Mu isi igezweho y'ikoranabuhanga,uduce duto twa wafer, izwi kandi nka silicon wafers, ni byo bice by'ingenzi by'inganda za semiconductor. Ni byo shingiro ryo gukora ibice bitandukanye by'ikoranabuhanga nka microprocessors, memory, sensors, nibindi, kandi buri wafer ifite ubushobozi bw'ibice byinshi by'ikoranabuhanga. None se kuki dukunze kubona wafers 25 mu gasanduku? Mu by'ukuri hari ibya siyansi n'ubukungu bw'umusaruro w'inganda inyuma y'ibi.
Guhishura impamvu hari wafer 25 mu gasanduku
Ubwa mbere, sobanukirwa ingano ya wafer. Ingano zisanzwe za wafer akenshi ni santimetero 12 na santimetero 15, ibyo bikaba ari ukugira ngo bihuzwe n'ibikoresho bitandukanye byo gukora n'imikorere.Udupaki twa santimetero 12ubu ni zo zikunze kugaragara cyane kuko zishobora kwakira chips nyinshi kandi zikaba zifite uburinganire mu bijyanye n'ikiguzi n'imikorere myiza y'inganda.
Umubare "ibice 25" ntabwo ari impanuka. Ushingiye ku buryo bwo gukata no gukoresha neza ipaki. Nyuma yuko buri ipaki ikozwe, igomba gukatwa kugira ngo ikoremo uduce twinshi twigenga. Muri rusange,Agace k'umugati ka santimetero 12ishobora gukata amafiriti amagana cyangwa ibihumbi. Ariko, kugira ngo byorohere gucunga no gutwara, izi firiti akenshi ziba zipakiye mu gipimo runaka, kandi ibice 25 ni amahitamo asanzwe kuko atari binini cyane cyangwa binini cyane, kandi bishobora gutuma habaho ituze rihagije mu gihe cyo gutwara.
Byongeye kandi, ingano y'ibice 25 nayo ituma umurongo w'ibicuruzwa ukorwa ugenda neza kandi ugakorwa neza. Gutunganya ibice byinshi bishobora kugabanya ikiguzi cyo gutunganya ikintu kimwe no kunoza imikorere. Muri icyo gihe, mu kubika no gutwara, agasanduku k'ibice 25 byoroshye gukoresha kandi bigabanya ibyago byo kwangirika.
Ni ngombwa kumenya ko hamwe n’iterambere ry’ikoranabuhanga, bimwe mu bicuruzwa byo ku rwego rwo hejuru bishobora gukoresha umubare munini w’ibipaki, nk’ibice 100 cyangwa 200, kugira ngo birusheho kunoza umusaruro. Ariko, ku bicuruzwa byinshi byo mu rwego rwo hejuru n’ibyo mu rwego rwo hagati, agasanduku k’ibice 25 ka wafer karacyari imiterere isanzwe.
Muri make, agasanduku k'amacupa ya wafers gakunze kuba karimo ibice 25, ari nabyo bigereranywa n'inganda zikora ibikoresho bya semiconductor hagati yo kunoza umusaruro, kugenzura ikiguzi no koroshya imicungire y'ibikoresho. Hamwe n'iterambere rihoraho ry'ikoranabuhanga, uyu mubare ushobora guhindurwa, ariko impamvu nyamukuru iwugize - kunoza inzira zo gukora no kunoza inyungu z'ubukungu - ntihinduka.
Imashini za wafer za santimetero 12 zikoresha FOUP na FOSB, naho santimetero 8 no munsi (harimo santimetero 8) zikoresha Cassette, SMIF POD, n'agasanduku k'ubwato bwa wafer, ni ukuvuga santimetero 12.umutwaro w'isukarirusange yitwa FOUP, naho santimetero 8umutwaro w'isukariBisangwa byose hamwe byitwa Cassette. Ubusanzwe, FOUP irimo ubusa ipima ibiro bigera kuri 4.2, naho FOUP yuzuyemo wafer 25 ipima ibiro bigera kuri 7.3.
Dukurikije ubushakashatsi n'imibare by'itsinda ry'ubushakashatsi rya QYResearch, isoko ry'ibicuruzwa bya wafer box ku isi ryageze kuri miliyari 4.8 z'amayuan mu 2022, kandi biteganijwe ko rizagera kuri miliyari 7.7 z'amayuan mu 2029, hamwe n'igipimo cy'izamuka ry'ibiciro ku mwaka (CAGR) cya 7.9%. Mu bijyanye n'ubwoko bw'ibicuruzwa, FOUP ifite igice kinini cy'isoko ryose, hafi 73%. Mu bijyanye n'ikoreshwa ry'ibicuruzwa, ikoreshwa rinini ni wafer za santimetero 12, hagakurikiraho wafer za santimetero 8.
Mu by’ukuri, hari ubwoko bwinshi bw’ibikoresho byo gutwara wafer, nka FOUP yo kohereza wafer mu nganda zikora wafer; FOSB yo gutwara hagati y’inganda zikora wafer za silicon n’inganda zikora wafer; ibikoresho bya CASSETTE bishobora gukoreshwa mu gutwara no gukoresha mu nganda zikora ibintu bitandukanye.
FUNGUYE KASETI
KASSETTE IFUNGUYE ikoreshwa cyane cyane mu gutwara no gusukura ibikoresho bitandukanye mu gukora wafer. Kimwe na FOSB, FOUP n'ibindi bikoresho, muri rusange ikoresha ibikoresho birwanya ubushyuhe, bifite imiterere myiza ya mekanike, bihamye mu ngero, kandi biramba, birwanya static, ntibisohoka neza, imvura nke, kandi bishobora kongera gukoreshwa. Ingano zitandukanye za wafer, uduce duto two gutunganya, n'ibikoresho byatoranijwe mu bikorwa bitandukanye biratandukanye. Ibikoresho rusange ni PFA, PTFE, PP, PEEK, PES, PC, PBT, PEI, COP, nibindi. Ibikoresho muri rusange byakozwe bifite ubushobozi bwo gukora ibice 25.
KASETI IFUNGUYE ishobora gukoreshwa hamwe n'ibijyanye nayoKaseti ya Waferibikoresho byo kubika no gutwara wafer hagati y’ibikorwa kugira ngo bigabanye ubwandu bwa wafer.
KASSETTE IFUNGUYE ikoreshwa hamwe n'ibicuruzwa bya Wafer Pod (OHT) byihariye, bishobora gukoreshwa mu kohereza ibicuruzwa mu buryo bwikora, kwinjira mu buryo bwikora no kubika neza hagati y'ibikorwa byo gukora wafer no gukora chips.
Birumvikana ko KASSETTE IFUNGUYE ishobora gukorwamo ibicuruzwa bya KASSETTE. Udusanduku two kohereza ibicuruzwa bya Wafer dufite imiterere nk'iyo, nk'uko bigaragara ku ishusho iri hepfo. Ishobora guhaza ibyifuzo byo gutwara wafer kuva mu nganda zikora wafer kugera mu nganda zikora chips. KASSETTE n'ibindi bicuruzwa bikomoka kuri yo bishobora guhaza ibyifuzo byo kohereza, kubika no gutwara hagati y'inganda hagati y'ibikorwa bitandukanye mu nganda za wafer n'inganda za chips.
Agasanduku k'ubwikorezi bw'imashini ifunguye imbere ya FOSB
Agasanduku k’imashini zitwara imyanda gafunguye imbere FOSB gakoreshwa cyane cyane mu gutwara imyanda ya santimetero 12 hagati y’inganda zikora imyanda n’inganda zikora imyanda. Kubera ko imyanda ari myinshi kandi isuku ikenewe cyane; ibice byihariye byo gushyiramo imyanda n’imiterere yayo bikoreshwa mu kugabanya imyanda iterwa no gukururana kw’imyanda; ibikoresho fatizo bikozwe mu bikoresho bigabanya imyuka, bishobora kugabanya ibyago byo kwanduza imyanda. Ugereranyije n’andi masanduku y’imyanda atwara imyanda, FOSB ifite ubushobozi bwo gufata umwuka neza. Byongeye kandi, mu ruganda rukora imyanda yo gupakira inyuma, FOSB ishobora no gukoreshwa mu kubika no kohereza imyanda hagati y’ibikorwa bitandukanye.
FOSB muri rusange ikorwamo ibice 25. Uretse kubika no kugarura ibintu mu buryo bwikora binyuze muri Sisitemu yo Gufata Ibintu mu buryo bwikora (AMHS), ishobora no gukoreshwa n'intoki.
Ifungura ry'imbere ry'agasanduku kamwe
Ifuru y'imbere ifunguye (FOUP) ikoreshwa cyane cyane mu kurinda, gutwara no kubika wafers mu ruganda rwa Fab. Ni igikoresho cy'ingenzi gitwara wafers mu ruganda rwa wafer rwa santimetero 12. Inshingano yayo y'ingenzi ni ukugenzura ko wafers 25 zose zirinzwe na yo kugira ngo hirindwe kwanduzwa n'umukungugu mu kirere cyo hanze mu gihe cyo kohereza hagati ya buri mashini ikora, bityo bigira ingaruka ku musaruro. Buri FOUP ifite ibyuma bitandukanye bihuza, imigozi n'imyobo kugira ngo FOUP iba iri ku cyambu cyo gupakira kandi ikoreshwe na AMHS. Ikoresha ibikoresho bike bisohora imyuka n'ibikoresho bike bikuramo ubushuhe, bishobora kugabanya cyane irekurwa ry'ibintu bikomoka ku bimera no gukumira kwanduzwa kwa wafers; icyarimwe, akazi keza ko gufunga no gusohora ibiciro bishobora gutanga ahantu hato ho guhumeka kuri wafers. Byongeye kandi, FOUP ishobora gushushanywa mu mabara atandukanye, nk'umutuku, umuhondo, umukara, ubonerana, nibindi, kugira ngo ihuze n'ibisabwa mu buryo bwo gukora no gutandukanya inzira n'imikorere itandukanye; muri rusange, FOUP ihindurwa n'abakiriya hakurikijwe umurongo w'umusaruro n'itandukaniro ry'imashini z'uruganda rwa Fab.
Byongeye kandi, POUP ishobora guhindurwamo ibicuruzwa byihariye ku bakora udukarito hakurikijwe inzira zitandukanye nka TSV na FAN OUT mu dupaki tw’inyuma, nka SLOT FOUP, 297mm FOUP, nibindi. FOUP ishobora kongera gukoreshwa, kandi igihe cyayo ni hagati y’imyaka 2-4. Abakora FOUP bashobora gutanga serivisi zo gusukura ibicuruzwa kugira ngo bahuze n’ibicuruzwa byanduye kugira ngo byongere bikoreshwe.
Abatwara Wafer batambitse badafite aho bahuriye
Imashini zitwara imizigo zitagira aho zihurira zikoreshwa cyane cyane mu gutwara imizigo zirangiye, nk'uko bigaragara ku ishusho iri hepfo. Agasanduku k'ubwikorezi ka Entegris gakoresha impeta yo gushyigikira kugira ngo wirinde ko imizigo ikora mu gihe cyo kubika no gutwara, kandi gafite uburyo bwo kuzifunga neza kugira ngo hirindwe kwanduzwa, kwangirika, gukubitana, gushwanyagurika, gusohora imyuka, nibindi. Iki gicuruzwa gikwiriye cyane cyane imizigo ya Thin 3D, lens cyangwa bumped wafers, kandi ahantu ikoreshwa harimo 3D, 2.5D, MEMS, LED na semiconductors zikoresha ingufu. Iki gicuruzwa gifite impeta 26 zo gushyigikira, zifite ubushobozi bwa wafer ya 25 (ifite ubunini butandukanye), kandi ingano ya wafer irimo 150mm, 200mm na 300mm.
Igihe cyo kohereza: 30 Nyakanga-2024