Mu dziko lamakono la ukadaulo wamakono,ma wafer, yomwe imadziwikanso kuti ma wafer a silicon, ndi zinthu zofunika kwambiri pamakampani opanga ma semiconductor. Ndiwo maziko opangira zinthu zosiyanasiyana zamagetsi monga ma microprocessor, memory, masensa, ndi zina zotero, ndipo wafer iliyonse imakhala ndi mphamvu ya zinthu zambiri zamagetsi. Nanga nchifukwa chiyani nthawi zambiri timawona ma wafer 25 m'bokosi? Pali mfundo zasayansi komanso zachuma pakupanga mafakitale kumbuyo kwa izi.
Kuwulula chifukwa chake pali ma wafer 25 m'bokosi
Choyamba, mvetsetsani kukula kwa wafer. Kukula kwa wafer wamba nthawi zambiri kumakhala mainchesi 12 ndi mainchesi 15, zomwe zimagwirizana ndi zida zosiyanasiyana zopangira ndi njira zosiyanasiyana.Ma wafer a mainchesi 12Pakadali pano ndi mitundu yofala kwambiri chifukwa imatha kusunga ma chip ambiri ndipo imakhala yofanana pa mtengo wopangira komanso magwiridwe antchito.
Nambala ya "zidutswa 25" si yangozi. Imachokera ku njira yodulira ndi momwe wafer imagwirira ntchito bwino. Wafer iliyonse ikapangidwa, imafunika kudulidwa kuti ipange tchipisi tambiri todziyimira payokha. Kawirikawiri,Chophimba cha mainchesi 12akhoza kudula ma chips mazana kapena zikwi. Komabe, kuti azisamalidwa mosavuta komanso azinyamulidwa, ma chips awa nthawi zambiri amapakidwa mu kuchuluka kwina, ndipo zidutswa 25 ndi zomwe anthu ambiri amasankha chifukwa si zazikulu kwambiri kapena zazikulu kwambiri, ndipo zimatha kutsimikizira kukhazikika kokwanira panthawi yonyamula.
Kuphatikiza apo, kuchuluka kwa zidutswa 25 kumathandizanso kuti mzere wopangira ukhale wokhazikika komanso wokonzedwa bwino. Kupanga zinthu zambiri kungachepetse mtengo wokonza chinthu chimodzi ndikuwonjezera magwiridwe antchito. Nthawi yomweyo, posungira ndi kunyamula, bokosi la wafer la zidutswa 25 ndi losavuta kugwiritsa ntchito ndipo limachepetsa chiopsezo cha kusweka.
Ndikofunikira kudziwa kuti chifukwa cha kupita patsogolo kwa ukadaulo, zinthu zina zapamwamba zitha kugwiritsa ntchito mapaketi ambiri, monga zidutswa 100 kapena 200, kuti ziwongolere bwino ntchito yopangira. Komabe, pazinthu zambiri zomwe zimagwiritsidwa ntchito ndi ogula komanso zapakatikati, bokosi la wafer la zidutswa 25 likadali lodziwika bwino.
Mwachidule, bokosi la ma wafer nthawi zambiri limakhala ndi zidutswa 25, zomwe ndi mgwirizano womwe makampani opanga zinthu zosiyanasiyana amapeza pakati pa kupanga bwino, kuwongolera ndalama, komanso kusavuta kwa zinthu. Ndi chitukuko chopitilira cha ukadaulo, chiwerengerochi chikhoza kusinthidwa, koma mfundo yoyambira kumbuyo kwake - kukonza njira zopangira ndikukweza phindu lazachuma - sichinasinthe.
Ma wafer fab a mainchesi 12 amagwiritsa ntchito FOUP ndi FOSB, ndipo mainchesi 8 ndi pansi (kuphatikiza mainchesi 8) amagwiritsa ntchito Cassette, SMIF POD, ndi bokosi la wafer boat, kutanthauza, mainchesi 12.chonyamulira chophikiraonse pamodzi amatchedwa FOUP, ndipo mainchesi 8chonyamulira chophikiraKawirikawiri, FOUP yopanda kanthu imalemera pafupifupi 4.2 kg, ndipo FOUP yodzaza ndi ma wafer 25 imalemera pafupifupi 7.3 kg.
Malinga ndi kafukufuku ndi ziwerengero za gulu lofufuza la QYResearch, malonda a msika wa ma wafer box padziko lonse lapansi adafika pa 4.8 biliyoni ya yuan mu 2022, ndipo akuyembekezeka kufika pa 7.7 biliyoni ya yuan mu 2029, ndi kuchuluka kwa kukula kwa pachaka (CAGR) kwa 7.9%. Ponena za mtundu wa malonda, semiconductor FOUP ili ndi gawo lalikulu kwambiri pamsika wonse, pafupifupi 73%. Ponena za kugwiritsa ntchito malonda, ntchito yayikulu kwambiri ndi ma wafer a mainchesi 12, kutsatiridwa ndi ma wafer a mainchesi 8.
Ndipotu, pali mitundu yambiri ya zonyamulira ma wafer, monga FOUP yotumizira ma wafer m'mafakitale opanga ma wafer; FOSB yotumizira pakati pa mafakitale opanga ma wafer a silicon ndi mafakitale opanga ma wafer; zonyamulira ma CASSETTE zitha kugwiritsidwa ntchito ponyamula ndikugwiritsa ntchito limodzi ndi njira zina.
KASETI YOTSEGULIRA
OPEN CASETTE imagwiritsidwa ntchito makamaka poyendetsa ndi kuyeretsa pakati pa njira zopangira ma wafer. Monga FOSB, FOUP ndi zonyamulira zina, nthawi zambiri imagwiritsa ntchito zinthu zomwe sizimatentha kwambiri, zimakhala ndi mphamvu zabwino kwambiri zamakanika, zimakhala zokhazikika, zimakhala zolimba, sizimatuluka mpweya wambiri, sizimagwa mvula yambiri, komanso zimatha kubwezeretsedwanso. Kukula kosiyanasiyana kwa ma wafer, ma process node, ndi zinthu zomwe zasankhidwa pazinthu zosiyanasiyana ndizosiyana. Zipangizo zambiri ndi PFA, PTFE, PP, PEEK, PES, PC, PBT, PEI, COP, ndi zina zotero. Chogulitsachi nthawi zambiri chimapangidwa ndi mphamvu ya zidutswa 25.
KASETI YOTSEGULIRA ingagwiritsidwe ntchito limodzi ndi cholembera chofananachoKaseti Yophikidwa Pang'onozinthu zosungiramo ma wafer ndi kunyamula pakati pa njira zosiyanasiyana kuti muchepetse kuipitsidwa kwa ma wafer.
OPEN CASETTE imagwiritsidwa ntchito limodzi ndi zinthu za Wafer Pod (OHT) zomwe zakonzedwa mwamakonda, zomwe zingagwiritsidwe ntchito potumiza zinthu zokha, njira yolumikizira yokha komanso malo osungira otsekedwa bwino pakati pa njira zopangira ma wafer ndi kupanga ma chip.
Zachidziwikire, OPEN CASETTE ikhoza kupangidwa mwachindunji kukhala zinthu za CASSETTE. Mabokosi Otumizira a Wafer ali ndi kapangidwe kotere, monga momwe chithunzi chili pansipa. Ikhoza kukwaniritsa zosowa za mayendedwe a wafer kuchokera ku mafakitale opanga ma wafer kupita ku mafakitale opanga ma chip. CASSETTE ndi zinthu zina zochokera mmenemo zimatha kukwaniritsa zosowa za kutumiza, kusungira ndi mayendedwe pakati pa mafakitale pakati pa njira zosiyanasiyana m'mafakitale opanga ma wafer ndi mafakitale a ma chip.
Bokosi Lotumizira la Wafer Lotsegulira Kutsogolo la FOSB
Bokosi Lotumizira la Wafer Lotsegulira Kutsogolo la FOSB limagwiritsidwa ntchito makamaka ponyamula ma wafer a mainchesi 12 pakati pa mafakitale opanga ma wafer ndi mafakitale opanga ma chip. Chifukwa cha kukula kwakukulu kwa ma wafer ndi zofunikira zapamwamba zaukhondo; zidutswa zapadera zoyikira ndi kapangidwe kosagwedezeka zimagwiritsidwa ntchito kuchepetsa zinyalala zomwe zimapangidwa ndi kusuntha kwa wafer; zipangizo zopangira zimapangidwa ndi zipangizo zotsika mpweya, zomwe zingachepetse chiopsezo cha ma wafer omwe amadetsa mpweya. Poyerekeza ndi mabokosi ena onyamula ma wafer, FOSB ili ndi mpweya wabwino. Kuphatikiza apo, mu fakitale yopangira ma packaging, FOSB ingagwiritsidwenso ntchito kusungira ndi kusamutsa ma wafer pakati pa njira zosiyanasiyana.
FOSB nthawi zambiri imapangidwa m'zidutswa 25. Kuwonjezera pa kusungira ndi kubweza zokha kudzera mu Automated Material Handling System (AMHS), ingagwiritsidwenso ntchito pamanja.
Kutsegulira Kutsogolo Pod Yogwirizana
FOUP (Front Opening Unified Pod) imagwiritsidwa ntchito makamaka poteteza, kunyamula, ndi kusungira ma wafers mu fakitale ya Fab. Ndi chidebe chofunikira chonyamulira makina oyendetsera okha mu fakitale ya ma wafers ya mainchesi 12. Ntchito yake yofunika kwambiri ndikuwonetsetsa kuti ma wafers 25 aliwonse atetezedwa ndi iyo kuti asadetsedwe ndi fumbi lakunja panthawi yotumizira pakati pa makina aliwonse opangira, zomwe zimakhudza phindu. FOUP iliyonse ili ndi mbale zosiyanasiyana zolumikizira, ma pini, ndi mabowo kotero kuti FOUP ili pamalo onyamulira katundu ndipo imayendetsedwa ndi AMHS. Imagwiritsa ntchito zipangizo zotulutsa mpweya wochepa komanso zinthu zonyowa chinyezi chochepa, zomwe zimachepetsa kwambiri kutulutsidwa kwa mankhwala achilengedwe ndikuletsa kuipitsidwa kwa ma wafers; nthawi yomweyo, ntchito yabwino kwambiri yotseka ndi kutsika kwa mpweya ingapereke malo okhala ndi chinyezi chochepa kwa ma wafers. Kuphatikiza apo, FOUP ikhoza kupangidwa mumitundu yosiyanasiyana, monga yofiira, lalanje, yakuda, yowonekera, ndi zina zotero, kuti ikwaniritse zofunikira panjira ndikusiyanitsa njira ndi njira zosiyanasiyana; nthawi zambiri, FOUP imasinthidwa ndi makasitomala malinga ndi mzere wopanga ndi kusiyana kwa makina a fakitale ya Fab.
Kuphatikiza apo, POUP ikhoza kusinthidwa kukhala zinthu zapadera za opanga ma CD malinga ndi njira zosiyanasiyana monga TSV ndi FAN OUT mu ma chip-end packaging, monga SLOT FOUP, 297mm FOUP, ndi zina zotero. FOUP ikhoza kubwezeretsedwanso, ndipo nthawi yake ya moyo ndi pakati pa zaka 2-4. Opanga FOUP angapereke ntchito zoyeretsa zinthu kuti akwaniritse zinthu zodetsedwa kuti zigwiritsidwenso ntchito.
Otumiza Ma Wafer Opanda Kukhudza
Ma Wafer Opanda Kukhudza Omwe Amatumizidwa amagwiritsidwa ntchito makamaka ponyamula ma wafer omalizidwa, monga momwe chithunzi chili pansipa chikusonyezera. Bokosi lonyamulira la Entegris limagwiritsa ntchito mphete yothandizira kuti ma wafer asakhudze panthawi yosungira ndi kunyamula, ndipo lili ndi chitseko chabwino choteteza kuipitsidwa, kuwonongeka, kugundana, kukanda, kuchotsa mpweya, ndi zina zotero. Chogulitsachi ndi choyenera kwambiri ma wafer a Thin 3D, lens kapena bumped, ndipo malo ogwiritsira ntchito ndi monga 3D, 2.5D, MEMS, LED ndi ma semiconductor amphamvu. Chogulitsachi chili ndi mphete zothandizira 26, zokhala ndi mphamvu ya wafer ya 25 (yokhala ndi makulidwe osiyanasiyana), ndipo kukula kwa wafer kumaphatikizapo 150mm, 200mm ndi 300mm.
Nthawi yotumizira: Julayi-30-2024