Kungani ibhokisi le-wafer liqukethe ama-wafer angu-25?

Ezweni eliyinkimbinkimbi lobuchwepheshe besimanje,ama-wafer, eyaziwa nangokuthi ama-wafer e-silicon, yizona zinto eziyinhloko embonini ye-semiconductor. Ziyisisekelo sokukhiqiza izingxenye ezahlukene ze-elekthronikhi njenge-microprocessors, inkumbulo, izinzwa, njll., futhi i-wafer ngayinye inamandla ezingxenye eziningi ze-elekthronikhi. Pho kungani sivame ukubona ama-wafer angu-25 ebhokisini? Empeleni kukhona izinto ezicatshangelwayo zesayensi kanye nezomnotho zokukhiqiza kwezimboni ngemuva kwalokhu.

 

Kwembula isizathu sokuthi kungani kukhona ama-wafer angu-25 ebhokisini

Okokuqala, qonda usayizi we-wafer. Ubukhulu be-wafer obujwayelekile buvame ukuba ngamasentimitha angu-12 namasentimitha angu-15, okuwukuzivumelanisa nemishini nezinqubo ezahlukene zokukhiqiza.Ama-wafer angu-12 intshiokwamanje uhlobo oluvame kakhulu ngoba lungamukela ama-chip amaningi futhi lulinganisela kahle izindleko zokukhiqiza kanye nokusebenza kahle.

Inombolo "yezingcezu ezingu-25" ayiyona ingozi. Isekelwe endleleni yokusika kanye nokusebenza kahle kokupakisha kwe-wafer. Ngemva kokuba i-wafer ngayinye ikhiqizwe, idinga ukunqunywa ukuze kwakhiwe ama-chips amaningi azimele. Ngokuvamile, i-I-wafer engamasentimitha angu-12ingasika amakhulu noma ngisho nezinkulungwane zama-chips. Kodwa-ke, ukuze kube lula ukuphatha nokuthuthwa, lawa ma-chips avame ukupakishwa ngenani elithile, futhi izingcezu ezingu-25 ziyisinqumo esivamile senani ngoba azinkulu kakhulu futhi azinkulu kakhulu, futhi zingaqinisekisa ukuzinza okwanele ngesikhathi sokuthuthwa.

Ngaphezu kwalokho, inani lezingcezu ezingu-25 liphinde lisize ekwenziweni ngokuzenzakalela kanye nokwenza ngcono umugqa wokukhiqiza. Ukukhiqizwa kweqembu kunganciphisa izindleko zokucubungula zengcezu eyodwa futhi kuthuthukise ukusebenza kahle kokukhiqiza. Ngesikhathi esifanayo, ukuze kugcinwe futhi kuthuthwe, ibhokisi le-wafer lezingcezu ezingu-25 kulula ukulisebenzisa futhi kunciphisa ingozi yokuphuka.

Kuyaphawuleka ukuthi ngokuthuthuka kobuchwepheshe, eminye imikhiqizo esezingeni eliphezulu ingase isebenzise inani elikhulu lamaphakheji, njengezingcezu eziyi-100 noma ezingama-200, ukuze ithuthukise ukusebenza kahle kokukhiqiza. Kodwa-ke, emikhiqizweni eminingi yabathengi kanye nephakathi nendawo, ibhokisi le-wafer elinama-piece angu-25 liseyindlela evamile yokucushwa.

Ngamafuphi, ibhokisi lama-wafer ngokuvamile liqukethe izingcezu ezingu-25, okuyibhalansi etholakala embonini ye-semiconductor phakathi kokusebenza kahle kokukhiqiza, ukulawulwa kwezindleko kanye nokulula kokuthutha. Ngokuthuthuka okuqhubekayo kobuchwepheshe, leli nani lingalungiswa, kodwa umqondo oyisisekelo ngemuva kwalo - ukwenza ngcono izinqubo zokukhiqiza kanye nokuthuthukisa izinzuzo zezomnotho - awushintshi.

Izingubo ze-wafer ezingamasentimitha angu-12 zisebenzisa i-FOUP ne-FOSB, kanti ezingamasentimitha angu-8 nangaphansi (kufaka phakathi amasentimitha angu-8) zisebenzisa i-Cassette, i-SMIF POD, kanye nebhokisi lesikebhe se-wafer, okungukuthi, i-12-intshiisithwali se-waferibizwa ngokuthi i-FOUP, kanye ne-8-inchisithwali se-waferibizwa ngokuthi i-Cassette. Ngokuvamile, i-FOUP engenalutho inesisindo esingaba ngu-4.2 kg, kanti i-FOUP egcwele ama-wafer angu-25 inesisindo esingaba ngu-7.3 kg.
Ngokusho kocwaningo nezibalo zethimba locwaningo lwe-QYResearch, ukuthengiswa kwemakethe yamabhokisi e-wafer emhlabeni wonke kufinyelele kuma-yuan ayizigidi eziyizinkulungwane ezingu-4.8 ngo-2022, futhi kulindeleke ukuthi kufinyelele kuma-yuan ayizigidi eziyizinkulungwane ezingu-7.7 ngo-2029, ngesilinganiso sokukhula sonyaka esihlanganisiwe (CAGR) esingu-7.9%. Ngokuphathelene nohlobo lomkhiqizo, i-semiconductor FOUP ithatha isabelo esikhulu kunazo zonke emakethe yonke, cishe u-73%. Ngokuphathelene nokusetshenziswa komkhiqizo, isicelo esikhulu kunazo zonke ama-wafer angamasentimitha angu-12, alandelwe ama-wafer angamasentimitha angu-8.

Eqinisweni, kunezinhlobo eziningi zezithwali ze-wafer, njenge-FOUP yokudlulisa i-wafer ezitshalweni zokukhiqiza i-wafer; i-FOSB yokuthutha phakathi kwezitshalo zokukhiqiza i-silicon wafer kanye nezitshalo zokukhiqiza i-wafer; izithwali ze-CASSETTE zingasetshenziswa ekuthuthweni nasekusetshenzisweni kwezinqubo ezahlukene kanye nezinqubo kanye nezinqubo.

 

IKHASETHI EVULEKILE

I-Open Cassette isetshenziswa kakhulu ezinqubweni zokuthutha kanye nokuhlanza phakathi kwezinqubo ekukhiqizeni i-wafer. Njenge-FOSB, i-FOUP kanye nezinye izithwali, ngokuvamile isebenzisa izinto ezingamelani nokushisa, ezinezakhiwo ezinhle kakhulu zemishini, ukuzinza okulinganayo, futhi ezihlala isikhathi eside, ezingamelani nokuma, ezingakhiphi igesi, ezingangenisi imvula eningi, futhi ezingaphinde zisetshenziswe. Osayizi abahlukene be-wafer, ama-process node, kanye nezinto ezikhethiwe zezinqubo ezahlukene zihlukile. Izinto ezijwayelekile yi-PFA, PTFE, PP, PEEK, PES, PC, PBT, PEI, COP, njll. Umkhiqizo ngokuvamile wenzelwe amandla angama-25.

IKHASETHI EVULIWE ingasetshenziswa kanye ne-Ikhasethi Yesiqeshana Esiyindilingaimikhiqizo yokugcina i-wafer kanye nokuthuthwa phakathi kwezinqubo zokunciphisa ukungcola kwe-wafer.

I-Open Cassette isetshenziswa kanye nemikhiqizo ye-Wafer Pod (OHT) eyenziwe ngokwezifiso, engasetshenziswa ekudluliseni okuzenzakalelayo, ukufinyelela okuzenzakalelayo kanye nesitoreji esivalwe kakhulu phakathi kwezinqubo zokukhiqiza i-wafer kanye nokukhiqizwa kwama-chip.

Vele, i-Open Cassette ingenziwa ngqo ibe yimikhiqizo ye-CASSETTE. Amabhokisi okuthumela i-Wafer womkhiqizo anesakhiwo esinjalo, njengoba kuboniswe esithombeni esingezansi. Angahlangabezana nezidingo zokuthuthwa kwe-wafer kusuka ezitshalweni zokukhiqiza i-wafer kuya ezitshalweni zokukhiqiza ama-chip. I-CASSETTE neminye imikhiqizo etholakala kuyo ingahlangabezana nezidingo zokudlulisa, ukugcina kanye nokuthuthwa phakathi kwezimboni phakathi kwezinqubo ezahlukahlukene ezimbonini ze-wafer kanye nasezimbonini ze-chip.

 

Ibhokisi Lokuthumela Le-Wafer Elivula Ngaphambili le-FOSB

Ibhokisi Lokuthumela Le-Wafer Elivula Ngaphambili I-FOSB isetshenziswa kakhulu ekuthuthweni kwama-wafer angamasentimitha angu-12 phakathi kwezitshalo zokukhiqiza ama-wafer nezitshalo zokukhiqiza ama-chip. Ngenxa yobukhulu obukhulu bama-wafer kanye nezidingo eziphakeme zokuhlanzeka; izingcezu zokubeka ezikhethekile kanye nomklamo ovikela ukushaqeka kusetshenziswa ukunciphisa ukungcola okubangelwa ukungqubuzana kokufuduka kwe-wafer; izinto zokusetshenziswa zenziwe ngezinto ezikhipha igesi kancane, okunganciphisa ingozi yokungcolisa ama-wafer. Uma kuqhathaniswa namanye amabhokisi e-wafer okuthutha, i-FOSB inomoya oqinile. Ngaphezu kwalokho, efektri yomugqa wokupakisha wangemuva, i-FOSB ingasetshenziswa futhi ukugcina nokudlulisa ama-wafer phakathi kwezinqubo ezahlukahlukene.

I-FOSB ngokuvamile yenziwa izingcezu ezingu-25. Ngaphezu kokugcina nokubuyisa okuzenzakalelayo nge-Automated Material Handling System (AMHS), ingasetshenziswa futhi ngesandla.

I-Unified Pod Evulekile Ngaphambili

I-Front Opening Unified Pod (FOUP) isetshenziswa kakhulu ekuvikeleni, ekuthuthweni nasekugcinweni kwama-wafer efektri ye-Fab. Iyisitsha esibalulekile sokuthwala uhlelo lokuhambisa oluzenzakalelayo efektri yama-wafer engamasentimitha angu-12. Umsebenzi wayo obaluleke kakhulu ukuqinisekisa ukuthi wonke ama-wafer angu-25 avikelwe yiyo ukuze agweme ukungcoliswa uthuli endaweni yangaphandle ngesikhathi sokudluliselwa phakathi komshini ngamunye wokukhiqiza, ngaleyo ndlela kuthinte isivuno. I-FOUP ngayinye inamapuleti ahlukahlukene okuxhuma, amaphini kanye nezimbobo ukuze i-FOUP itholakale echwebeni lokulayisha futhi isetshenziswe yi-AMHS. Isebenzisa izinto ezikhipha igesi ephansi kanye nezinto zokumunca umswakama ophansi, okunganciphisa kakhulu ukukhishwa kwamakhemikhali e-organic futhi kuvimbele ukungcoliswa kwe-wafer; ngesikhathi esifanayo, umsebenzi omuhle kakhulu wokuvala nowokukhuphuka kwentengo ungahlinzeka ngendawo enomswakama ophansi ye-wafer. Ngaphezu kwalokho, i-FOUP ingaklanywa ngemibala ehlukene, njengobomvu, o-orenji, omnyama, obonakalayo, njll., ukuze kuhlangatshezwane nezidingo zenqubo futhi kuhlukaniswe izinqubo nezinqubo ezahlukene; ngokuvamile, i-FOUP yenziwe ngokwezifiso ngamakhasimende ngokuya ngomugqa wokukhiqiza kanye nomehluko womshini efektri ye-Fab.

Ngaphezu kwalokho, i-POUP ingenziwa ngokwezifiso ibe yimikhiqizo ekhethekile yabakhiqizi bokupakisha ngokwezinqubo ezahlukene ezifana ne-TSV kanye ne-FAN OUT ekupakisheni kwe-chip back-end, njenge-SLOT FOUP, i-297mm FOUP, njll. I-FOUP ingaphinde isetshenziswe, futhi isikhathi sayo sokuphila siphakathi kweminyaka engu-2-4. Abakhiqizi be-FOUP banganikeza izinsizakalo zokuhlanza umkhiqizo ukuze bahlangabezane nemikhiqizo engcolisiwe ukuze isetshenziswe futhi.

 

Abathumeli be-Wafer abavundlile abangenakuthinta

I-Wafer Evundlile Engenakuthintana Ama-Shipper asetshenziswa kakhulu ekuthuthweni kwama-wafer aqediwe, njengoba kuboniswe esithombeni esingezansi. Ibhokisi lokuthutha le-Entegris lisebenzisa indandatho yokusekela ukuqinisekisa ukuthi ama-wafer awathintani ngesikhathi sokugcina nokuthuthwa, futhi linokuvala okuhle ukuvimbela ukungcola, ukuguguleka, ukushayisana, ukuklwebheka, ukukhishwa kwegesi, njll. Umkhiqizo ufanelekela kakhulu ama-wafer e-Thin 3D, ilensi noma ama-wafer ahlanganisiwe, futhi izindawo zokusetshenziswa kwawo zifaka phakathi ama-3D, 2.5D, MEMS, LED kanye nama-semiconductor anamandla. Umkhiqizo ufakwe ama-ring okusekela angu-26, anomthamo we-wafer ongu-25 (anobukhulu obuhlukene), kanti osayizi be-wafer bafaka phakathi u-150mm, 200mm no-300mm.