uhlangothi, kungafeza injongo yokususa izinhlayiya nezinto eziphilayo ebusweni bokupholisha ngokumuncwa kwama-surfactants; ngakolunye uhlangothi, ngokuhlanganiswa kwama-surfactants nendawo ene-acidic, kungafeza injongo yokususa ukungcola kwensimbi ebusweni beshidi lokupholisha. Le ndlela ingadlala indima yokusula ngomshini kanye nokuhlanza amakhemikhali ngasikhathi sinye.
Njengamanje, indlela yokuhlanza ye-megasonic isiyindlela ephumelelayo yokuhlanza amashidi okupholisha.
6. Indlela yokufutha ngokujikeleza:
Indlela yokufutha ejikelezayo iyindlela esebenzisa izindlela zomshini ukuzungezisa i-wafer ngesivinini esikhulu, futhi ifutha njalo uketshezi (amanzi ahlanzekile kakhulu noma olunye uketshezi lokuhlanza) ebusweni be-wafer ngesikhathi senqubo yokuzungezisa ukuze kususwe ukungcola ebusweni be-wafer.
Le ndlela isebenzisa ukungcola okusebusweni be-wafer ukuze kuncibilike kuketshezi olufuthwe (noma kusetshenziswe ngamakhemikhali ukuze kuncibilike), futhi isebenzisa umphumela we-centrifugal wokujikeleza ngesivinini esikhulu ukwenza uketshezi oluqukethe ukungcola luhlukane nobuso be-wafer ngesikhathi.
Indlela yokufutha ejikelezayo inezinzuzo zokuhlanza ngamakhemikhali, ukuhlanza okwenziwa ngoketshezi, kanye nokukhuhla ngokucindezela okukhulu. Ngesikhathi esifanayo, le ndlela ingahlanganiswa nenqubo yokomisa. Ngemva kwesikhathi sokuhlanza isifutho samanzi esingenawo ama-ion, isifutho samanzi siyamiswa bese kusetshenziswa igesi yokufutha. Ngesikhathi esifanayo, ijubane lokujikeleza lingakhushulwa ukuze kwandiswe amandla e-centrifugal ukuze kususwe amanzi ngokushesha ebusweni be-wafer.
7.Ukuhlanza amakhemikhali okomile
Ukuhlanza okomile kubhekisela kubuchwepheshe bokuhlanza obungasebenzisi izixazululo.
Ubuchwepheshe bokuhlanza okomile obusetshenziswa njengamanje buhlanganisa: ubuchwepheshe bokuhlanza i-plasma, ubuchwepheshe bokuhlanza isigaba segesi, ubuchwepheshe bokuhlanza imisebe, njll.
Izinzuzo zokuhlanza nge-dry cleaner zilula futhi azikho ukungcola kwemvelo, kodwa izindleko ziphezulu futhi ububanzi bokusetshenziswa abukhulu okwamanje.
1. Ubuchwepheshe bokuhlanza i-plasma:
Ukuhlanzwa kwe-plasma kuvame ukusetshenziswa enqubweni yokususa i-photoresist. Inani elincane lomoya-mpilo lifakwa ohlelweni lokusabela kwe-plasma. Ngaphansi kwesenzo sensimu kagesi enamandla, umoya-mpilo ukhiqiza i-plasma, evuselela ngokushesha i-photoresist ibe yisimo segesi esiguquguqukayo bese ikhishwa.
Lobu buchwepheshe bokuhlanza bunezinzuzo zokusebenza okulula, ukusebenza kahle okuphezulu, indawo ehlanzekile, ukungabi nemihuzuko, futhi buyasiza ekuqinisekiseni ikhwalithi yomkhiqizo enqubweni yokukhipha i-gum. Ngaphezu kwalokho, abusebenzisi ama-acid, ama-alkali kanye nezinyibilikisi eziphilayo, futhi azikho izinkinga ezifana nokulahlwa kwemfucuza kanye nokungcola kwemvelo. Ngakho-ke, buyaziswa kakhulu ngabantu. Kodwa-ke, abukwazi ukususa ikhabhoni kanye nokunye ukungcola kwensimbi noma kwe-metal oxide okungaguquki.
2. Ubuchwepheshe bokuhlanza isigaba segesi:
Ukuhlanza isigaba segesi kubhekisela endleleni yokuhlanza esebenzisa isigaba segesi esilingana nento ehambisanayo enqubweni yoketshezi ukuze ixhumane nento engcolisiwe ebusweni be-wafer ukuze kufezwe injongo yokususa ukungcola.
Isibonelo, enqubweni ye-CMOS, ukuhlanza i-wafer kusebenzisa ukusebenzisana phakathi kwe-HF yesigaba segesi kanye nomhwamuko wamanzi ukususa ama-oxide. Ngokuvamile, inqubo ye-HF equkethe amanzi kumele ihambisane nenqubo yokususa izinhlayiya, kuyilapho ukusetshenziswa kobuchwepheshe bokuhlanza i-HF yesigaba segesi kungadingi inqubo elandelayo yokususa izinhlayiya.
Izinzuzo ezibaluleke kakhulu uma kuqhathaniswa nenqubo ye-HF enamanzi ukusetshenziswa kwamakhemikhali e-HF okuncane kakhulu kanye nokusebenza kahle kokuhlanza okuphezulu.
Yamukela noma yimaphi amakhasimende avela emhlabeni wonke ukuthi asivakashele ukuze sixoxe kabanzi!
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Isikhathi sokuthunyelwe: Agasti-13-2024