I loko o ke ao holoʻokoʻa o ka ʻenehana hou,nā wafers, i ʻike ʻia hoʻi he mau wafer silicon, ʻo ia nā ʻāpana koʻikoʻi o ka ʻoihana semiconductor. ʻO lākou ke kumu no ka hana ʻana i nā ʻāpana uila like ʻole e like me nā microprocessors, memory, sensors, etc., a lawe kēlā me kēia wafer i ka hiki o nā ʻāpana uila helu ʻole. No laila no ke aha mākou e ʻike pinepine ai i 25 mau wafers i loko o kahi pahu? Aia maoli nā noʻonoʻo ʻepekema a me ka hoʻokele waiwai o ka hana ʻoihana ma hope o kēia.
Ke hōʻike nei i ke kumu he 25 mau wafers i loko o kahi pahu
ʻO ka mea mua, e hoʻomaopopo i ka nui o ka wafer. ʻO nā nui wafer maʻamau he 12 ʻīniha a me 15 ʻīniha, ʻo ia hoʻi ke hoʻololi i nā lako hana a me nā kaʻina hana like ʻole.Nā wafers 12-'īnihaʻo ia ke ʻano maʻamau i kēia manawa no ka mea hiki iā lākou ke hoʻokipa i nā ʻāpana he nui a ua kaulike ʻia ke kumukūʻai hana a me ka pono.
ʻAʻole he mea ulia ka helu "25 ʻāpana". Hoʻokumu ʻia ia ma ke ʻano ʻoki a me ka pono o ka hoʻopili ʻana o ka wafer. Ma hope o ka hana ʻia ʻana o kēlā me kēia wafer, pono e ʻoki ʻia e hana i nā ʻāpana kūʻokoʻa he nui. Ma ke ʻano laulā, hewafer 12-'īnihahiki ke ʻoki i nā haneli a i ʻole nā tausani o nā ʻāpana ʻāpana. Eia nō naʻe, no ka maʻalahi o ka hoʻokele a me ka halihali ʻana, hoʻopili pinepine ʻia kēia mau ʻāpana i kahi nui, a he 25 mau ʻāpana kahi koho nui maʻamau no ka mea ʻaʻole nui loa a ʻaʻole hoʻi nui loa, a hiki iā ia ke hōʻoia i ka lawa ʻana o ke kūpaʻa i ka wā e halihali ʻia ai.
Eia kekahi, ʻo ka nui o 25 mau ʻāpana he mea kūpono hoʻi i ka automation a me ka hoʻonui ʻana o ka laina hana. Hiki i ka hana ʻana o ka batch ke hōʻemi i ke kumukūʻai hana o kahi ʻāpana hoʻokahi a hoʻomaikaʻi i ka pono hana. I ka manawa like, no ka mālama ʻana a me ka halihali ʻana, he maʻalahi ka hana ʻana i kahi pahu wafer 25-ʻāpana a hōʻemi i ka pilikia o ka haki ʻana.
He mea kūpono ke hoʻomaopopo ʻana me ka holomua o ka ʻenehana, hiki i kekahi mau huahana kiʻekiʻe ke hoʻohana i kahi helu nui o nā pūʻolo, e like me 100 a 200 paha mau ʻāpana, e hoʻomaikaʻi hou aku i ka pono o ka hana ʻana. Eia nō naʻe, no ka hapa nui o nā huahana mea kūʻai aku a me nā huahana waena, he hoʻonohonoho maʻamau mau ka pahu wafer 25-ʻāpana.
I ka hōʻuluʻulu manaʻo, aia ma kahi pahu o nā wafers he 25 mau ʻāpana, ʻo ia ke kaulike i loaʻa e ka ʻoihana semiconductor ma waena o ka pono o ka hana ʻana, ka kaohi ʻana i ke kumukūʻai a me ka maʻalahi o ka logistics. Me ka hoʻomohala mau ʻana o ka ʻenehana, hiki ke hoʻoponopono ʻia kēia helu, akā ʻo ke kumu kumu ma hope ona - ka hoʻomaikaʻi ʻana i nā kaʻina hana a me ka hoʻomaikaʻi ʻana i nā pono waiwai - ʻaʻole i loli.
Hoʻohana nā lole wafer 12-'īniha i ka FOUP a me FOSB, a ʻo 8-'īniha a ma lalo (me 8-'īniha) e hoʻohana iā Cassette, SMIF POD, a me ka pahu wafer, ʻo ia hoʻi, ka 12-'īnihamea lawe waferua kapa ʻia ʻo FOUP, a ʻo ka 8-'īnihamea lawe waferua kapa ʻia ʻo Cassette. ʻO ka maʻamau, he 4.2 kg ke kaumaha o kahi FOUP hakahaka, a he 7.3 kg ke kaumaha o kahi FOUP i piha i 25 mau wafers.
Wahi a ka noiʻi a me nā helu helu o ka hui noiʻi QYResearch, ua hōʻea ke kūʻai aku ʻana o ka mākeke pahu wafer honua i 4.8 biliona yuan i ka makahiki 2022, a ua manaʻo ʻia e hōʻea i 7.7 biliona yuan i ka makahiki 2029, me ka nui o ka ulu makahiki hui (CAGR) o 7.9%. Ma ke ʻano o ke ʻano huahana, noho ka semiconductor FOUP i ka hapa nui loa o ka mākeke holoʻokoʻa, ma kahi o 73%. Ma ke ʻano o ka noi huahana, ʻo ka noi nui loa he 12-'īniha wafers, ukali ʻia e 8-'īniha wafers.
ʻO kaʻoiaʻiʻo, he nui nā ʻano mea lawe wafer, e like me FOUP no ka hoʻoili wafer i nā hale hana hana wafer; FOSB no ka halihali ma waena o ka hana wafer silicon a me nā hale hana hana wafer; Hiki ke hoʻohana ʻia nā mea lawe CASSETTE no ka halihali ma waena o nā kaʻina hana a hoʻohana pū ʻia me nā kaʻina hana.
KASETE WEHE
Hoʻohana nui ʻia ka CASSETTE OPEN i nā kaʻina hana halihali a me nā kaʻina hana hoʻomaʻemaʻe i ka hana wafer. E like me FOSB, FOUP a me nā mea lawe ʻē aʻe, hoʻohana pinepine ia i nā mea i kūpaʻa i ka mahana, loaʻa nā waiwai mechanical maikaʻi loa, kūpaʻa dimensional, a paʻa, anti-static, haʻahaʻa out-gassing, haʻahaʻa precipitation, a hiki ke hana hou ʻia. He ʻokoʻa nā nui wafer like ʻole, nā kikowaena hana, a me nā mea i koho ʻia no nā kaʻina hana like ʻole. ʻO nā mea maʻamau ʻo PFA, PTFE, PP, PEEK, PES, PC, PBT, PEI, COP, a pēlā aku. Hoʻolālā maʻamau ʻia ka huahana me ka hiki ke hoʻokomo i 25 mau ʻāpana.
Hiki ke hoʻohana ʻia ka CASSETTE WEHE me ka mea likeKaseta Wafernā huahana no ka mālama ʻana i ka wafer a me ka halihali ʻana ma waena o nā kaʻina hana e hōʻemi i ka haumia o ka wafer.
Hoʻohana ʻia ʻo OPEN CASSETTE me nā huahana Wafer Pod (OHT) i hana maʻamau ʻia, hiki ke hoʻopili ʻia i ka hoʻoili ʻakomi, ke komo ʻakomi a me ka mālama ʻana i sila ʻia ma waena o nā kaʻina hana i ka hana wafer a me ka hana ʻāpana.
ʻOiaʻiʻo, hiki ke hana pololei ʻia ʻo OPEN CASSETTE i nā huahana CASSETTE. Loaʻa i ka huahana Wafer Shipping Boxes kahi ʻano like, e like me ka mea i hōʻike ʻia ma ke kiʻi ma lalo nei. Hiki iā ia ke hoʻokō i nā pono o ka lawe ʻana i nā wafer mai nā hale hana wafer a i nā hale hana chip. Hiki iā CASSETTE a me nā huahana ʻē aʻe i loaʻa mai ia mea ke hoʻokō i nā pono o ka hoʻoili ʻana, ka mālama ʻana a me ka lawe ʻana ma waena o nā hale hana ma waena o nā kaʻina hana like ʻole ma nā hale hana wafer a me nā hale hana chip.
Pahu Hoʻouna Wafer Wehe mua FOSB
Hoʻohana nui ʻia ka Pahu Hoʻouna Wafer Wehe mua ʻo FOSB no ka lawe ʻana i nā wafers 12-'īniha ma waena o nā hale hana hana wafer a me nā hale hana hana chip. Ma muli o ka nui o nā wafers a me nā koi kiʻekiʻe no ka maʻemaʻe; hoʻohana ʻia nā ʻāpana hoʻonoho kūikawā a me ka hoʻolālā pale haʻalulu e hōʻemi i nā haumia i hana ʻia e ka friction neʻe wafer; hana ʻia nā mea maka me nā mea haʻahaʻa-outgassing, hiki ke hōʻemi i ka pilikia o ka hoʻokuʻu ʻana i nā wafers haumia. Ke hoʻohālikelike ʻia me nā pahu wafer lawe ʻē aʻe, ʻoi aku ka maikaʻi o ka paʻa ʻana o ka ea o FOSB. Eia kekahi, ma ka hale hana laina hoʻopili hope, hiki ke hoʻohana ʻia ʻo FOSB no ka mālama ʻana a me ka hoʻoili ʻana i nā wafers ma waena o nā kaʻina hana like ʻole.
Hana ʻia ka FOSB i 25 mau ʻāpana. Ma waho aʻe o ka mālama ʻakomi a me ka loaʻa hou ʻana ma o ka Automated Material Handling System (AMHS), hiki ke hoʻohana lima ʻia.
Pod Unified Wehe mua
Hoʻohana nui ʻia ka Front Opening Unified Pod (FOUP) no ka pale ʻana, ka lawe ʻana a me ka mālama ʻana i nā wafers ma ka hale hana Fab. He pahu lawe koʻikoʻi ia no ka ʻōnaehana lawe automated ma ka hale hana wafer 12-'īniha. ʻO kāna hana nui loa, ʻo ia ka hōʻoia ʻana ua pale ʻia kēlā me kēia 25 wafers e ia i ʻole e haumia ʻia e ka lepo ma ke kaiapuni waho i ka wā o ka hoʻoili ʻana ma waena o kēlā me kēia mīkini hana, a laila e hoʻopilikia ana i ka hua. Loaʻa i kēlā me kēia FOUP nā papa hoʻohui like ʻole, nā pine a me nā lua i hiki ai i ka FOUP ke kau ʻia ma ke awa hoʻouka a hoʻokele ʻia e ka AMHS. Hoʻohana ia i nā mea haʻahaʻa gassing a me nā mea hoʻomoʻa haʻahaʻa, hiki ke hōʻemi nui i ka hoʻokuʻu ʻana o nā hui organik a pale i ka haumia wafer; i ka manawa like, hiki i ka hana sila a me ka hoʻopiha maikaʻi loa ke hāʻawi i kahi kaiapuni haʻahaʻa haʻahaʻa no ka wafer. Eia kekahi, hiki ke hoʻolālā ʻia ʻo FOUP i nā kala like ʻole, e like me ka ʻulaʻula, ʻalani, ʻeleʻele, moakaka, a pēlā aku, e hoʻokō i nā koi hana a hoʻokaʻawale i nā kaʻina hana a me nā kaʻina hana like ʻole; ma ke ʻano laulā, hoʻopilikino ʻia ʻo FOUP e nā mea kūʻai aku e like me ka laina hana a me nā ʻokoʻa mīkini o ka hale hana Fab.
Eia kekahi, hiki ke hoʻopilikino ʻia ʻo POUP i nā huahana kūikawā no nā mea hana ʻōpala e like me nā kaʻina hana like ʻole e like me TSV a me FAN OUT i loko o ka ʻōpala hope chip, e like me SLOT FOUP, 297mm FOUP, a pēlā aku. Hiki ke hana hou ʻia ʻo FOUP, a ʻo kona ola ma waena o 2-4 mau makahiki. Hiki i nā mea hana FOUP ke hāʻawi i nā lawelawe hoʻomaʻemaʻe huahana e hoʻokō i nā huahana haumia e hoʻohana hou ʻia.
Nā mea hoʻouna wafer horizontal contactless
Hoʻohana nui ʻia nā Contactless Horizontal Wafer Shippers no ka lawe ʻana i nā wafers i hoʻopau ʻia, e like me ka mea i hōʻike ʻia ma ke kiʻi ma lalo nei. Hoʻohana ka pahu lawe o Entegris i kahi apo kākoʻo e hōʻoia i ka pili ʻole o nā wafers i ka wā mālama a me ka lawe ʻana, a he sila maikaʻi hoʻi e pale aku i ka haumia, ka ʻaʻahu, ka hoʻokuʻi ʻana, nā ʻōpala, ka degassing, a pēlā aku. He kūpono nui ka huahana no nā wafers Thin 3D, lens a i ʻole bumped, a ʻo kāna mau wahi noi e komo pū me 3D, 2.5D, MEMS, LED a me nā semiconductors mana. Ua lako ka huahana me 26 mau apo kākoʻo, me ka hiki ke wafer o 25 (me nā mānoanoa like ʻole), a ʻo nā nui wafer e komo pū me 150mm, 200mm a me 300mm.
Ka manawa hoʻouna: Iulai-30-2024