A cikin duniyar fasahar zamani mai cike da sarkakiya,wafers, wanda aka fi sani da wafers na silicon, su ne manyan sassan masana'antar semiconductor. Su ne tushen ƙera kayan lantarki daban-daban kamar microprocessors, memory, firikwensin, da sauransu, kuma kowace wafer tana ɗauke da damar da ba a iya samu daga kayan lantarki marasa adadi. To me yasa muke yawan ganin wafers 25 a cikin akwati? Akwai la'akari da kimiyya da tattalin arzikin samar da masana'antu a bayan wannan.
Bayyana dalilin da yasa akwai wafers guda 25 a cikin akwati
Da farko, a fahimci girman wafer ɗin. Girman wafer ɗin da aka saba da shi yawanci inci 12 ne da inci 15, wanda ke nufin daidaitawa da kayan aiki da hanyoyin samarwa daban-daban.Wafers mai inci 12a halin yanzu nau'in ya fi yawa saboda suna iya ɗaukar ƙarin guntu kuma suna da daidaito a cikin farashi da inganci na masana'antu.
Lambar "guda 25" ba ta faru ba ne bisa kuskure. Ya dogara ne akan hanyar yankewa da ingancin marufi na wafer. Bayan an samar da kowace wafer, ana buƙatar a yanke ta don samar da guntu masu zaman kansu da yawa. Gabaɗaya, aWafer mai inci 12zai iya yanke ɗaruruwan ko ma dubban guntu. Duk da haka, don sauƙin sarrafawa da jigilar kaya, waɗannan guntu galibi ana naɗe su a cikin wani adadi, kuma guda 25 zaɓi ne na yawan da aka saba da shi saboda bai yi girma ba kuma bai yi girma ba, kuma yana iya tabbatar da isasshen kwanciyar hankali yayin jigilar kaya.
Bugu da ƙari, adadin guda 25 yana da amfani ga sarrafa kansa da inganta layin samarwa. Samar da rukuni na iya rage farashin sarrafa guda ɗaya da kuma inganta ingancin samarwa. A lokaci guda, don ajiya da jigilar kaya, akwatin wafer mai guda 25 yana da sauƙin aiki kuma yana rage haɗarin karyewa.
Ya kamata a lura cewa tare da ci gaban fasaha, wasu samfuran masu inganci na iya ɗaukar adadi mai yawa na fakiti, kamar guda 100 ko 200, don ƙara inganta ingancin samarwa. Duk da haka, ga yawancin samfuran masu amfani da matsakaicin farashi da matsakaicin farashi, akwatin wafer mai guda 25 har yanzu tsari ne na yau da kullun.
A taƙaice, akwatin wafers yawanci yana ɗauke da guda 25, wanda shine daidaito da masana'antar semiconductor ke samu tsakanin ingancin samarwa, sarrafa farashi da kuma sauƙin amfani da kayayyaki. Tare da ci gaba da haɓaka fasaha, ana iya daidaita wannan adadin, amma ainihin ma'anar da ke bayansa - inganta hanyoyin samarwa da inganta fa'idodin tattalin arziki - har yanzu ba a canza ba.
Wafer fabric masu inci 12 suna amfani da FOUP da FOSB, kuma inci 8 da ƙasa (gami da inci 8) suna amfani da Cassette, SMIF POD, da akwatin jirgin ruwa mai wafer, wato, inci 12.mai ɗaukar waferana kiransa FOUP gaba ɗaya, kuma inci 8mai ɗaukar waferana kiransa Cassette gaba ɗaya. Yawanci, FOUP mara komai yana da nauyin kimanin kilogiram 4.2, kuma FOUP cike da wafers 25 yana da nauyin kimanin kilogiram 7.3.
A cewar bincike da kididdigar ƙungiyar bincike ta QYResearch, tallace-tallacen kasuwar akwatin wafer ta duniya ya kai yuan biliyan 4.8 a shekarar 2022, kuma ana sa ran zai kai yuan biliyan 7.7 a shekarar 2029, tare da karuwar ci gaban shekara-shekara (CAGR) na kashi 7.9%. Dangane da nau'in samfura, semiconductor FOUP ya mamaye mafi girman kaso na dukkan kasuwar, kimanin kashi 73%. Dangane da aikace-aikacen samfura, mafi girman aikace-aikacen shine wafer mai inci 12, sai wafer mai inci 8.
A zahiri, akwai nau'ikan masu ɗaukar wafer da yawa, kamar FOUP don canja wurin wafer a cikin masana'antar kera wafer; FOSB don jigilar kaya tsakanin samar da wafer na silicon da masana'antar kera wafer; ana iya amfani da masu ɗaukar CASSETTE don jigilar kaya tsakanin aikace-aikace da amfani tare da hanyoyin aiki.
A BUƊE KASET
Ana amfani da OPEN CASSETTE a fannin sufuri da tsaftacewa tsakanin matakai a masana'antar wafer. Kamar FOSB, FOUP da sauran masu ɗaukar kaya, galibi yana amfani da kayan da ke jure zafin jiki, suna da kyawawan halaye na injiniya, kwanciyar hankali na girma, kuma suna da ɗorewa, hana tsatsa, ƙarancin fitar da iskar gas, ƙarancin ruwan sama, kuma ana iya sake amfani da su. Girman wafer daban-daban, hanyoyin sarrafawa, da kayan da aka zaɓa don ayyuka daban-daban sun bambanta. Kayan gabaɗaya sune PFA, PTFE, PP, PEEK, PES, PC, PBT, PEI, COP, da sauransu. Gabaɗaya an tsara samfurin da ƙarfin guda 25.
Ana iya amfani da BUƊE CASSETTE tare da haɗin kai da ya daceKaset ɗin Waferkayayyakin ajiya na wafer da jigilar su tsakanin hanyoyin don rage gurɓatar wafer.
Ana amfani da BUƊE CASSETTE tare da samfuran Wafer Pod (OHT) na musamman, waɗanda za a iya amfani da su ga watsawa ta atomatik, samun dama ta atomatik da ƙarin ajiyar ajiya tsakanin hanyoyin da ake amfani da su a cikin kera wafer da kera guntu.
Ba shakka, ana iya yin OPEN CASSETTE kai tsaye zuwa samfuran CASSETTE. Kayan da ke cikin Akwatunan jigilar kaya na Wafer suna da irin wannan tsari, kamar yadda aka nuna a cikin hoton da ke ƙasa. Yana iya biyan buƙatun jigilar wafer daga masana'antun kera wafer zuwa masana'antun kera guntu. CASSETTE da sauran samfuran da aka samo daga gare shi na iya biyan buƙatun watsawa, ajiya da jigilar tsakanin masana'antu tsakanin matakai daban-daban a masana'antun wafer da masana'antun guntu.
Akwatin jigilar kaya na Wafer na Gaba
Akwatin Jigilar Wafer na Buɗewa a Gaba Ana amfani da FOSB ne musamman don jigilar wafers mai inci 12 tsakanin masana'antun wafer da masana'antun guntu. Saboda girman wafers da buƙatun tsafta mafi girma; ana amfani da kayan sanyawa na musamman da ƙirar hana girgiza don rage ƙazanta da gogayya ta hanyar maye gurbin wafer; kayan an yi su ne da kayan da ba su da iskar gas mai yawa, wanda zai iya rage haɗarin gurɓatar wafers masu fitar da iskar gas. Idan aka kwatanta da sauran akwatunan wafer na sufuri, FOSB yana da mafi kyawun matse iska. Bugu da ƙari, a masana'antar layin marufi na baya, ana iya amfani da FOSB don ajiya da canja wurin wafers tsakanin ayyuka daban-daban.
Gabaɗaya ana yin FOSB zuwa guda 25. Baya ga ajiya ta atomatik da kuma dawo da shi ta hanyar Tsarin Kula da Kayan Aiki ta atomatik (AMHS), ana iya sarrafa shi da hannu.
Gaban Buɗewa Haɗaɗɗen Pod
Ana amfani da Foda Mai Haɗaka ta Gaba (FOUP) don kariya, jigilar kaya da adana wafers a masana'antar Fab. Akwati ne mai mahimmanci don tsarin jigilar kaya ta atomatik a masana'antar wafer mai inci 12. Babban aikinsa shine tabbatar da cewa kowace wafer 25 ta sami kariya daga gare ta don guje wa gurɓata ƙura a cikin muhallin waje yayin watsawa tsakanin kowace injin samarwa, ta haka yana shafar yawan amfanin ƙasa. Kowace FOUP tana da faranti, fil da ramuka daban-daban don FOUP ta kasance a kan tashar kaya kuma AMHS ke sarrafawa. Yana amfani da kayan fitar da iskar gas mai ƙarancin iska da kayan shaye-shaye masu ƙarancin danshi, wanda zai iya rage sakin mahaɗan halitta sosai da hana gurɓatar wafer; a lokaci guda, kyakkyawan aikin rufewa da hauhawar farashin kaya na iya samar da yanayin ƙarancin danshi ga wafer. Bugu da ƙari, ana iya tsara FOUP a launuka daban-daban, kamar ja, lemu, baƙi, mai haske, da sauransu, don biyan buƙatun tsari da bambance-bambancen tsari da matakai daban-daban; gabaɗaya, abokan ciniki suna keɓance FOUP bisa ga layin samarwa da bambance-bambancen injin masana'antar Fab.
Bugu da ƙari, ana iya keɓance POUP zuwa samfura na musamman ga masana'antun marufi bisa ga tsari daban-daban kamar TSV da FAN OUT a cikin marufi na baya-bayan guntu, kamar SLOT FOUP, 297mm FOUP, da sauransu. Ana iya sake yin amfani da FOUP, kuma tsawon rayuwarsa yana tsakanin shekaru 2-4. Masana'antun FOUP za su iya ba da ayyukan tsaftace samfura don dacewa da samfuran da suka gurɓata don sake amfani da su.
Masu jigilar Wafer na kwance ba tare da taɓawa ba
Ana amfani da masu jigilar wafer marasa taɓawa don jigilar wafers ɗin da aka gama, kamar yadda aka nuna a cikin hoton da ke ƙasa. Akwatin jigilar Entegris yana amfani da zoben tallafi don tabbatar da cewa wafers ɗin ba sa taɓawa yayin ajiya da jigilar kaya, kuma yana da kyakkyawan rufewa don hana gurɓatar datti, lalacewa, karo, ƙarce, cire gas, da sauransu. Samfurin ya dace da Thin 3D, ruwan tabarau ko wafers masu bumped, kuma wuraren amfani da shi sun haɗa da 3D, 2.5D, MEMS, LED da na'urorin lantarki masu ƙarfin lantarki. Samfurin yana da zoben tallafi guda 26, tare da ƙarfin wafer na 25 (tare da kauri daban-daban), kuma girman wafer ya haɗa da 150mm, 200mm da 300mm.
Lokacin Saƙo: Yuli-30-2024